TA8483CP TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA8483CP Three−Phase All wave Driver IC The TA8483CP is a three−phase all wave driver IC that makes possible PWM sensorless driving. Features • Built−in excess current detection function • Built−in heat protection function Weight: 3.0g (typ.) TA8483CP: The TA8483CP is Sn plated product including Pb. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230°C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245°C *dipping time = 5 seconds *the number of times = once *use of R-type flux 1 2006-3-2 TA8483CP Block Diagram TSD − SEL 2 N 3 COMP 4 VCC 10 VCC Output voltage detection circuit Heat protection 9 IN−U 11 Control circuit 7 IN−W 13 6 OUT−V OUT−W VI 8 Excess current detection 14 VISD RF IN−V 12 OUT−U GND 1 ISD 5,FIN 2 2006-3-2 TA8483CP Pin Connection ISD 1 14 VISD TSD−SEL 2 13 IN−W N 3 12 IN−V COMP 4 11 IN−U GND GND VCC GND 5 10 OUT−W 6 9 OUT−U OUT−V 7 8 VI Pin Function Pin No. Symbol I/O 1 ISD O Excess current detection signal output 2 TSD−SEL I Heat protection circuit selecting pin 3 N ― Mid−point voltage pin 4 COMP O Majority logical sum output (power output pin voltage detection circuit) 5 GND ― GND 6 OUT−W O W −phase output pin 7 OUT−V O V −phase output pin 8 VI O Current detection resistanse connecting pin 9 OUT−U O U −phase output pin 10 VCC I Supply voltage pin 11 IN−U I U −phase input pin 12 IN−V I V −phase input pin 13 IN−W I W −phase input pin 14 VISD I Excess current detection input pin Functional Description 3 2006-3-2 TA8483CP Functional Description 10 VCC 1. Output section (OUT −U, OUT−V, OUT−W) • The configuration of the output stage is shown in the chart to the right. 9 • The PWM operation takes off−on control of the upper side transistor. 6 OUT−U OUT−V 7 • Be sure to set the schottky barrier diode outside, because the current flows to the lower−side diode when PWM is off. OUT−W RF VI 8 < Output circuit > 36kΩ 30kΩ 50kΩ 11, 12, 13 10kΩ 30kΩ IN Lower side PwTr control Circuit 3. Overheat protection circuit • When junction temperature Tj is Tj≥TSD (on) (overheat protection operation temperature) when TSD−SEL = "low", the entire output maintains an off state. To cancel this state, (1) Reapply the supply voltage. (2) Apply " " signal to the TSD−SEL pin. Upper side PwTr control circuit 21kΩ 2. Input circuit (IN−U, IN−V, IN−W) • The three−phase input receivs three−state impedance (high. low, high impedance) from the controller side. Internal logic power supply (≃ 6.7V) < Input circuit > • When TSD−SEL = "high", an automatic return mode takes place. Internal logic power supply (≃ 6.7V) VRF + − 4kΩ VISD 14 • When VISD voltage rises above internal reference voltage VRF (≃ 0.5V), excess current detection circuit ISD becomes "high". 75kΩ 12.3kΩ 4. Excess current detection circuit (VISD, ISD) • The voltage in current detection resistor RF outside VI pin is input to the VISD pin. 1 ISD < Excess current detection circuit > 4 2006-3-2 TA8483CP 12.3kΩ Internal logic power supply (≃ 6.7V) 5. Output voltage detection circuit (COMP) • Brings about majority logical sum output. (When two−phase output or higher out of three−phase output is larger than mid−point voltage VCC / 2, "high" is output; when it is smaller, "low" is output.) COMP 4kΩ 75kΩ 4 < Output voltage detection circuit > 6. Upper side output B−E shunt circuit • A base−emitter shunt circuit is incorporated to turn off the upper side power transistor. 