STMICROELECTRONICS STPS1L40A

STPS1L40
®
LOW DROP POWER SCHOTTKY RECTIFIER
Table 1: Main Product Characteristics
IF(AV)
1A
VRRM
40 V
Tj (max)
150°C
VF(max)
0.42 V
FEATURES AND BENEFITS
■
■
■
■
■
SMA
(JEDEC DO-214AC)
STPS1L40A
Very small conduction losses
Negligible switching losses
Low forward voltage drop
Surface mount miniature packages
Avalanche capability specified
SMB
(JEDEC DO-214AA)
STPS1L40U
DESCRIPTION
Table 2: Order Codes
Part Number
STPS1L40A
STPS1L40U
Single chip Schottky rectifiers suited to Switched
Mode Power Supplies and high frequency DC to
DC converters.
Packaged in SMA and SMB, this device is especially intended for surface mounting and used in
low voltage, high frequency inverters, free wheeling and polarity protection applications.
Marking
GB4
GC4
Table 3: Absolute Ratings (limiting values)
Symbol
Parameter
VRRM Repetitive peak reverse voltage
IF(RMS) RMS forward voltage
Value
40
Unit
V
8
A
IF(AV)
Average forward current
TL = 130°C δ = 0.5
1
A
IFSM
Surge non repetitive forward current
tp = 10ms sinusoidal
60
A
IRRM
Repetitive peak reverse current
tp = 2µs F = 1kHz square
1
A
IRSM
Non repetitive peak reverse current
tp = 100µs square
1
A
PARM
Repetitive peak avalanche power
tp = 1µs Tj = 25°C
900
W
-65 to + 150
°C
150
10000
°C
V/µs
Tstg
Tj
dV/dt
Storage temperature range
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
1
dPt ot
* : --------------- > -------------------------- thermal runaway condition for a diode on its own heatsink
Rth ( j – a )
dTj
August 2004
REV. 5
1/7
STPS1L40
Table 4: Thermal Resistance
Symbol
Rth(j-l)
Parameter
Value
30
25
SMA
SMB
Junction to lead
Unit
°C/W
Table 5: Static Electrical Characteristics
Symbol
Parameter
Tests conditions
IR *
Reverse leakage current
Tj = 25°C
Tj = 125°C
Tj = 25°C
VF *
Tj = 125°C
Forward voltage drop
Tj = 25°C
Tj = 125°C
Min.
Typ
VR = VRRM
Max.
Unit
35
µA
10
mA
6
0.5
IF = 1A
0.37
0.42
V
0.63
IF = 2A
0.5
0.61
* tp = 380 µs, δ < 2%
Pulse test:
2
To evaluate the conduction losses use the following equation: P = 0.23 x IF(AV) + 0.19 IF (RMS)
Figure 1: Average forward power dissipation
versus average forward current
Figure 2: Average forward current versus
ambient temperature (δ = 0.5)
PF(AV)(W)
IF(AV)(A)
0.70
δ = 0.1
0.60
1.2
δ = 0.2
δ = 0.5
Rth(j-a)=Rth(j-I)
1.0
δ = 0.05
0.50
0.8
δ=1
Rth(j-a)=120°C/W
0.40
Rth(j-a)=100°C/W
0.6
0.30
0.4
0.20
T
T
0.2
0.10
IF(AV)(A)
δ=tp/T
0.00
0.0
0.2
0.4
0.6
0.8
1.0
Figure 3: Normalized avalanche
derating versus pulse duration
δ=tp/T
tp
0.0
0
1.2
power
Tamb(°C)
tp
25
50
75
100
125
Figure 4: Normalized avalanche
derating versus junction temperature
PARM(tp)
PARM(1µs)
150
power
PARM(tp)
PARM(25°C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
0.001
0.01
2/7
Tj(°C)
tp(µs)
0.1
1
0
10
100
1000
25
50
75
100
125
150
STPS1L40
Figure 5: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMA)
Figure 6: Non repetitive surge peak forward
current versus overload duration (maximum
values) (SMB)
IM(A)
IM(A)
6.0
7
5.5
6
5.0
4.5
5
Ta=25°C
4.0
Ta=25°C
3.5
4
Ta=50°C
3.0
Ta=50°C
3
2.5
2.0
Ta=100°C
1.5
2
Ta=100°C
IM
1.0
IM
1
t
t
t(s)
δ=0.5
0.5
t(s)
δ=0.5
0
0.0
1E-3
1E-2
1E-1
1E+0
Figure 7: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMA)
1E-3
1E-1
1E+0
Figure 8: Relative variation of thermal
impedance junction to ambient versus pulse
duration (epoxy printed circuit board,
e(Cu)=35µm, recommended pad layout) (SMB)
Zth(j-c)/Rth(j-c)
Zth(j-c)/Rth(j-c)
1.0
1.0
0.8
0.8
0.6
1E-2
0.6
δ = 0.5
0.4
δ = 0.5
0.4
T
δ = 0.2
0.2
δ=tp/T
tp(s)
Single pulse
0.0
1E-2
1E-1
1E+0
1E+1
T
δ = 0.2
0.2
δ = 0.1
δ = 0.1
1E+2
5E+2
Figure 9: Reverse leakage current versus
reverse voltage applied (typical values)
0.0
1E-2
δ=tp/T
tp(s)
Single pulse
tp
1E-1
1E+0
1E+1
tp
1E+2
5E+2
Figure 10: Junction capacitance versus
reverse voltage applied (typical values)
IR(mA)
C(pF)
2E+1
1E+1
200
Tj=150°C
F=1MHz
Tj=25°C
100
Tj=100°C
1E+0
50
1E-1
20
1E-2
Tj=25°C
VR(V)
VR(V)
10
1E-3
0
5
10
15
20
25
30
35
40
1
2
5
10
20
50
3/7
STPS1L40
Figure 11: Forward voltage drop versus
forward current (typical values, high level)
Figure 12: Forward voltage drop versus
forward current (maximum values, low level)
IFM(A)
IFM(A)
3.0
10.00
2.5
Tj=125°C
Tj=125°C
Tj=25°C
1.00
Tj=25°C
2.0
Tj=150°C
1.5
0.10
Tj=150°C
1.0
0.5
VFM(V)
0.01
VFM(V)
0.0
0
100
200
300
400
500
600
700
800
900
1000
Figure 13: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMA)
0
100
200
300
400
500
600
700
800
Figure 14: Thermal resistance junction to
ambient versus copper surface under each
lead (Epoxy printed circuit board FR4, copper
thickness: 35µm) (SMB)
Rth(j-a)(°C/W)
Rth(j-a)(°C/W)
140
120
120
100
100
80
80
60
60
40
40
20
20
S(Cu)(cm²)
S(Cu)(cm²)
0
0
0
4/7
1
2
3
4
5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
STPS1L40
Figure 15: SMA Package Mechanical Data
DIMENSIONS
REF.
E1
D
E
A1
A2
C
L
b
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.03
0.075
0.080
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.41
0.006
0.016
E
4.80
5.60
0.189
0.220
E1
3.95
4.60
0.156
0.181
D
2.25
2.95
0.089
0.116
L
0.75
1.60
0.030
0.063
Figure 16: SMA Foot Print Dimensions
(in millimeters)
1.65
1.45
2.40
1.45
5/7
STPS1L40
Figure 17: SMB Package Mechanical Data
DIMENSIONS
REF.
E1
D
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
1.95
2.20
0.077
0.087
c
0.15
0.41
0.006
0.016
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
D
3.30
3.95
0.130
0.156
L
0.75
1.60
0.030
0.063
E
A1
A2
C
L
b
Figure 18: SMB Foot Print Dimensions
(in millimeters)
2.3
1.52
6/7
2.75
1.52
STPS1L40
Table 6: Ordering Information
Ordering type
STPS1L40A
STPS1L40U
■
■
Marking
GB4
GC4
Package
SMA
SMB
Weight
0.068 g
0.107 g
Base qty
5000
2500
Delivery mode
Tape & reel
Tape & reel
Band indicates cathode
Epoxy meets UL94, V0
Table 7: Revision History
Date
Jul-2003
Revision
4A
Aug-2004
5
Description of Changes
Last update.
SMA package dimensions update. Reference A1 max.
changed from 2.70mm (0.106inc.) to 2.03mm (0.080).
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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