SKCD 81 C 170 I HD Absolute Maximum Ratings Symbol Conditions Values Unit VRRM IF(AV) Tj = 25 °C, IR = 0.1 mA 1700 V Ts = 80 °C, Tj = 150 °C 85 A IFSM 10 ms sin 180° Tj = 25 °C 1370 A Tj = 150 °C 1070 A 150 °C Tjmax CAL-DIODE Electrical Characteristics Symbol Conditions IF = 150 A i2t VRRM = 1700 V IR Size: 9 mm x 9 mm SKCD 81 C 170 I HD min. typ. max. Unit Tj = 150 °C, 10 ms, sin 180° 5720 A2s Tj = 25 °C, VRRM = 1700 V 0.10 mA Tj = 125 °C, VRRM = 1700 V mA Tj = 25 °C, IF = 150 A 1.73 2.02 V Tj = 125 °C, IF = 150 A 1.78 2.05 V V(TO) Tj = 125 °C 1.03 V rT Tj = 125 °C 5.0 mΩ VF Features Dynamic Characteristics • high current density • easy paralleling due to a small forward voltage spread • positive temperature coefficient • very soft recovery behavior • small switching losses • high ruggedness • compatible to thick wire bonding • compatible to standard solder processes Symbol Conditions trr Tj = 25 °C, 150 A, 1200 V, 1125 A/µs trr Tj = 125 °C, 150 A, 1200 V, 1125 A/µs Qrr Tj = 25 °C, 150 A, 1200 V, 1125 A/µs 25 µC Qrr Tj = 125 °C, 150 A, 1200 V, 1125 A/µs 44 µC Irrm Tj = 25 °C, 150 A, 1200 V, 1125 A/µs 83 A Irrm Tj = 125 °C, 150 A, 1200 V, 1125 A/µs 102 A Typical Applications* Thermal Characteristics • freewheeling diode for IGBT • particularly suitable for frequencies < 8 kHz Symbol Conditions min. typ. max. Unit µs ns min. typ. max. Unit °C Tj -40 150 Tstg -40 150 °C Tsolder 10 min. 250 °C Tsolder 5 min. 320 °C Rth(j-s) sold. on 0,38 mm DCB, reference point on copper heatsink close to the chip 0.4 K/W Values Unit 9x9 mm2 81 mm2 Mechanical Characteristics Symbol Conditions Raster size Area total Anode bondable (Al) Cathode solderable (Ag/Ni) Al, diameter ≤ 500 µm Wire bond Package wafer frame Chips / Package 116 (5" Wafer) pcs SKCD © by SEMIKRON Rev. 1 – 18.02.2010 1 SKCD 81 C 170 I HD This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. 2 Rev. 1 – 18.02.2010 © by SEMIKRON