10 VCC 250µA 9/7/6 OUT : Shunt circuit 8 VI < Upper side output b − e shunt circuit > Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Supply voltage VS 35 V Output current IOUT (PEAK) 2.0 A Power dissipation PD 2.3 (Note) W Operating temperature Topr −30~85 °C Storage temperature Tstg −55~150 °C Input voltage VIN 6.0 V (Note) No heat sink Recommended Operating Conditions (Ta = −30 to 85°C) Characteristic Symbol Min Typ. Max Unit Supply voltage VS 20 ― 30 V Output current IOUT ― ― 1.5 A Chopping frequency fPWM ― 20 40 kHz 5 2006-3-2 TA8483CP Electrical Characteristics (Ta = 25°C, VCC = 24V) Characteristic Symbol Test Cir− cuit Min. Typ. Max. Chop on ― 40 51 Chop off ― 24 30 ICC (3) Off ― 22 28 IIN1 (L) VIN = 0V, IN−U, IN−V, IN−W −350 ― −100 ― 0 ― 100 ― 350 ICC (1) Current consumption ICC (2) 1 IIN1 (OFF) Input current Input voltage IIN1 (H) Test Condition VIN = 2.5V, IN−U, IN−V, IN−W 2 VIN = 5V, IN−U, IN−V, IN−W IIN2 (L) VIN = 0V, TSD−SEL, Tj = 150°C ― 0 ― IIN2 (H) VIN = 5V, TSD−SEL, Tj = 150°C ― 5.5 100 VIN1 (L) VCC = 20V, IN−U, IN−V, IN−W 0 ― 0.7 VIN1 (OFF) VCC = 20V, IN−U, IN−V, IN−W 1.9 ― 3.0 VCC = 20V, IN−U, IN−V, IN−W 4 ― 5.5 VIN2 (L) TSD−SEL, Tj = 150°C 0 ― 0.5 VIN2 (H) TSD−SEL, Tj = 150°C 1.1 ― 5.5 VIN1 (H) 3 Unit mA µA V VN 4 0.95× VS / 2 VS / 2 1.05× VS / 2 V Pin voltage detection level VCMP 5 0.95× VS / 2 VS / 2 1.05× VS / 2 V Pin voltage detection output voltage VOV 5 4.3 ― 5.15 V Excess current detection level VRF 6 0.43 0.50 0.52 V Excess current detection output voltage VOC 6 IO = 50µA 4.3 ― 5.15 V VSAT (H) 7 VCC = 20V, IO = 1A ― 1.3 1.7 VCC = 20V, IO = 1.5A ― 1.6 2.1 VCC = 20V, IO = 1A ― 1.3 1.7 VCC = 20V, IO = 1.5A ― 1.5 2.0 Mid −point potential Output saturation voltage IO = 50µA VSAT (H) 8 Upper side diode forward voltage VF (H) 9 IO = 1A ― 1.8 2.5 Output leakage voltage IL (L) 10 VL = 35V ― 0 50 IS 11 VCC = 35V ― 250 400 ― 175 ― ― 150 ― ― 25 ― ― 0.2 ― ― 6.1 ― ― 0.5 ― ― 1.5 ― ― 1 ― ― 7 ― Upper side output B−E shunt circuit current TSD (ON) Heat protection operative temperature TSD (OFF) ― Tj TSD (HYS) Output transmission time Comparator output transmitting duration Excess current detection duration ton toff tpLH tpHL tr tf ― ― ― 6 V V °C µs µs µs 2006-3-2 TA8483CP Thermal resistance Rth (j − c) = 8°C / W Rth (j − a) = 54°C / W 12 Power consumption PD (W) PD – Ta 8 Infinite heat sink 10 °C / W heat sink 4 No heat sink 0 0 50 100 Ta 7 150 200 (°C) 2006-3-2 TA8483CP Test Circuit 1: 1CC 3 4 10 11 24V 2 A ICC 9 SW1 7 12 SW2 TA8483CP 6 13 SW3 5V 2.5V 8 14 FIN 5 1 2 3 4 24V Test Circuit 2: IIN 10 11 9 7 12 TA8483CP 6 13 A 8 A 2.5V 5V A 14 5 1 8 FIN 2006-3-2 TA8483CP 2 3 4 20V Test Circuit 3: VIN 10 11 500Ω 9 500Ω 7 12 TA8483CP 500Ω 6 V V V 8 0.7V 1.9V 3.0V 4.0V VIN 5.5V 13 14 5 1 FIN (Note) Confirm output voltage by inputting regular VIN. 24V Test Circuit 4: VN V VN 2 3 4 10 11 9 7 12 TA8483CP 6 13 2.5V 5V 8 14 1 5 9 FIN 2006-3-2 TA8483CP V 2 3 4 24V VOV 50µA Test Circuit 5: VCMP, VOV 10 11 9 7 12 TA8483CP 6 13 14 1 5 12.6V 11.4V 2.5V 2.5V 2.5V 8 FIN 2 3 4 24V Test Circuit 6: VRF, VOC 10 11 9 7 12 TA8483CP 6 13 8 10 FIN 0.52V VOC V 5 50µA 1 0.43V 14 2006-3-2 TA8483CP 2 3 4 10 VSAT (H) 11 V 20V Test Circuit 7: VSAT (H) 9 7 12 TA8483CP 1 A / 1.5A 6 13 5V 8 14 1 5 FIN 2 3 4 20V Test Circuit 8: VSAT (L) 10 11 9 TA8483CP 6 13 VSAT (L) V 8 1 A / 1.5A 7 12 14 1 5 11 FIN 2006-3-2 TA8483CP Test Circuit 9: VF (H) 3 4 10 11 9 1A 2 VF (H) V 7 12 TA8483CP 6 13 8 14 1 5 FIN 2 3 4 35V Test Circuit 10: IL (L) 10 11 9 A 7 12 TA8483CP 6 13 14 1 5 12 0.015V 2.5V 2.5V 2.5V 8 FIN 2006-3-2 TA8483CP 2 3 4 35V Test Circuit 11: IS 10 11 9 7 12 TA8483CP A 6 13 2.5V 2.5V 2.5V 8 14 1 5 13 FIN 2006-3-2 TA8483CP Function Description Of TB6520P/PG+TA8483CP • Three−phase sensorless drive The TB6520P/PG detects the motor's induced voltage (motor's terminal voltage), compares it with VM (motor's power supply voltage) divided by 2, and generates a commutation signal based on the comparison result. Therefore, the TB6520P/PG eliminates the need for the hall elements and hall ICs that have conventionally been used to detect the