STMICROELECTRONICS BYV255V-200

BYV255V

HIGH EFFICIENCY FAST RECOVERY RECTIFIER DIODES
FEATURES
n
n
n
n
n
n
SUITED FOR SMPS
VERY LOW FORWARD LOSSES
NEGLIGIBLE SWITCHING LOSSES
HIGH SURGE CURRENT CAPABILITY
HIGH AVALANCHE ENERGY CAPABILITY
INSULATED :
Insulating voltage = 2500 VRMS
Capacitance = 55 pF
K2
A2
K1
A1
DESCRIPTION
Dual rectifier suited for switchmode power supply
and high frequency DC to DC converters.
Packaged in ISOTOPTM this device is intended for
use in low voltage, high frequency inverters, free
wheeling and polarity protection applications.
ISOTOP
(Plastic)
ABSOLUTE MAXIMUM RATINGS
Symbol
IF(RMS)
Parameter
RMS forward current
Value
Unit
Per diode
150
A
IF(AV)
Average forward current δ = 0.5
Tc=110°C
Per diode
100
A
IFSM
Surge non repetitive forward current
tp=10ms
sinusoidal
Per diode
1600
A
Tstg
Tj
Storage and junction temperature range
- 40 to +
150
- 40 to + 150
°C
°C
Value
Unit
200
V
Symbol
VRRM
Parameter
Repetitive peak reverse voltage
ISOTOP is a trademark of STMicroelectronics.
May 2000 - Ed : 2E
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BYV255V
THERMAL RESISTANCE
Symbol
Rth (j-c)
Rth (c)
Parameter
Junction to case
Value
Unit
Per diode
0.4
°C/W
Total
0.25
°C/W
0.1
Coupling
When the diodes 1 and 2 are used simultaneously :
Tj-Tc (diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
ELECTRICAL CHARACTERISTICS (Per diode)
STATIC CHARACTERISTICS
Symbol
IR *
Test Conditions
Tj = 25°C
Min.
Typ.
VR = VRRM
Tj = 100°C
VF **
Max.
Unit
100
µA
10
mA
V
Tj = 125°C
IF = 100 A
0.85
Tj = 125°C
IF = 200 A
1.00
Tj = 25°C
IF = 200 A
1.15
Pulse test : * tp = 5 ms, duty cycle < 2 %
** tp = 380 µs, duty cycle < 2 %
RECOVERY CHARACTERISTICS
Symbol
trr
Test Conditions
Tj = 25°C
Min.
Typ.
Max.
Unit
ns
IF = 0.5A
IR = 1A
Irr = 0.25A
55
IF = 1A
VR = 30V
dIF/dt = -50A/µs
80
tfr
Tj = 25°C
IF = 1A
VFR = 1.1 x VF
tr = 5 ns
10
ns
VFP
Tj = 25°C
IF = 1A
tr = 5 ns
1.5
V
TURN-OFF SWITCHING CHARACTERISTICS
Symbol
IRM
2/5
Test Conditions
Tj = 100°C
IF = 100A
Lp  0.05µH
Vcc  0.6 VRRM
Min.
Typ.
dIF/dt = -200A/µs
dIF/dt = -400A/µs
24
Max.
Unit
16
A
BYV255V
Fig.1 : Average forward power dissipation versus
average forward current.
P F(av)(W)
120
110
100
90
80
70
60
50
40
30
20
10
0
0
Fig.2 : Peak current versus form factor.
IM(A)
120
500
450
P=40W
T
400
IM
350
P=70W
=tp/T
300
tp
250
200
P=100W
150
100 P=20W
50
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Fig.3 : Forward voltage drop versus forward
current (maximum values).
Fig.4 : Relative variation of thermal impedance
junction to case versus pulse duration.
=1
=0.5
=0.2
=0.1
=0.05
T
I F(av)(A)
20
40
60
=tp/T
80
tp
100
1.0
VFM(V)
K
1.8
1.6
Zth(j-c) (tp. )
K =
Rth(j-c)
Tj=125 oC
1.4
=0 . 5
0.5
1.2
=0 . 2
1.0
=0 . 1
0.8
0.6
T
0.2
Single pulse
0.4
0.2
0.0
IFM(A)
1
10
100
1000
1.0E-03
Fig.5 : Non repetitive surge peak forward current
versus overload duration.
I M(A)
1000
900
800
700
600
500
400
300
IM
200
100
0
0.001
=t p/T
tp(s)
0.1
1.0E-02
1.0E-01
Fig.6 : Average current versus
temperature. (duty cycle : 0.5)
120
tp
1. 0E+0 0
ambient
IF(av)(A)
100
Rth(j-a)=Rth(j-c)
80
60
Tc=25 oC
=0.5
Tc=75 o C
t
=0.5
0.01
20
Tc=110 o C
t(s)
T
40
=tp/T
0.1
1
0
0
20
Tamb( o C)
tp
40
60
80
100 120
140 160
3/5
BYV255V
Fig.7 : Junction capacitance versus reverse
voltage applied (Typical values).
800
Fig.8 : Recovery charges versus dIF/dt.
C(pF)
QRR(uC)
2
F=1Mhz Tj=25 oC
90%CONFIDENCE Tj=100 OC
750
IF=IF(av)
1
700
0.5
650
600
0.2
550
VR(V)
500
1
dIF/dt(A/us)
10
100
200
Fig.9 : Peak reverse current versus dIF/dt.
0.1
10
20
200
100
500
Fig.10 : Dynamic parameters versus junction
temperature.
IRM(A)
1.50
50
QRR;IRM[Tj]/QRR;IRM[Tj=100 o C
TYPICAL VALUE S
90%CONFIDENCE
IF=IF(av)
20
50
1.25
Tj=100 OC
1.00
10
IRM
0.75
5
QRR
0.50
0.25
2
Tj( o C)
dIF/dt(A/us)
1
10
4/5
20
50
100
200
500
0.00
0
25
50
75
100
125
150
BYV255V
PACKAGE MECHANICAL DATA
ISOTOP
DIMENSIONS
n
n
n
n
REF.
Millimeters
A
A1
B
C
C2
D
D1
E
E1
E2
G
G1
G2
F
F1
P
P1
S
Min.
Max.
11.80
12.20
8.90
9.10
7.8
8.20
0.75
0.85
1.95
2.05
37.80
38.20
31.50
31.70
25.15
25.50
23.85
24.15
24.80 typ.
14.90
15.10
12.60
12.80
3.50
4.30
4.10
4.30
4.60
5.00
4.00
4.30
4.00
4.40
30.10
30.30
Inches
Min.
0.465
0.350
0.307
0.030
0.077
1.488
1.240
0.990
0.939
0.976
0.587
0.496
0.138
0.161
0.181
0.157
0.157
1.185
Max.
0.480
0.358
0.323
0.033
0.081
1.504
1.248
1.004
0.951
typ.
0.594
0.504
0.169
0.169
0.197
0.69
0.173
1.193
Marking : Type number
Cooling method : C
Weight : 27 g
Epoxy meets UL94, V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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