TS3L501E www.ti.com SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 16-BIT TO 8-BIT MULTIPLEXER/DEMULTIPLEXER GIGABIT ETHERNET LAN SWITCH WITH POWER DOWN MODE Check for Samples: TS3L501E FEATURES 1 • • • • 10/100/1000 Base-T Signal Switching Differential (LVDS, LVPECL) Signal Switching Audio/Video Switching Hub and Router Signal Switching LED_ B2 LED_ C2 VDD 41 40 39 LED_A2 42 2 37 B1 A1 3 36 C0 VDD 4 35 C1 PD 5 34 B2 A2 6 33 B3 A3 7 32 C2 VDD 8 31 C3 A4 9 30 VDD A5 10 29 B4 A6 11 28 B5 A7 12 27 C4 SEL 13 26 C5 VDD 14 25 B6 LED_A0 15 24 B7 LED_ A1 16 23 C6 LED_ B0 17 22 C7 Exposed Center Pad (GND) 21 APPLICATIONS A0 VDD • B0 19 • 38 20 • • • 1 LED_C1 • VDD LED_C0 • RUA PACKAGE (TOP VIEW) 18 • • Integrated Power Down Mode Wide Bandwidth (BW = 600 MHz Typ) Low Crosstalk (XTALK = –37 dB Typ @ 250 MHz) Low Bit-to-Bit Skew (tsk(o) = 100 ps Max) Low and Flat ON-State Resistance (ron = 4 Ω Typ, ron(flat) = 0.5 Ω Typ) Low Input/Output Capacitance (CON = 9 pF Typ) Rail-to-Rail Switching on Data I/O Ports (0 to 3.6 V) VCC Operating Range From 3 V to 3.6 V Support Power Down Mode Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance (A, B, C, LED pins) – ± 4-kV IEC61000-4-2, Contact Discharge – 6-kV Human Body Model Per JESD22-A114E (Switch I/O pins to GND) ESD Performance (All pins) – 2-kV Human Body Model Per JESD22-A114E LED_B1 • • • The exposed center pad must be connected to GND. DESCRIPTION/ORDERING INFORMATION The TS3L501E is a 16-bit to 8-bit multiplexer/demultiplexer LAN switch with a single select (SEL) input and Power down Mode input. The device provides additional I/Os for switching status indicating LED signals and includes high ESD protection. SEL input controls the data path of the multiplexer/demultiplexer. Power down input can put the device into the standby mode for minimizing current consumption per mode selection. The device provides a low and flat ON-state resistance (Ron) and an excellent ON-state resistance match. Low input/output capacitance, high bandwidth, low skew, and low crosstalk among channels make this device suitable for various LAN applications, such as 10/100/1000 Base-T. This device can be used to replace mechanical relays in LAN applications. It also can be used to route signals from a 10/100 Base-T Ethernet transceiver to the RJ-45 LAN connectors in laptops or in docking stations. It is characterized for operation over the free-air temperature range of –40ºC to 85ºC. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TS3L501E SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com Table 1. ORDERING INFORMATION PACKAGE (1). (2) TA –40°C to 85°C (1) (2) TQFN – RUA Tape and reel ORDERABLE PART NUMBER TS3L501ERUAR TOP-SIDE MARKING TK501E Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. LOGIC DIAGRAM (POSITIVE LOGIC) A0 B0 A1 B1 A2 B2 A3 B3 A4 A5 B4 B5 A6 B6 A7 B7 C0 C1 C2 LED_A0 C3 C4 C5 C6 C7 LED_B0 LED_A1 LED_B1 LED_A2 LED_B2 LED_C0 LED_C1 LED_C2 2 SEL Control Logic PD POWER DOWN Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E TS3L501E www.ti.com SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 FUNCTION TABLE PD SEL FUNCTION L L An to Bn, LED_An to LED_Bn L H An to Cn, LED_An to LED_Cn H X Hi-Z PIN DESCRIPTION NAME DESCRIPTION An Port A DeMux I/O Bn, Cn Port B, C Mux I/O LED_An, LED_Bn, LED_Cn LED Mux I/O SEL Select Input PD Power Down Input, Active High GND Ground VDD Power ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VDD Supply voltage range VIN Control input voltage range (2) –0.5 4.6 V (3) –0.5 7 VI/O Switch I/O voltage range (2) V (3) (4) –0.5 7 V IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA II/O ON-state switch current (5) ±128 mA Continuous current through VDD or GND ±100 mA 51.2 °C/W 150 °C qJA Package thermal impedance Tstg Storage temperature range (1) (2) (3) (4) (5) (6) (6) –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) MIN MAX VDD