motor's rotor position. • PWM drive The TB6520P/PG allows output duty cycles to be controlled by using its duty input voltage. PWM operation is chopped by the upper−side output on / off operation. Position detection is accomplished by monitoring the motor's terminal voltage at falling edges of PWN and comparing the detected voltage with the reference voltage. In this way, avoid effects of the terminal voltage on PWM are avoided. But this causes a position detection error associated with the PWM signal frequency. Therefore, care must be taken when using the controller for high−speed motors. • Startup method At startup, no induced voltage develops because the motor is not turning yet. for this reason, the TB6520P/PG forcibly applies a predetermined commutation pattern to the motor as it starts. In this case, a problem occurs that the motor cannot be started smoothly depending on its rotor position. To solve this problem, the TB6520P/PG uses single−phase excitation (by setting the IP pin high to fix the phase and allow current to conduct in only one phase) for a predetermined period. This helps to move the rotor position at startup forcibly to a ready to start position. However, since the duration of single−phase excitation and the power applied for it (DUTY input voltage) varies with each motor, adjustment is required. • About the duration of single−phase excitation The duration of single−phase excitation (DC excitation) can be changed by adjusting the RC constant in the application circuit shown below. DUTY TB6520P/PG IP C Start − SP R Start − SP IP Duration of single − phase excitation (DC excitation) Setup example: C = 4.7µF, R = 220kΩ 14 2006-3-2 TA8483CP • Changing and stopping revolutions (1) The motor speed or revolutions can be changed by adjusting the VDUTY voltage (TB6520P/PG input voltage). (2) To stop the motor, drop VDUTY to 0V. • About stepping−out Monitor the TB6520P/PG's speed detection signal (FG output) to see if a FG signal of the designated frequency is returned. If not, the motor has stepped out of synchronization, so restart it. • About overcurrent limiting operation The TA8483CP's overcurrent detection function works in such a way that the motor current is detected using an external resistor and when the voltage that develops in the resistor exceeds the reference voltage VRF, the ISD signal is driven high. The TB6520P/PG limits the on−time of the PWM signal (output by the TB6520P/PG) at a rising edge of the ISD signal. The on−time of the upper−side power transistor in the TA8483CP is thereby limited. • Lead angle control The TB6520P/PG determines the commutation timing based on the changeover point (zero−cross point) of the induced voltage and reference voltage Vn ( = VM (motor's power supply voltage) divided by2). During forced starting commutation, the motor operates with a lead angle of 0 degrees. After the motor switches over to normal−speed operation, the lead angle is automatically changes to 15 degrees. (Lead angle of 0 degrees: For 120−degree switch−on, current starts conducting 30 degrees behind the zero−cross point. Lead angle of 15 degrees: Current starts conducting 15 degrees behind the zero−cross point.) Note that depending on motor characteristics, the waveform of the induced voltage may be distorted, causing the zero−cross point to slip out of place. The commutation timing also is thereby made to drift. 