MICROCHIP TC962IJA

M
TC962
High Current Charge Pump DC-to-DC Converter
Features
General Description
•
•
•
•
•
•
•
•
The TC962 is an advanced version of the industry
standard TC7662 high voltage DC-to-DC converter.
Using improved design techniques and CMOS
construction, the TC962 can source as much as 80mA
versus the 7662’s 20mA capability.
Pin Compatible With TC7662/ICL7662/SI7661
High Output Current 80mA
No External Diodes Required
Wide Operating Range 3V to 18V
Low Output Impedance 28Ω Typ.
No Low Voltage Terminal Required
Application Zener On-Chip
OSC Frequency Doubling Pin Option for Smaller
Output Capacitors
Applications
•
•
•
•
Laptop Computers
Disk Drives
Process Instrumentation
µP-Based Controllers
Device Selection Table
Part
Number
Package
Operating
Temp.
Range
TC962COE
16-Pin SOIC Wide
0°C to +70°C
TC962CPA
8-Pin Plastic DIP
0°C to +70°C
TC962EPA
8-Pin Plastic DIP
-40°C to +85°C
TC962IJA
8-Pin CERDIP
-25°C to +85°C
TC962MJA
8-Pin CERDIP
-55°C to +125°C
As an inverter, the TC962 can put out voltages as high
as 18V and as low as 3V without the need for external
diodes. The output impedance of the device is a low
28Ω (with the proper capacitors), voltage conversion
efficiency is 99.9%, and power conversion efficiency is
97%.
The low voltage terminal (pin 6) required in some
TC7662 applications has been eliminated. Grounding
this terminal will double the oscillator frequency from
12kHz to 24kHz. This will allow the use of smaller
capacitors for the same output current and ripple, in
most applications. Only two external capacitors are
required for inverter applications. In the event an
external clock is needed to drive the TC962 (such as
paralleling), driving this pin directly will cause the
internal oscillator to sync to the external clock.
Pin 1, which is used as a test pin on the 7662, is a
voltage reference zener on the TC962. This zener
(6.4V at 5mA) has a dynamic impedance of 12Ω and is
intended for use where the TC962 is supplying current
to external regulator circuitry and a reference is needed
for the regulator circuit. (See Section 3.0 Applications
Information).
The TC962 is compatible with the LTC1044, SI7661
and ICL7662. It should be used in designs that require
greater power and/or less input to output voltage drop.
It offers superior performance over the ICL7660S.
Package Type
16-Pin SOIC Wide
8-Pin DIP
8-Pin CERDIP
Zener
8 VDD
Cathode 1 •
C+ 2 TC962CPA 7 COSC
TC962EPA
6 FREQ x 2
GND 3
TC962IJA
–
C 4 TC962MJA 5 VOUT
 2002 Microchip Technology Inc.
Zener
Cathode 1
16 VDD
NC 2
C+ 3
15 NC
14 COSC
NC 4
GND 5
13 NC
TC962COE
12 FREQ x 2
NC 6
11 NC
C– 7
10 VOUT
NC 8
9 NC
DS21484B-page 1
TC962
Functional Block Diagram
8
FREQ x 2
–
OSC/C
Timing
6
I
VDD
I
TC962
7
Level
Shift
Q
+
–
P SW1
2
F/F
C
Q
Level
Shift
Comparator
with Hysteresis
N SW4
CAP +
+
CP
External
3
Zener
Cathode
GND
1
6.4V
VREF
+
Level
Shift
N SW2
4
Level
Shift
CR
EXT
OUT
CAP –
RL
N SW3
5
VOUT
DS21484B-page 2
 2002 Microchip Technology Inc.
TC962
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings*
Supply Voltage (VDD to GND) ..............................+18V
Input Voltage Any Pin
......................... (VDD +0.3) to (VSS -0.3) (Note 1)
Current Into Any Pin............................................ 10mA
ESD Protection ................................................ ±2000V
Output Short Circuit ........... Continuous (at 5.5V Input)
Package Power Dissipation (TA ≤ 70°C)
SOIC ....................................................... 760 mW
PDIP........................................................ 730 mW
CERDIP .................................................. 800 mW
Package Thermal Resistance
CERDIP, RθJ-A ......................................... 90°C/W
PDIP, RθJ-A ............................................ 140°C/W
Operating Temperature Range
CPA, COE ....................................... 0°C to +70°C
IJA ................................................ -25°C to +85°C
EPA .............................................. -40°C to +85°C
MJA ............................................ -55°C to +125°C
Storage Temperature Range ............. -65°C to +150°C
TC962 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD = 15V, TA = 25°C (See Figure 3-1) unless otherwise noted.