Supply voltage 3 3.6 V VIH High-level control input voltage (SEL) 2 5.5 V VIL Low-level control input voltage (SEL) 0 0.8 V VIN Input voltage (SEL) 0 5.5 V VI/O Input/output voltage 0 VDD V TA Operating free-air temperature –40 85 °C (1) UNIT All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E 3 TS3L501E SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS for 1000 Base-T Ethernet switching over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIK SEL, PD VDD = 3.6 V, IIN = –18 mA IIH SEL, PD VDD = 3.6 V, IIL SEL, PD IOFF SEL, PD MIN TYP (2) MAX –0.7 UNIT –1.2 V VIN = VDD ±2 mA VDD = 3.6 V, VIN = GND ±1 mA VDD = 0 V, VIN = 0 to 3.6 V ±1 mA ICC VDD = 3.6 V, II/O = 0, Switch ON or OFF 600 mA ICC_PD VDD = 3.6 V, VIN = 3.6 V, PD = High 250 1 CIN SEL, PD f = 1 MHz, VIN = 0 2.6 3.0 pF COFF B or C port VI = 0, f = 1 MHz, Outputs open, Switch OFF 3 4 pF VI = 0, f = 1 MHz, Outputs open, Switch ON 9 9.8 pF VDD = 3 V, 1.5 V ≤ VI ≤ VDD, IO = –40 mA 4 8 Ω VDD = 3 V, VI = 1.5 V and VDD, IO = –40 mA 0.7 VDD = 3 V, 1.5 V ≤ VI ≤ VDD, IO = –40 mA 0.8 CON ron ron(flat) Δron (1) (2) (3) (4) (3) (4) Ω 1.5 Ω VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. ron(flat) is the difference of ron in a given channel at specified voltages. Δron is the difference of ron from center (A4, A5) ports to any other port. ELECTRICAL CHARACTERISTICS for 10/100 Base-T Ethernet switching over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP (2) MAX –0.7 UNIT VIK SEL, PD VDD = 3.6 V, IIN = –18 mA –1.2 V IIH SEL, PD VDD = 3.6 V, VIN = VDD ±2 mA IIL SEL, PD VDD = 3.6 V, VIN = GND ±1 mA IOFF SEL, PD VDD = 0 V, VIN = 0 to 3.6 V ICC VDD = 3.6 V, II/O = 0, Switch ON or OFF ICC_PD VDD = 3.6 V, VIN = 3.6 V, PD = High CIN SEL, PD f = 1 MHz, VIN = 0 COFF B or C port 250 ±1 mA 600 mA 3.0 pF 1 2.6 VI = 0, f = 10 MHz, Outputs open, Switch OFF 3 4 pF CON VI = 0, f = 10 MHz, Outputs open, Switch ON 9 9.8 pF ron VDD = 3 V, 1.25 V ≤ VI ≤ VDD, IO = –10 mA to –30 mA 4 6 Ω VDD = 3 V, VI = 1.25 V and VDD, IO = –10 mA to –30 mA 0.5 VDD = 3 V, 1.25 V ≤ VI ≤ VDD, IO = –10 mA to –30 mA 0.8 ron(flat) Δron (1) (2) (3) (4) 4 (3) (4) Ω 1.5 Ω VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. ron(flat) is the difference of ron in a given channel at specified voltages. Δron is the difference of ron from center (A4, A5) ports to any other port. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E TS3L501E www.ti.com SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) (see Figure 5 and Figure 6) FROM (INPUT) TO (OUTPUT) A or B/C B/C or A tPZH, tPZL SEL A or B/C 0.5 15 ns tPHZ, tPLZ SEL A or B/C 0.9 9 ns PARAMETER tpd (2) (3) (4) (5) TYP (1) MAX 0.3 UNIT ns tsk(o) (3) A or B/C B/C or A 50 100 ps tsk(p) (4) A or B/C B/C or A 50 100 ps PD A or B/C 250 ns tON/tOFF (1) (2) MIN (5) All typical values are at VDD = 3.3 V (unless otherwise noted), TA = 25°C. The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance when driven by an ideal voltage source (zero output impedance). Output skew between center port (A4 to A5) to any other port Skew between opposite transitions of the same output in a given device |tPHL – tPLH| Device enable/disable time from PD DYNAMIC CHARACTERISTICS over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V (unless otherwise noted) PARAMETER UNIT XTALK RL = 50 Ω, f = 250 MHz, See Figure 8 –37 OIRR RL = 50 Ω, f = 250 MHz, See Figure 9 –37 dB 600 MHz BW (1) TYP (1) TEST CONDITIONS See Figure 7 dB All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E 5 TS3L501E SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com OPERATING CHARACTERISTICS -14 -2 -24 -4 -34 Attenuation - dB 0 Gain - dB -6 -8 -10 -44 -54 -64 -12 -74 -14 -84 -16 1.00E+06 10.00E+06 100.00E+06 1.00E+09 f - Frequency - Hz 10.00E+09 -94 1.00E+6 Figure 1. Gain vs Frequency 10.00E+6 100.00E+6 1.00E+9 f - Frequency - Hz 10.00E+9 Figure 2. OFF Isolation vs Frequency 3.5 -19.97 -29.97 