IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 IXDI402PI / I402SI / I402SI-16 2 Ampere Dual Low-Side Ultrafast MOSFET Drivers Features General Description • Built using the advantages and compatibility of CMOS and IXYS HDMOSTM processes • Latch-Up Protected Over Entire Operating Range • High Peak Output Current: 2A Peak • Wide Operating Range: 4.5V to 25V • High Capacitive Load Drive Capability: 1000pF in <10ns • Matched Rise And Fall Times • Low Propagation Delay Time • Low Output Impedance • Low Supply Current • Two Drivers in Single Chip The IXDN402/IXDI402/IXDF402 consists of two 2 Amp CMOS high speed MOSFET drivers. Each output can source and sink 2A of peak current while producing voltage rise and fall times of less than 15ns to drive the latest IXYS MOSFETs & IGBTs. The input of the driver is TTL or CMOS compatible and is fully immune to latch up over the entire operating range. A patent-pending circuit virtually eliminates cross conduction and current shoot-through. Improved speed and drive capabilities are further enhanced by very low and matched rise and fall times. Applications • • • • • • • • • The IXDN402 is configured as a dual non-inverting gate driver, the IXDI402 as a dual inverting gate driver, and the IXDF402 as a dual inverting + non-inverting gate driver. The IXDN402/IXDI402/IXDF402 family are available in the standard 8 pin P-DIP (PI), SOP-8 (SI) and SOP-16 (SI-16) packages respectively. Driving MOSFETs and IGBTs Motor Controls Line Drivers Pulse Generators Local Power ON/OFF Switch Switch Mode Power Supplies (SMPS) DC to DC Converters Pulse Transformer Driver Class D Switching Amplifiers Ordering Information Part Number IXDN402PI IXDN402SI IXDN402SI-16 IXDI402PI IXDI402SI IXDI402SI-16 IXDF402PI IXDF402SI IXDF402SI-16 Package Type 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC Temp. Range Configuration -40°C to +85°C Dual Non Inverting -40°C to +85°C Dual Inverting -40°C to +85°C Inverting + Non Inverting NOTE: Mounting or solder tabs on all packages are connected to ground Copyright © IXYS CORPORATION 2002 First Release IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 IXDN402PI / N402SI / N402SI-16 Figure 1 - IXDN402 Dual 2A Non-Inverting Gate Driver Functional Block Diagram Vcc P ANTI-CROSS CONDUCTION CIRCUIT * IN A OUT A N P ANTI-CROSS CONDUCTION CIRCUIT * IN B OUT B N GND Figure 2 - IXDI402 Dual Inverting 2A Gate Driver Functional Block Diagram Vcc P ANTI-CROSS CONDUCTION CIRCUIT * IN A OUT A N P ANTI-CROSS CONDUCTION CIRCUIT * IN B OUT B N GND Figure 3 - IXDF402 Inverting + Non-Inverting 2A Gate Driver Functional Block Diagram Vcc P IN A ANTI-CROSS CONDUCTION CIRCUIT * OUT A N P IN B ANTI-CROSS CONDUCTION CIRCUIT * GND * Patent Pending 2 OUT B N IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 Absolute Maximum Ratings (Note 1) Parameter Supply Voltage All Other Pins Junction Temperature Storage Temperature Lead Temperature (10 sec) IXDN402PI / N402SI / N402SI-16 Operating Ratings Parameter Operating Temperature Range Value 25 V -0.3 V to VCC + 0.3 V 150 oC Value -40 oC to 85 oC Thermal Impedance (To Ambient) 8 Pin PDIP (PI) (θJA) 8 Pin SOIC (SI) (θJA) -65 oC to 150 oC 300 oC 16 Pin SOIC (SI-16) (θJA) 210 oC/W 190 oC/W 190 oC/W Electrical Characteristics Unless otherwise noted, TA = 25 oC, 4.5V ≤ VCC ≤ 25V . All voltage measurements with respect to GND. IXDD402 configured as described in Test Conditions. All specifications are for one channel. Symbol Parameter VIH High input voltage VIL Low input voltage VIN Input voltage range IIN Input current VOH High