Min
Typ
Max
Units
VDD
Symbol
Supply Voltage
Parameter
3
—
18
V
IS
Supply Current
VDD = 15V
—
—
—
—
—
—
—
—
510
560
650
190
210
210
—
700
—
—
—
—
—
µA
RL = ∞
TA = +25°C
0 ≤ TA ≤ +70°C
-55°C ≤ TA ≤ +125°C
TA = +25°C
0 ≤ TA ≤ +70°C
-55°C ≤ TA ≤ +125°C
IL = 20mA, VDD = 15V
IL = 80mA, VDD = 15V
IL = 3mA, VDD = 5V
VDD = 5V
Test Conditions
RO
Output Source
Resistance
—
—
—
32
35
—
37
40
50
Ω
FOSC
Oscillator Frequency
—
—
12
24
—
—
kHz
PEFF
Power Efficiency
93
—
97
—
—
—
%
RL = 2kΩ
VDEF
Voltage Efficiency
99
—
96
99.9
—
—
—
—
—
%
RL = ∞
Over temperature range
VZ
Zener Voltage
6.0
6.2
6.4
V
IZ = 5mA
ZZT
Zener Impedance
—
12
—
Ω
IL = 2.5mA to 7.5mA
Note
1:
Pin 6 Open
Pin 6 GND
Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no
inputs from sources operating from external supplies be applied prior to "power up" of the TC962.
 2002 Microchip Technology Inc.
DS21484B-page 3
TC962
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin DIP)
(8-Pin CERDIP)
Symbol
1
Zener Cathode
2
C+
3
GND
4
C-
5
VOUT
6
FREQ x 2
7
COSC
8
VDD
Pin No.
(16-Pin SOIC)
Symbol
1
Zener Cathode
2
NC
+
3
C
4
NC
5
GND
6
NC
7
C
-
8
NC
9
NC
10
VOUT
11
NC
12
FREQ x 2
13
NC
14
COSC
Description
Cathode of internal zener diode.
Positive side of external CP capacitor (pump cap).
Ground terminal.
Negative side of external CP capacitor (pump cap).
Output voltage.
If grounded, frequency doubles.
Capacitor to GND will decrease frequency.
Input voltage.
Description
Cathode of internal zener diode.
No connect.
Positive side of external CP capacitor (pump cap).
No connect.
Ground terminal.
No connect.
Negative side of external CP capacitor (pump cap).
No connect.
No connect.
Output voltage.
No connect.
If grounded, frequency doubles.
No connect.
Capacitor to GND will decrease frequency.
15
NC
No connect.
16
VDD
Input voltage.
DS21484B-page 4
 2002 Microchip Technology Inc.
TC962
3.0
APPLICATIONS INFORMATION
3.1
Theory of Operation
internal to the TC962. Grounding pin 6 will turn on a
current source and double the frequency. This will
double the charge current going into the internal
capacitor, as well as any capacitor added to pin 7.
The TC962 is a capacitive pump (sometimes called a
switched capacitor circuit), where four MOSFET
switches control the charge and discharge of a
capacitor.
A zener diode has been added to the TC962 for use as
a reference in building external regulators. This zener
runs from pin 1 to ground.
3.2
The functional block diagram shows how the switching
action works. SW1 and SW2 are turned on simultaneously, charging CP to the supply voltage, VIN. This
assumes that the on resistance of the MOSFETs in
series with the capacitor results in a charging time
(3 time constants) that is less than the on time provided
by the oscillator frequency as shown:
Latch Up
All CMOS structures contain a parasitic SCR. Care
must be taken to prevent any input from going above or
below the supply rail, or latch up will occur. The result
of latch up is an effective short between VDD and VSS.
Unless the power supply input has a current limit, this
latch up phenomena will result in damage to the device.
(See AN763 Latch-up Protection of CMOS ICs.)
3 (RDS(ON) CP) < CP/(0.5 fOSC)
In the next cycle, SW1 and SW2 are turned off and after
a very short interval of all switches being off (this
prevents large currents from occurring due to cross
conduction), SW3 and SW4 are turned on. The charge
in CP is then transferred to CR, but with the polarity
inverted. In this way, a negative voltage is now derived.
FIGURE 3-1:
TEST CIRCUIT
690
IS
NC
An oscillator supplies pulses to a flip-flop that is then
fed to a set of level shifters. These level shifters then
drive each set of switches at one-half the oscillator
frequency.