15 2006-3-2 TA8483CP Precautions On Using TB6520P/PG+TA8483CP • About DC power supply voltage and control voltage on / off sequence The power−on sequence dictates that VCC (TA8483CP power supply) be turned on after VDD (TB6520P/PG power supply) becomes steadily on. When powering on, make sure VDUTY (PWM control input to the TB6520P/PG) is dropped to 0V. When powering off, make sure VDUTY (PWM control input to the TB6520P/PG) is dropped to 0V. Before shutting off VDD (TB6520P/PG power supply voltage) wait until VCC (TA8483CP power supply voltage) is sufficiently low (5V or less). The thing that especially requires caution is that shutting off VDD during high−speed rotation or floating GND causes a short−circuit current to flow in due to counterelectromotive force, which could break down the output transistors. When VDD is shut off, the TB6520P/PG output is pulled to GND and the TA8483CP input goes low, causing all of the lower−side output transistors to turn on. Because the motor is turning, a short−circuit current is generated by counterelectromotive force and flows into the transistors as shown below. This current, if large enough to exceed the rated current, may break the transistors. (This trouble tends to occur when the motor is not loaded.) TA8483CP output (lower side) + − • About an external oscillator for the TB6520P/PG The TB6520P/PG has an external oscillator attached as the reference clock source to generate PWM control and commutation signals. Selection of this oscillator requires caution. Some oscillator may oscillate erratically if the power supply turn−on time is fast (1ms or less), causing the TB6520P/PG to malfunction. In this case, the drive IC, the TB8483CP, may break down. (This is because the TB6520P/PG output is uncertain and the overcurrent limiting function becomes unable to work.) • About the TB6520P/PG DUTY input When the DUTY pin is open, the duty cycle is full (100%). If the motor with the TA8483CP connected to it is made to run without turning on the power supply voltage, the induced voltage in the motor wraps around into the TB6520P/PG, causing it to malfunction, which in turn may break down the TA8483CP. Make sure the DUTY pin is pulled low via a resistor (approx. 100 kΩ). • About external diode For reason of PWM control, when PWM turns off, a regenerative current flows in the lower−side diodes at the output stage. Always be sure to attach an external diode. This external diode must have a sufficient current capacity to satisfy the maximum value of the motor current. Another thing to be noted is that a through current flows depending on the diode's reverse recovery time. TOSHIBA recommends attaching a schottky diode (2GWJ42 or equivalent). 16 2006-3-2 TA8483CP • Other precautions to be observed (1) When VDD changes slowly (1V / s or less) between 2 to 4V (near 3.8V), the TA8483CP's output transistors are placed in an oscillating state and could thereby be broken. a b Input 3.8V a Output b (2) If VCC and VDD are connected to the GND line that is floating, the device may break down. VCC (24V) VDD (5V) This is charged. TB6520P/PG TA8483CP M × When the GND line goes open, the capacitor on the low−voltage power supply side is charged with a high voltage from the 24V line through a circuit shown above. When GND is connected next time,the device may be broken by that voltage. 17 2006-3-2 TA8483CP Application Circuit 5V 6 15 WAVE WAVE −W −V 11 PS 16 VDD 4 100kΩ TB6520P/PG 2 FG Frequency of OUT − V 13 rotation 5 CMP − SEL L OUT − W 12 9 3 N OUT − U 9 OUT − V 7 OUT − W 6 11 IN − U OUT − U 14 GND XT (Note) 10 VCC COMP Position detection signal Speed control signal (analog) 1 DUTY M C U 24V 3 XT 4 12 IN − V TA8483CP 13 IN − W OC 10 1 ISD IP START − SP Excess current TSD − SEL detection signal 7 8 2 2GWJ42 VI GND 8 VISD 14 5, FIN Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. . 18 2006-3-2 TA8483CP Package Dimensions Weight: 3.0g (typ.) 19 2006-3-2 TA8483CP Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 20 2006-3-2 TA8483CP Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 21 2006-3-2 TA8483CP 22 2006-3-2