DYNEX RD65FV04

RD65FV
RD65FV
Rectifier Diode
Target Information
Replaces November 2000, version DS5408-1.1
DS5408-2.0 October 2001
FEATURES
KEY PARAMETERS
■
Optimised For High Current Rectifiers
VRRM
■
High Surge Capability
IF(AV)
(max)
11745A
■
Very Low On-state Voltage
IFSM
(max)
162000A
600V
APPLICATIONS
■
Electroplating
■
Power Supplies
■
Welding
VOLTAGE RATINGS
Part and Ordering Repetitive Peak
Number
Reverse Voltage
VRRM
V
RD65FV06
RD65FV05
RD65FV04
RD65FV03
RD65FV02
RD65FV01
600
500
400
300
200
100
Conditions
VRSM = VRRM
Outline type code: V
(See Package Details for further information)
Fig. 1 Package outline
ORDERING INFORMATION
When ordering, select the required part number shown in the
Voltage Ratings selection table.
For example:
RD65FV04
Note: Please use the complete part number when ordering and
quote this number in any future correspondance relating to your
order.
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RD65FV
CURRENT RATINGS
Tcase = 75oC unless otherwise stated
Symbol
Parameter
Conditions
Max.
Units
11745
A
Double Side Cooled
Half wave resistive load
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
18450
A
Continuous (direct) forward current
-
16974
A
7632
A
IF
Single Side Cooled (Anode side)
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
11988
A
Continuous (direct) forward current
-
10079
A
IF
Half wave resistive load
Tcase = 85oC unless otherwise stated
Symbol
Parameter
Test Conditions
Max.
Units
11120
A
Double Side Cooled
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
17500
A
Continuous (direct) forward current
-
16000
A
7200
A
IF
Half wave resistive load
Single Side Cooled
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
11300
A
Continuous (direct) forward current
-
9450
A
IF
Half wave resistive load
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RD65FV
SURGE RATINGS
Symbol
IFSM
I2t
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
Units
130
kA
84.5 x 106
A2s
162
kA
132 x 106
A2s
10ms half sine, Tcase = 175˚C
VR = 50% VRRM - 1/4 sine
Surge (non-repetitive) forward current
Max.
Test Conditions
Parameter
10ms half sine, Tcase = 175˚C
I2t for fusing
VR = 0
THERMAL AND MECHANICAL RATINGS
Symbol
Rth(j-c)
Rth(c-h)
Tvj
Parameter
Thermal resistance - junction to case
Thermal resistance - case to heatsink
Virtual junction temperature
Test Conditions
Min.
Max.
Units
Double side cooled
DC
-
0.0075
˚CW
Single side cooled
Anode DC
-
0.015
˚CW
Cathode DC
-
0.015
˚CW
Double side
-
0.002
˚CW
(with mounting compound) Single side
-
0.004
˚CW
Forward (conducting)
-
225
˚C
Reverse (blocking)
-
200
˚C
Clamping force 43.0kN
Tstg
Storage temperature range
–55
200
˚C
Fm
Clamping force
38.7
47.3
kN
Min.
Max.
Units
CHARACTERISTICS
Symbol
Parameter
Test Conditions
IRM
Peak reverse current
At VRRM, Tcase = 200˚C
-
150
mA
Irr
Peak reverse recovery current
IF = 2000A, dIRR/dt = 3A/µs,
-
230
A
QS
Total stored charge
Tcase = 200˚C, VR = 100V
-
39
µC
VTO
Threshold voltage
At Tvj = 200˚C
-
0.6
V
rT
Slope resistance
At Tvj = 200˚C
-
0.0225
mΩ
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RD65FV
CURVES
16000
8000
dc
1/2 wave
3 phase
6 phase
7000
14000
6000
12000
Mean power dissipation - (W)
Instantaneous forward current, IF - (A)
Tj = 200˚C
10000
5000
4000
3000
2000
1000
0
0.5
8000
6000
4000
2000
0
0.55
0.6
0.65
0.7
0.75
Instantaneous forward voltage, VF - (V)
0.8
0
2000
4000
6000
Fig. 2 Maximum (limit) forward characteristics
12000
14000
1000
IF
dI/dt
IRM
Max. IRR
1000
100
Max. QS
1.0
10
Reverse recovery current IRR - (A)
Conditions:
Tj = 200˚C
VR = 100V
IF = 2000A
QS
100
0.1
10000
Fig. 3 Power dissipation
10000
Stored charge QS - (µC)
8000
Mean forward current, IF(AV) - (A)
10
100
Rate of decay of forward current dI/dt - (A/µs)
Fig. 4 Maximum stored charge and reverse recovery current vs dI/dt
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RD65FV
0.1
280
I2t = Î2 x t
100
80
200
160
60
120
40
80
20
40
1
10
ms
1
2 3 5
10 20
50
Thermal impedance - ˚C/W
Anode side cooled
I2t value - (A2s x 106)
Peak half sine forward current - (kA)
2
240
0.01
Double side cooled
0.001
0.0001
0.001
Conduction Effective thermal resistance
Junction to case ˚C/W
Double side Anode side
0.0075
0.015
d.c.
0.0085
0.016
Halfwave
0.0092
0.0167
3 phase 120˚
0.0120
0.0194
6 phase 60˚
0.01
0.1
1.0
Time - (s)
10
100
Cycles at 50Hz
Duration
Fig. 5 Surge (non-repetitive) forward current vs time
(with 50% VRRM @ Tcase = 175˚C)
Fig. 6 Maximum (limit) transient thermal impedance
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RD65FV
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Holes Ø3.6 x 2.0 deep (In both electrodes)
Cathode
27.0
25.4
Ø112.5 max
Ø73 nom
Ø73 nom
Anode
Nominal weight: 1100g
Clamping force: 43kN ±10%
Package outine type code: V
Note:
1. Package maybe supplied with pins and/or tags.
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RD65FV
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current
capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution
(PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded
clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance
or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer
Services.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5408-2 Issue No. 2.0 October 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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