3 RON - On-Resistance - W Attenuation - dB -39.97 -49.97 -59.97 -69.97 -79.97 2.5 2 1.5 1 -89.97 0.5 -99.97 -109.97 1.00E+6 10.00E+6 100.00E+6 1.00E+9 f - Frequency - Hz 10.00E+9 0 0 Figure 3. Crosstalk vs Frequency 6 Submit Documentation Feedback 0.5 1 1.5 2 2.5 3 VI - Input Voltage - V 3.5 4 Figure 4. ron (Ω) vs Vcom (V) Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E TS3L501E www.ti.com SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) VDD Input Generator VIN 50 W 50 W VG1 TEST CIRCUIT DUT 2 × VDD Input Generator RL VO VI S1 50 W CL (see Note A) 50 W VG2 RL TEST VDD S1 RL Vin CL VD tPLZ/tPZL 3.3 V 2 × VDD 200 W GND 10 pF 0.3 V tPHZ/tPZH 3.3 V GND 200 W VDD 10 pF 0.3 V VI VO 2.5 V Output Control (VIN) 1.25 V 1.25 V 0V Output Waveform 1 S1 at 2 VDD (see Note B) tPZL tPLZ VOH VDD/2 VOL + 0.3 V tPZH VO Open GND Output Waveform 2 S1 at GND (see Note B) VOL tPHZ VDD/2 VOH - 0.3 V VOH VOL VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 W, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. t PZL and tPZH are the same as ten. Figure 5. Test Circuit and Voltage Waveforms Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E 7 TS3L501E SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (Skew) VDD Input Generator VIN 50 W 50 W VG1 TEST CIRCUIT DUT 2 × VDD Input Generator RL TEST VDD S1 RL Vin CL tsk(o) 3.3 V ± 0.3 V Open 200 W VDD or GND 10 pF tsk(p) 3.3 V ± 0.3 V Open 200 W VDD or GND 10 pF 3.5 V 2.5 V 1.5 V Data In at Ax or Ay tPLHx tPHLx VOH (VOH + VOL)/2 VOL Data Out at XB1 or XB2 tsk(o) VO CL (see Note A) 50 W VG2 VO Open GND 50 W VI RL VO VI S1 2.5 V 1.5 V Input tsk(o) VOH (VOH + VOL)/2 VOL Data Out at YB1 or YB2 tPLHy 3.5 V tPHLy tPLH VOH (VOH + VOL)/2 VOL Output tsk(o) = t PLHy - t PLHx or t PHLy - t PHLx VOLTAGE WAVEFORMS OUTPUT SKEW (tsk(o)) tPHL tsk(p) = t PHL - t PLH VOLTAGE WAVEFORMS PULSE SKEW [tsk(p)] NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR≤ 10 MHz, ZO = 50 W, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 6. Test Circuit and Voltage Waveforms 8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E TS3L501E www.ti.com SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD 0B1 A0 SEL DUT CL = 10 pF (see Note A) VSEL A. CL includes probe and jig capacitance. Figure 7. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 and A0 is the input, the output is measured at 0B1. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E 9 TS3L501E SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD A0 0B1 RL = 50 W A1 1B1 0B2 DUT A2 1B2 2B1 RL = 50 W A3 3B1 2B2 3B2 SEL VSEL A. CL includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. Figure 8. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSEL = 0 and A1 is the input, the output is measured at A3. All unused analog input (A) ports are connected to GND, and output (B) ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 10 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E TS3L501E www.ti.com SCDS307A – SEPTEMBER 2010 – REVISED SEPTEMBER 2010 PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD A0 0B1 RL = 50 W A1 1B1 DUT 0B2 1B2 SEL VSEL A. CL includes probe and jig capacitance. B. A 50-Ω termination resistor is needed to match the loading of the network analyzer. Figure 9. Test Circuit for OFF Isolation (OIRR) OFF isolation is measured at the output of the OFF channel. For example, when VSEL = GND and A1 is the input, the output is measured at 1B2. All unused analog input (A) ports are connected to ground, and output (B) ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TS3L501E 11 PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2010 PACKAGING INFORMATION Orderable Device TS3L501ERUAR Status (1) ACTIVE Package Type Package Drawing WQFN RUA Pins Package Qty 42 3000 Eco Plan TBD (2) Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) Call TI Purchase Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated