DIODES DMN2005LPK

DMN2005LPK
N-CHANNEL ENHANCEMENT MODE
FIELD EFFECT TRANSISTOR
NEW PRODUCT
Lead-free Green
UNDER DEVELOPMENT
Features
·
·
·
·
·
·
·
·
Low On-Resistance
Low Gate Threshold Voltage
DFN1006-3
Fast Switching Speed
G
Low Input/Output Leakage
H
Dim
Min
Max
Typ
A
0.95
1.075
1.00
B
0.55
0.675
0.60
C
0.45
0.55
0.50
D
0.20
0.30
0.25
G
0.47
0.53
0.50
H
0
0.05
0.03
K
0.10
0.20
0.15
L
0.20
0.30
0.25
M
¾
¾
0.35
N
¾
¾
0.40
Ultra-Small Surface Mount Package
Lead Free By Design/RoHS Compliant (Note 2)
A
"Green" Device (Note 4)
ESD Protected Gate
K
M
B C
Mechanical Data
·
·
D
Case: DFN1006-3
N
L
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating
94V-0
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
·
·
Marking: See Last Page
G
All Dimensions in mm
D
Terminals Connections: See Diagram
Terminals: Finish ¾ Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
S
TOP VIEW
Ordering & Date Code Information: See Last Page
Drain
Body
Diode
Gate
Gate
Protection
Diode
ESD protected
Source
EQUIVALENT CIRCUIT
Maximum Ratings
@ TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
20
V
Gate-Source Voltage
VGSS
±8
V
ID
200
250
mA
Drain Current per element (Note 1)
Continuous
Pulsed (Note 3)
Total Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Note:
Pd
200
mW
RqJA
625
°C/W
Tj, TSTG
-65 to +150
°C
1. Device mounted on FR-4 PCB.
2. No purposefully added lead.
3. Pulse width £10mS, Duty Cycle £1%.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
DS30836 Rev. 3 - 1
1 of 4
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DMN2005LPK
ã Diodes Incorporated
Electrical Characteristics
@ TA = 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Drain-Source Breakdown Voltage
BVDSS
20
¾
¾
V
VGS = 0V, ID = 100mA
Zero Gate Voltage Drain Current
IDSS
¾
¾
10
mA
VDS = 17V, VGS = 0V
Gate-Source Leakage
IGSS
¾
¾
±5
mA
VGS = ±8V, VDS = 0V
VGS(th)
0.53
¾
1.2
V
VDS = VGS, ID = 100mA
RDS (ON)
¾
¾
¾
¾
¾
0.9
0.85
1.2
2.4
2.5
1.5
1.7
1.7
3.5
3.5
W
VGS = 4V, ID = 10mA
VGS = 2.7V, ID = 200mA
VGS = 2.5V, ID = 10mA
VGS = 1.8V, ID = 200mA
VGS = 1.5V, ID = 1mA
|Yfs|
40
¾
¾
mS
OFF CHARACTERISTICS (per element) (Note 5)
ON CHARACTERISTICS (per element) (Note 5)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Notes:
VDS = 3V, ID = 10mA
5. Short duration test pulse used to minimize self-heating effect.
1000
0.9
900
ID, DRAIN CURRENT (mA)
ID, DRAIN CURRENT (A)
800
0.6
TBD
0.3
700
600
TBD
500
400
300
200
100
0
0.4
0
0
1
2
5
4
3
1
0.8
1.2
1.6
2
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 2 Reverse Drain Current
vs. Source-Drain Voltage
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
VGS(th), GATE THRESHOLD VOLTAGE (V)
NEW PRODUCT
UNDER DEVELOPMENT
1
0.9
0.8
0.7
0.6
TBD
TBD
0.5
0.4
0.3
0.2
0.1
0
-75
0.1
-50
-25
0
25
50
75
100
125 150
Tch, CHANNEL TEMPERATURE (°C)
Fig. 3 Gate Threshold Voltage
vs. Channel Temperature
DS30836 Rev. 3 - 1
0.2
0.4
0.6
0.8
1.0
ID, DRAIN CURRENT (A)
Fig. 4 Static Drain-Source On-Resistance
Vs. Drain Current
2 of 4
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DMN2005LPK
UNDER DEVELOPMENT
1
NEW PRODUCT
1.0
0.9
0.8
0.7
0.6
TBD
TBD
0.5
0.4
0.3
0.2
0.1
0
0.1
0.2
0.6
0.4
2
0
1.0
0.8
6
4
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 6 Static Drain-Source, On-Resistance
vs. Gate-Source Voltage
ID, DRAIN CURRENT (A)
Fig. 5 Static Drain-Source On-Resistance
vs. Drain Current
1
0.5
0.9
0.4
0.8
0.7
0.3
TBD
0.6
TBD
0.2
0.5
0.4
0.1
0.3
0.2
0.4
0.2
0
0.6
0.8
1
0
-50
1.2
0
25
50
75
100
125 150
Tj, JUNCTION TEMPERATURE (° C)
Fig. 8 Static Drain-Source, On-Resistance
vs. Temperature
ID, DRAIN CURRENT (A)
Fig. 7 On-Resistance vs. Drain
Current and Gate Voltage
10000
1
IDR, REVERSE DRAIN CURRENT (A)
IDSS, DRAIN-SOURCE LEAKAGE
CURRENT (nA)
-25
1000
100
TBD
10
1
0.1
0.1
TBD
0.01
0.001
2
4
6
8
10 12
14
16
18
20
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 9 Drain Source Leakage Current
vs. Voltage
DS30836 Rev. 3 - 1
3 of 4
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0
1
0.5
VSD, DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Reverse Drain Current
vs. Source-Drain Voltage
DMN2005LPK
120
1
100
C, CAPACITANCE (pF)
|Yfs|, FORWARD TRANSFER ADMITTANCE (S)
NEW PRODUCT
UNDER DEVELOPMENT
TBD
0.1
80
TBD
60
40
20
0.01
0
1
10
1000
100
0
ID, DRAIN CURRENT (mA)
Fig. 11 Forward Transfer Admittance
vs. Drain Current
Ordering Information
Notes:
2
4
6
8
10 12 14 16
18 20
VDS, DRAIN SOURCE VOLTAGE (V)
Fig. 12 Capacitance Variation
(Note 6)
Device
Packaging
Shipping
DMN2005LPK-7
DFN1006-3
3000/Tape & Reel
6. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
DM
DM = Product Type Marking Code,
Dot Denotes Collector Side
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further
notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither
does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will
agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the
President of Diodes Incorporated.
DS30836 Rev. 3 - 1
4 of 4
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DMN2005LPK