STMICROELECTRONICS STW55NM60ND

STW55NM60ND
N-channel 600 V - 0.047 Ω - 51 A TO-247
FDmesh™ II Power MOSFET (with fast diode)
Preliminary Data
Features
Type
VDSS
STW55NM60ND
600 V
RDS(on)
ID
Pw
< 0.060 Ω 51 A 350 W
■
The worldwide best RDS(on) amongst the fast
recovery diode devices in TO-247
■
100% avalanche tested
■
Low input capacitance and gate charge
■
Low gate input resistance
■
High dv/dt and avalanche capabilities
2
3
1
TO-247
Application
■
Switching applications
Figure 1.
Internal schematic diagram
Description
The FDmesh™ II series belongs to the second
generation of MDmesh™ technology. This
revolutionary Power MOSFET associates a new
vertical structure to the company's strip layout
and associates all advantages of reduced onresistance and fast switching with an intrinsic fastrecovery body diode.It is therefore strongly
recommended for bridge topologies, in particular
ZVS phase-shift converters.
Table 1.
Device summary
Order codes
Marking
Package
Packaging
STW55NM60ND
55NM60ND
TO-247
Tube
November 2007
Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/9
www.st.com
9
Electrical ratings
1
STW55NM60ND
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage (VGS = 0)
600
V
VGS
Gate- source voltage
±25
V
ID
Drain current (continuous) at TC = 25 °C
51
A
ID
Drain current (continuous) at TC = 100 °C
32
A
Drain current (pulsed)
204
A
Total dissipation at TC = 25 °C
350
W
Derating factor
2.8
W/°C
Peak diode recovery voltage slope
40
V/ns
–55 to 150
150
°C
Value
Unit
0.36
°C/W
50
°C/W
300
°C
Max value
Unit
IDM
(1)
PTOT
dv/dt(2)
Tstg
Tj
Storage temperature
Max. operating junction temperature
1. Pulse width limited by safe operating area
2.
ISD ≤ 51 A, di/dt ≤ 600 A/µs, VDD = 80% V(BR)DSS
Table 3.
Symbol
Thermal data
Parameter
Rthj-case Thermal resistance junction-case max
Rthj-amb Thermal resistance junction-ambient max
Tl
Table 4.
Symbol
2/9
Maximum lead temperature for soldering
purpose
Avalanche characteristics
Parameter
IAS
Avalanche current, repetitive or notrepetitive (pulse width limited by Tj max)
15
A
EAS
Single pulse avalanche energy
(starting Tj = 25 °C, ID = IAS, VDD = 50 V)
850
mJ
STW55NM60ND
2
Electrical characteristics
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 5.
Symbol
On/off states
Parameter
Test conditions
Min.
Typ.
Max.
Unit
Drain-source
breakdown voltage
ID = 1 mA, VGS = 0
IDSS
Zero gate voltage
drain current (VGS = 0)
VDS = Max rating
VDS = Max rating @125 °C
1
10
µA
µA
IGSS
Gate-body leakage
current (VDS = 0)
VGS = ± 20 V
100
nA
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 250 µA
4
5
V
RDS(on)
Static drain-source on
resistance
VGS = 10 V, ID = 25.5 A
0.047
0.060
Ω
Typ.
Max.
Unit
V(BR)DSS
Table 6.
Symbol
600
3
V
Dynamic
Parameter
Test conditions
Min.
gfs (1)
Forward transconductance
VDS = 15 V, ID = 25.5 A
45
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 50 V, f = 1 MHz,
VGS = 0
5800
300
30
Coss eq.(2)
Equivalent output
capacitance
VGS = 0, VDS = 0 to 480 V
900
pF
td(on)
tr
td(off)
tf
Turn-on delay time
Rise time
Turn-off delay time
Fall time
VDD = 300 V, ID = 25.5 A
RG = 4.7 Ω, VGS = 10 V
(see Figure 7),
(see Figure 2)
TBD
TBD
TBD
TBD
ns
ns
ns
ns
Qg
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain charge
VDD = 480 V, ID = 51 A,
VGS = 10 V,
(see Figure 3)
190
30
90
nC
nC
nC
Rg
Gate input resistance
f=1 MHz Gate DC Bias = 0
Test signal level = 20 mV
Open drain
2.5
Ω
S
pF
pF
pF
1. Pulsed: pulse duration=300µs, duty cycle 1.5%
2. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS
increases from 0 to 80% VDSS
3/9
Electrical characteristics
Table 7.
Symbol
STW55NM60ND
Source drain diode
Parameter
Test conditions
Typ.
Max.
Unit
51
204
A
A
1.3
V
ISD
ISDM (1)
Source-drain current
Source-drain current (pulsed)
VSD (2)
Forward on voltage
ISD = 50 A, VGS = 0
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 50 A, VDD = 100 V
di/dt = 100 A/µs
(see Figure 4)
TBD
TBD
TBD
ns
µC
A
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 50 A,VDD = 100 V
di/dt = 100 A/µs,
Tj = 150 °C
(see Figure 4)
TBD
TBD
TBD
ns
µC
A
trr
Qrr
IRRM
trr
Qrr
IRRM
1. Pulse width limited by safe operating area
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
4/9
Min.
STW55NM60ND
Test circuit
3
Test circuit
Figure 2.
Switching times test circuit for
resistive load
Figure 4.
Test circuit for inductive load
Figure 5.
switching and diode recovery times
Unclamped Inductive load test
circuit
Figure 6.
Unclamped inductive waveform
Switching time waveform
Figure 3.
Figure 7.
Gate charge test circuit
5/9
Package mechanical data
4
STW55NM60ND
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6/9
STW55NM60ND
Package mechanical data
TO-247 MECHANICAL DATA
DIM.
mm.
MIN.
TYP
inch
MAX.
MIN.
TYP.
MAX.
A
4.85
5.15
0.19
0.20
A1
2.20
2.60
0.086
0.102
b
1.0
1.40
0.039
0.055
b1
2.0
2.40
0.079
0.094
0.134
b2
3.0
3.40
0.118
c
0.40
0.80
0.015
0.03
D
19.85
20.15
0.781
0.793
E
15.45
15.75
0.608
e
5.45
L
14.20
14.80
0.560
L1
3.70
4.30
0.14
L2
0.620
0.214
18.50
0.582
0.17
0.728
øP
3.55
3.65
0.140
0.143
øR
4.50
5.50
0.177
0.216
S
5.50
0.216
7/9
Revision history
5
STW55NM60ND
Revision history
Table 8.
8/9
Document revision history
Date
Revision
16-Nov-2007
1
Changes
First release.
STW55NM60ND
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
9/9