STMICROELECTRONICS STPS340B

STPS340U/S/B
®
POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
3A
VRRM
40 V
Tj (max)
150 °C
VF (max)
0.57 V
K
A
FEATURES AND BENEFITS
n
n
n
n
n
n
n
NC
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
LOW THERMAL RESISTANCE
EXTREMELY FAST SWITCHING
SURFACE MOUNTED DEVICE
AVALANCHE CAPABILITY SPECIFIED
DPAK
STPS340B
DESCRIPTION
Single chip Schottky rectifier suited for Switch
Mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMB, SMC and DPAK this device is
intended for use in low and medium voltage
operation, high frequency inverters, free wheeling
and polarity protection applications where low
switching losses are required.
SMB
(JEDEC DO-214AA)
STPS340U
SMC
(JEDEC DO-214AB)
STPS340S
ABSOLUTE RATINGS (limiting values)
Symbol
VRRM
IF(RMS)
IF(AV)
Parameter
Value
40
Unit
V
DPAK
6
A
SMB / SMC
10
Repetitive peak reverse voltage
RMS forward current
Average forward current
Tc = 135°C δ = 0.5
TL = 105°C δ = 0.5
DPAK
SMB / SMC
IFSM
Surge non repetitive forward
current
tp = 10 ms Sinusoidal
IRRM
Repetitive peak reverse current
tp = 2 µs
A
1
A
W
- 65 to + 150
°C
Maximum operating junction temperature
+ 150
°C
Critical rate of rise of reverse voltage
10000
V/µs
Repetitive peak avalanche
power
Tstg
Storage temperature range
dV/dt
75
1300
PARM
Tj
A
3
July 2003 - Ed: 7B
tp = 1µs
F = 1kHz square
Tj = 25°C
1/7
STPS340U/S/B
THERMAL RESISTANCES
Symbol
Rth (j-l)
Rth (j-c)
Parameter
Junction to leads
Junction to case
SMC
Value
20
SMB
25
DPAK
5.5
Unit
°C/W
°C/W
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Tests Conditions
IR *
Reverse leakage current
VF *
Tests Conditions
Forward voltage drop
Min.
Typ.
Max.
20
Unit
µA
2
10
mA
V
Tj = 25°C
VR = VRRM
Tj = 125°C
VR = VRRM
Tj = 25°C
IF = 3 A
0.63
Tj = 25°C
IF = 6 A
0.84
Tj = 125°C
IF = 3 A
0.52
0.57
Tj = 125°C
IF = 6 A
0.63
0.72
Pulse test : * tp = 380 µs, δ < 2 %
To evaluate the maximum conduction losses use the following equation :
P = 0.42 x IF(AV) + 0.050 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Average current
temperature (δ =0.5).
ambient
IF(av)(A)
PF(av)(W)
2.5
δ = 0.1
δ = 0.2
3.5
δ = 0.5
Rth(j-a)=Rth(j-c)
(DPAK)
3.0
δ = 0.05
2.0
versus
2.5
δ=1
1.5
Rth(j-a)=65°C/W
Rth(j-a)=Rth(j-l)
(SMB/SMC)
2.0
1.5
1.0
T
1.0
0.5
0.0
0.0
δ=tp/T
IF(av) (A)
0.5
1.0
1.5
2.0
2.5
3.0
0.5
tp
3.5
T
4.0
Fig. 3: Normalized avalanche power derating
versus pulse duration.
0.0
0
25
Tamb(°C)
tp
50
75
100
125
150
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
δ=tp/T
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
2/7
Tj(°C)
tp(µs)
0.1
1
0
10
100
1000
0
25
50
75
100
125
150
STPS340U/S/B
Fig. 5-1: Non repetitive surge peak forward current
versus overload duration (SMB)(Maximum values).
IM(A)
10
9
8
7
6
5
4
3
IM
2
1
0
1E-3
IM(A)
12
10
Ta=25°C
Ta=25°C
Ta=50°C
Ta=50°C
4
Ta=100°C
2
t
IM
1E-2
1E-1
1E+0
40
Tc=25°C
30
20
Tc=50°C
Tc=100°C
IM
t
t(s)
1E-2
t(s)
δ=0.5
IM(A)
δ=0.5
Ta=100°C
t
t(s)
δ=0.5
50
0
1E-3
8
6
Fig. 5-3: Non repetitive surge peak forward current
versus overload duration (DPAK) (Maximum
values).
10
Fig. 5-2: Non repetitive surge peak forward current
versus overload duration (SMC) (Maximum values).
1E-1
1E+0
Fig. 6-2: Relative variation of thermal transient
impedance junction to lead versus pulse duration
(SMC).
1E-2
1E-1
1E+0
Fig. 6-1: Relative variation of thermal transient
impedance junction to lead versus pulse duration
(SMB).
