STTH803D/G ® HIGH FREQUENCY SECONDARY RECTIFIER MAJOR PRODUCTS CHARACTERISTICS IF(AV) 8A VRRM 300 V Tj (max) 175 °C VF (max) 1V trr (max) 35 ns K K A N.C. A K D2PAK STTH803G TO-220AC STTH803D FEATURES AND BENEFITS COMBINES HIGHEST RECOVERY AND REVERSE VOLTAGE PERFORMANCE ULTRA-FAST, SOFT AND NOISE-FREE RECOVERY DESCRIPTION Single Fast Recovery Epitaxial Diode suited for Switch Mode Power Supply and high frequency DC/DC converters. Packaged in TO-220AC or D2PAK this device is especially intended for secondary rectification. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) Parameter Repetitive peak reverse voltage RMS forward current IF(AV) Average forward current Tc = 150°C δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal IRSM Non repetitive avalanche current tp = 20 µs square Tstg Storage temperature range Tj Maximum operating junction temperature October 1999 - Ed: 5C Value 300 Unit V 20 A 8 A 100 A 4 A -65 +175 °C + 175 °C 1/6 STTH803D/G THERMAL RESISTANCES Symbol Rth (j-c) Parameter Junction to case Value Unit 2.5 °C/W STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol IR * VF ** Parameter Tests conditions Reverse leakage current VR = 300 V Forward voltage drop IF = 8 A Tj = 25°C IF = 8 A Tj = 125°C Min. Typ. Tj = 25°C 20 Tj = 125°C Max. Unit 20 µA 200 1.25 V 0.85 1 Typ. Max. Unit Tj = 25°C 25 ns Tj = 25°C 35 IF = 8 A dIF/dt = 100 A/µs VFR = 1.1 x VF max. Tj = 25°C 200 ns Tj = 25°C 3.5 V Vcc = 200V dIF/dt = 200 A/µs Tj = 125°C Pulse test : * tp = 5 ms, δ < 2 % ** tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation : P = 0.75 x IF(AV) + 0.031 IF2(RMS) RECOVERY CHARACTERISTICS Symbol trr Tests conditions IF = 0.5 A IF = 1 A tfr VFP Sfactor IRM 2/6 Irr = 0.25 A dIF/dt = - 50 A/µs IF = 8 A IR = 1 A VR = 30 V Min. 0.3 8 A STTH803D/G Fig. 1: Conduction losses versus average current. Fig. 2: Forward voltage drop versus forward current (maximum values). P1(W) IFM(A) 12 δ = 0.05 10 δ = 0.1 100.0 δ = 0.2 δ = 0.5 Tj=125°C 8 10.0 δ=1 Tj=25°C 6 Tj=75°C 4 1.0 T 2 δ=tp/T 10 VFM(V) 0.1 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 Fig. 3: Relative variation of thermal impedance junction to case versus pulse duration. Fig. 4: Peak reverse recovery current versus dIF/dt (90% confidence). IF(av) (A) 0 0 1 2 3 4 5 6 7 8 tp 9 IRM(A) Zth(j-c)/Rth(j-c) 16 1.0 IF=2*IF(av) VR=200V Tj=125°C 14 0.8 IF=IF(av) 12 δ = 0.5 0.6 10 8 δ = 0.2 0.4 δ = 0.1 0.2 IF=0.5*IF(av) 6 T 4 Single pulse δ=tp/T tp(s) 0.0 1E-3 1E-2 1E-1 tp 1E+0 Fig. 5: Reverse recovery time versus dIF/dt (90% confidence). 2 0 dIF/dt(A/µs) 0 Fig. 6: values). trr(ns) 100 90 80 70 60 50 40 30 20 10 0 50 100 150 200 250 300 350 400 450 500 Softness factor versus dIF/dt (typical S factor 0.60 VR=200V Tj=125°C VR=200V Tj=125°C 0.50 0.40 IF=2*IF(av) IF=IF(av) 0.30 0.20 IF=0.5*IF(av) dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 0.10 dIF/dt(A/µs) 0.00 0 50 100 150 200 250 300 350 400 450 500 3/6 STTH803D/G Fig. 7: Relative variation of dynamic parameters versus junction temperature (reference: Tj = 125°C). VFP(V) 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 25 8 6 5 4 3 IRM 2 1 Tj(°C) 50 75 0 100 125 tfr(ns) 300 VFR=1.1*VF max. IF=IF(av) Tj=125°C 250 200 150 100 0 4/6 dIF/dt(A/µs) 0 IF=IF(av) Tj=125°C 7 S factor Fig. 9: Forward recovery time versus dIF/dt (90% confidence). 50 Fig. 8: Transient peak forward voltage versus dIF/dt (90% confidence). 50 100 150 200 250 300 350 400 450 500 dIF/dt(A/µs) 0 50 100 150 200 250 300 350 400 450 500 STTH803D/G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm Inches Min. Max. Min. Max. A A1 A2 B B2 C C2 D 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 E G L L2 L3 M R V2 10.00 10.40 4.88 5.28 15.00 15.85 1.27 1.40 1.40 1.75 2.40 3.20 0.40 typ. 0° 8° C2 L2 Millimeters 0.393 0.409 0.192 0.208 0.590 0.624 0.050 0.055 0.055 0.069 0.094 0.126 0.016 typ. 0° 8° FOOT PRINT DIMENSIONS (in millimeters) D2PAK 16.90 10.30 5.08 1.30 3.70 8.90 5/6 STTH803D/G PACKAGE MECHANICAL DATA TO-220AC DIMENSIONS A H2 REF. Millimeters Inches A C D E F F1 G H2 L2 L4 L5 L6 L7 L9 M Diam. I Min. Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 4.95 5.15 10.00 10.40 16.40 typ. 13.00 14.00 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.194 0.202 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 C L5 L7 ØI L6 L2 D L9 F1 L4 M F E G Ordering code Marking Package Weight Base qty Delivery mode STTH803D STTH803D TO-220AC 1.86g 50 Tube 1.48g 50 Tube STTH803G STTH803G 2 D PAK Cooling method: by conduction (C) Recommended torque value (TO-220AC): 0.55 N.m. Maximum torque value (TO-220AC): 0.70 N.m. Epoxy meets UL 94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. 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