+ 10µF
CP
1
8
2
7
3
IL
TC962
4
COSC
RL
VOUT
(–5V)
5
The oscillator has two pins that control the frequency of
oscillation. Pin 7 can have a capacitor added that is
returned to ground. This will lower the frequency of the
oscillator by adding capacitance to the timing capacitor
FIGURE 3-2:
V+
(+5V)
CR
+
10µF
TYPICAL APPLICATIONS
Combined Negative Converter and Positive Multiplier
Split V+ In Half
V+
1
8
2
7
+ 10µF 3
CP2
TC962
6
5
4
+
CP1
+
V+
VD1
VD2
VOUT = –V +
C R1
VOUT =
2V + –2V
+
CP
D
+
10µF
1
8
2
7
3
TC962
4
6
5
10µF
10µF
CR
Lowering Output Resistance by Paralleling Devices
VOUT =
+
V+
2
10µF
Positive Voltage Multiplier
V+
V+
CP1
+ 10µF
1
8
1
8
1
8
2
7
2
7
2
7
6
3
5
4
3
4
TC962
6
5
CP2
+ 10µF
3
4
TC962
TC962
VD1
VD2
6
5
CP
+ 10µF
CP
VOUT =
2V +–2V
+
D
10µF
VOUT
CR
+
 2002 Microchip Technology Inc.
10µF
DS21484B-page 5
TC962
4.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Circuit of Figure 3-1, CP = CR = 10µF, CPESR ≈ CRESR ≈ 1Ω.
Frequency vs. Temperature
Oscillator Frequency vs. C OSC
Supply Current vs. Temperature
20
700
V + = 15V
400
300
200
V + = 15V
COSC = FREQ x 2 = OPEN
18
FREQUENCY (kHz)
500
FREQUENCY (Hz)
1k
100
0
-60 -40 -20
10
12
10
6
10
1
0 20 40 60 80 100 120 140
100
1000
10,000
Output Resistance vs. Temperature
Current vs. Zener Voltage
Power Conversion Efficiency vs. I LOAD
CURRENT (mA)
60
V+ = 5V IL = 3mA
40
POWER CONVERSION EFFICIENCY (%)
50
70
TA = +25°C
40
30
20
V+ = 15V IL = 20mA
10
20
10
-60 -40 -20
0 20 40 60 80 100 120 140
TEMPERATURE (°C)
0
4.5
0 20 40 60 80 100 120 140
TEMPERATURE (°C)
80
30
-60 -40 -20
CAPACITANCE (pF)
TEMPERATURE (°C)
OUTPUT RESISTANCE ( Ω)
14
8
100
50
16
TA = +25°C
100
150
135
90
80
EFFICIENCY
120
105
70
SUPPLY
CURRENT
60
90
75
50
40
60
30
45
20
30
10
15
0
0
4.0
5.5
6.0
ZENER VOLTAGE (V)
6.5
7.0
SUPPLY CURRENT (mA)
SUPPLY CURRENT (µA)
TA = +25°C
10k
600
8
16 24 32 40 48 56
64 72
80
LOAD CURRENT (mA)
Output Resistance vs. Input Voltage
110
TA = +25°C
OUTPUT RESISTANCE (Ω)
100
90
80
70
3mA
60
20mA
50
40
30
20
10
0
2
4
6 8 10 12 14 16 18
INPUT VOLTAGE (V)
DS21484B-page 6
20
 2002 Microchip Technology Inc.
TC962
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Package marking data not available at this time.
5.2
Package Dimensions
8-Pin CDIP (Narrow)
.110 (2.79)
.090 (2.29)
PIN 1
.300 (7.62)
.230 (5.84)
.020 (0.51) MIN.
.055 (1.40) MAX.
.320 (8.13)
.290 (7.37)
.400 (10.16)
.370 (9.40)
.040 (1.02)
.020 (0.51)
.200 (5.08)
.160 (4.06)
.150 (3.81)
MIN.
.200 (5.08)
.125 (3.18)
.015 (0.38)
.008 (0.20)
3° MIN.
.400 (10.16)
.320 (8.13)
.065 (1.65) .020 (0.51)
.045 (1.14) .016 (0.41)
Dimensions: inches (mm)
8-Pin Plastic DIP
PIN 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.150 (3.81)
.115 (2.92)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
.015 (0.38)
.008 (0.20)
3° MIN.
.400 (10.16)
.310 (7.87)
Dimensions: inches (mm)
 2002 Microchip Technology Inc.
DS21484B-page 7
TC962
Package Dimensions (Continued)
16-Pin SOIC (Wide)
PIN 1
.299 (7.59) .419 (10.65)
.291 (7.40) .398 (10.10)
.413 (10.49)
.398 (10.10)
.104 (2.64)
.097 (2.46)
.050 (1.27) TYP. .019 (0.48)
.014 (0.36)
.012 (0.30)
.004 (0.10)
8°
MAX.
.013 (0.33)
.009 (0.23)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS21484B-page 8
 2002 Microchip Technology Inc.
TC962
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21484B-page9
TC962
NOTES:
DS21484B-page10
 2002 Microchip Technology Inc.
TC962
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
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dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
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Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
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The Company’s quality system processes and
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 2002 Microchip Technology Inc.
DS21484B-page 11
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'!%!'
DS21484B-page 12
 2002 Microchip Technology Inc.