Zth(j-a)/Rth(j-a)
1.0
0.9 Printed circuit board (e=35µm)
0.8
0.7
0.6
0.5 δ = 0.5
0.4
0.3
0.2 δ = 0.2
0.1 δ = 0.1
tp(s)
Single pulse
0.0
1.0E-2
1.0E-1
1.0E+0
1.0E+1
T
δ=tp/T
tp
1.0E+2
1.0E+3
Fig. 6-3: Relative variation of thermal transient
impedance junction to lead versus pulse
duration(DPAK).
Zth(j-a)/Rth(j-a)
Zth(j-a)/Rth(j-a)
1.0
0.9 Printed circuit board (e=35µm)
0.8
0.7
0.6
0.5 δ = 0.5
0.4
0.3
0.2 δ = 0.2
0.1 δ = 0.1
tp(s)
Single pulse
0.0
1.0E-2
1.0E-1
1.0E+0
1.0E+1
0
1E-3
T
δ=tp/T
1.0E+2
tp
1.0E+3
1.0
0.9 Printed circuit board (e=35µm)
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3 δ = 0.2
0.2 δ = 0.1
Single pulse
0.1
0.0
1E-3
1E-2
T
tp(s)
δ=tp/T
1E-1
tp
1E+0
3/7
STPS340U/S/B
Fig. 7: Reverse leakage current versus reverse
voltage applied (Typical values).
Fig. 8: Junction capacitance versus reverse
voltage applied (Typical values).
IR(A)
C(pF)
1E-2
500
Tj=150°C
F=1MHz
Tj=25°C
200
Tj=125°C
1E-3
100
Tj=100°C
50
1E-4
Tj=75°C
20
VR(V)
VR(V)
1E-5
0
5
10
15
20
25
30
35
40
Fig. 9: Forward voltage drop versus forward
current (Maximum values).
10.00
10
1
2
5
10
20
50
Fig. 10-1: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm) (SMB).
Rth(j-a) (°C/W)
IFM(A)
120
Typical values
Tj=150°C
100
1.00
80
Tj=125°C
60
0.10
40
20
VFM(V)
0.01
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Fig. 10-2: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm) (SMC).
S(Cu) (cm²)
0
0
1
2
5
Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
100
80
80
60
60
40
40
20
20
S(Cu) (cm²)
S(Cu) (cm²)
4/7
4
Fig. 10-3: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy printed
circuit board FR4, copper thickness: 35µm) (DPAK).
100
0
3
0
1
2
3
4
5
0
0
2
4
6
8
10
12
14
16
18
20
STPS340U/S/B
PACKAGE MECHANICAL DATA
DPAK
DIMENSIONS
REF.
Millimeters
Min.
A
A1
A2
B
B2
C
C2
D
E
G
H
L2
L4
V2
Max
2.20
2.40
0.90
1.10
0.03
0.23
0.64
0.90
5.20
5.40
0.45
0.60
0.48
0.60
6.00
6.20
6.40
6.60
4.40
4.60
9.35
10.10
0.80 typ.
0.60
1.00
0°
8°
Inches
Min.
Max.
0.086
0.094
0.035
0.043
0.001
0.009
0.025
0.035
0.204
0.212
0.017
0.023
0.018
0.023
0.236
0.244
0.251
0.259
0.173
0.181
0.368
0.397
0.031 typ.
0.023
0.039
0°
8°
FOOTPRINT DIMENSIONS (in millimeters)
6.7
6.7
3
3
1.6
1.6
2.3
2.3
5/7
STPS340U/S/B
PACKAGE MECHANICAL DATA
SMB
DIMENSIONS
E1
REF.
A1
A2
C
L
b
FOOTPRINT DIMENSIONS (in millimeters)
2.3
1.52
6/7
2.75
1.52
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.41
0.006
0.016
D
E
Millimeters
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.60
0.030
0.063
STPS340U/S/B
PACKAGE MECHANICAL DATA
SMC
DIMENSIONS
E1
REF.
A1
A2
b
c
E
E1
E2
D
L
D
E
A1
Millimeters
Min.
1.90
0.05
2.90
0.15
7.75
6.60
4.40
5.55
0.75
Max.
2.45
0.20
3.2
0.41
8.15
7.15
4.70
6.25
1.60
Inches
Min.
0.075
0.002
0.114
0.006
0.305
0.260
0.173
0.218
0.030
Max.
0.096
0.008
0.126
0.016
0.321
0.281
0.185
0.246
0.063
A2
C
L
E2
b
FOOTPRINT DIMENSIONS (in millimeters)
3.3
2.0
n
n
4.2
2.0
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS340U
STPS340S
STPS340B
STPS340B-TR
U34
S34
S340
S340
SMB
SMC
DPAK
DPAK
0.107g
0.243g
0.30g
0.30g
2500
2500
75
2500
Tape and reel
Tape and reel
Tube
Tape and reel
BAND INDICATES CATHODE ON SMB, SMC
EPOXY MEETS UL94,V0
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change without notice. This publication supersedes and replaces all information previously supplied.
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