SD05T1 Series Preferred Device Transient Voltage Suppressor Diode SOD−323 Zeners for ESD Protection These Zener diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. These devices are ideal for situations where board space is at a premium. http://onsemi.com Specification Features: • • • • • • • • • • Steady State Power Routing of 200 mW Peak Power − 350 W (8 20 ms) Low Leakage Cathode Indicated by Polarity Band Package Weight: 4.507 mg/wmt Meets IEC61000−4−2 Level 4, 15 kV (Air), 8 kV (Contact) Meets IEC6100−4−4 Level 4, 40 A Meets IEC6100−4−5 (Lightning), 24 A Meets 16 kV Human Body Model ESD Requirements Pb−Free Packages are Available SOD−323 CASE 477 STYLE 1 MARKING DIAGRAM Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic xx M Epoxy Meets UL 94, V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any xx = Specific Device Code ZA = SD05T1 ZC = SD12T1 M = Date Code QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. ORDERING INFORMATION Package Shipping † SD05T1 SOD−323 3000/Tape & Reel SD05T1G SOD−323 (Pb−Free) 3000/Tape & Reel SD12T1 SOD−323 3000/Tape & Reel SD12T1G SOD−323 (Pb−Free) 3000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 1 1 Publication Order Number: SD05T1/D SD05T1 Series MAXIMUM RATINGS Rating Symbol Value Unit Ppk 350 Watts ±15 ±8.0 kV 40 A Peak Power Dissipation @ 20 ms (Note 1) @ TL ≤ 25°C IEC 61000−4−2 (ESD) Air Contact IEC 61000−4−4 (EFT) ESD Voltage (Human Body Model (HBM) Waveform per IEC 61000−4−2) VPP 30 kV Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25°C Derate above 25°C °PD° 200 1.6 °mW° mW/°C Thermal Resistance Junction−to−Ambient RqJA 635 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C TL 260 °C Lead Solder Temperature − Maximum (10 Second Duration) Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *Other voltages may be available upon request. 1. Nonrepetitive current pulse, per Figure 6. 2. FR−5 = 1.0 x 0.75 x 0.62 in. ELECTRICAL CHARACTERISTICS I (TA = 25°C unless otherwise noted) IF Parameter Symbol IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF VC VBR VRWM V IR VF IT IPP Uni−Directional TVS ELECTRICAL CHARACTERISTICS VBR, Breakdown Voltage (V) Max Capacitance (pF) Max IT mA VC @ IPP = 5 A (Note 3) (V) Max IPP (Note 3) (A) VC @ Max IPP (Note 3) (V) 6.2 7.3 1.0 9.8 24 14.5 350 13.3 15.75 1.0 19 15 25 150 Device VRWM (V) IR @ VRWM (mA) Min SD05T1, G 5.0 10 SD12T1, G 12 1.0 3. 8 × 20 ms pulse waveform. http://onsemi.com 2 VR = 0 V f = 1.0 MHz SD05T1 Series TYPICAL CHARACTERISTICS 280 140 120 240 C, CAPACITANCE (pF) C, CAPACITANCE (pF) 260 220 200 180 160 140 100 60 40 20 120 100 80 0.5 0 1 1.5 2 2.5 3 BIAS (V) 3.5 4 4.5 0 5 Figure 1. SD05 Typical Capacitance versus Bias Voltage 6 BIAS (V) 10 8 12 LEAKAGE CURRENT (nA) 100 100 10 −55 −35 −15 5 25 45 65 85 TEMPERATURE (°C) 10 1 0.1 −55 105 125 145 −30 Figure 3. SD05 Typical Leakage Current versus Temperature 100 100 90 90 80 80 70 60 50 40 30 20 10 0 −5 20 45 70 TEMPERATURE (°C) 95 120 145 Figure 4. SD12 Typical Leakage Current versus Temperature % OF PEAK PULSE CURRENT PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25°C 4 Figure 2. SD12 Typical Capacitance versus Bias Voltage 1000 LEAKAGE CURRENT (nA) 2 0 tr PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 70 60 HALF VALUE IRSM/2 @ 20 ms 50 40 30 tP 20 10 0 25 50 75 100 125 150 175 TA, AMBIENT TEMPERATURE (°C) 200 0 0 Figure 5. Pulse Derating Curve 20 40 t, TIME (ms) 60 Figure 6. 8 × 20 ms Pulse Waveform http://onsemi.com 3 80 SD05T1 Series PACKAGE DIMENSIONS SOD−323 CASE 477−02 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. K A D 1 2 B DIM A B C D E H J K L E C J NOTE 3 L H NOTE 5 MILLIMETERS MIN MAX 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 0.15 REF 0.00 0.10 0.089 0.177 2.30 2.70 0.075 −−− INCHES MIN MAX 0.063 0.071 0.045 0.053 0.031 0.039 0.010 0.016 0.006 REF 0.000 0.004 0.0035 0.0070 0.091 0.106 0.003 −−− STYLE 1: PIN 1. CATHODE 2. ANODE SOLDERING FOOTPRINT* 0.63 0.025 0.83 0.033 1.60 0.063 2.85 0.112 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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