output voltage VOL Low output voltage ROH Output resistance @ Output high Output resistance @ Output Low Peak output current ROL IPEAK IDC Test Conditions Min Max 3 0V ≤ VIN ≤ VCC Units V 2.4 V -5 VCC + 0.3 V -10 10 µA VCC - 0.025 V 0.025 V VCC = 18V 3.7 4 Ω VCC = 18V 2.5 3 Ω VCC is 18V 2 tR Continuous output current Rise time CL=1000pF Vcc=18V 7 tF Fall time CL=1000pF Vcc=18V tONDLY VCC On-time propagation delay Off-time propagation delay Power supply voltage ICC Power supply current VIN = 3.5V VIN = 0V VIN = + VCC tOFFDLY Typ A 1 A 8 10 ns 7 8 9 ns CL=1000pF Vcc=18V 27 28 32 ns CL=1000pF Vcc=18V 25 26 30 ns 4.5 18 25 V 1 0 3 10 10 mA µA µA Specifications Subject To Change Without Notice 3 IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 IXDN402PI / N402SI / N402SI-16 Pin Description SYMBOL IN A FUNCTION A Channel Input GND Ground IN B B Channel Input OUT B B Channel Output VCC Supply Voltage OUT A A Channel Output DESCRIPTION A Channel Input signal-TTL or CMOS compatible. The system ground pin. Internally connected to all circuitry, this pin provides ground reference for the entire chip. This pin should be connected to a low noise analog ground plane for optimum performance. B Channel Input signal-TTL or CMOS compatible. B Channel Driver output. For application purposes, this pin is connected via a resistor to a gate of a MOSFET/IGBT. Positive power-supply voltage input. This pin provides power to the entire chip. The range for this voltage is from 4.5V to 25V. A Channel Driver output. For application purposes, this pin is connected via a resistor to a gate of a MOSFET/IGBT. CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when handling and assembling this component. Note 1: Operating the device beyond the parameters listed as “Absolute Maximum Ratings” may cause permanent damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Figure 4 - Characteristics Test Diagram Vcc 10uF 25V 1 NC 2 In A 3 Gnd 4 In B NC 8 7 Out A Vcc 6 Out B 5 Agilent 1147A Current Probe 1000 pF 4 Agilent 1147A Current Probe 1000 pF IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 IXDN402PI / N402SI / N402SI-16 Typical Performance Characteristics Fig. 3 Output Rise Time vs. Supply Voltage CL = 100pF to 6800pF Fig. 4 Output Fall Time vs. Supply Voltage CL = 100pF to 6800pF 60 90 80 50 Fall Time (ns) 70 Rise Time (ns) 60 6800 pF 50 40 30 40 6800 pF 30 20 3900 pF 3900 pF 2200 pF 20 2200 pF 10 10 1000 pF 470 pF 100 pF 1000 pF 470 pF 100 pF 0 8 10 12 14 16 0 8 18 10 12 Supply Voltage (V) Fig. 5 14 16 18 Supply Voltage (V) Output Rise And Fall Times vs. Case Temperature CL = 1000pF, Vcc = 18V Fig. 6 Output Rise Times vs. Load Capacitance 90 12 80 8V 10 tR Rise Time (ns) Time (ns) 8 tF 6 4 70 10V 60 12V 14V 16V 18V 50 40 30 20 2 10 0 -60 0 -40 -20 0 20 40 60 80 100 120 0 140 1000 2000 4000 5000 6000 7000 Load Capacitance (pF) Temperature (C) Fig. 7 Max / Min Input vs. Temperature CL = 1000 pF Vcc = 18V Fig. 8 Output Fall Times vs. Load Capacitance 8V 3.5 45 10V 3.3 40 12V 14V 16V 18V 3.1 Max / Min Input Voltage 50 35 Fall Times (ns) 3000 30 25 20 15 10 5 MinimumInput High 2.9 2.7 2.5 MaximumInput Low 2.3 2.1 1.9 1.7 1.5 -60 0 0 1000 2000 3000 4000 5000 6000 7000 Load Capacitance (pF) -40 -20 0 20 40 60 Temperature (C) 5 80 100 120 140 IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 Fig. 9 Supply Current vs. Load Capacitance Vcc = 18V IXDN402PI / N402SI / N402SI-16 Supply Current vs. Frequency Vcc = 18V Fig. 10 1 MHz 1000 100 2 MHz 6800 pF 3900 pF 2200 pF 1000 pF 470 pF 100 pF 90 100 70 Supply Current (mA) Supply Current (mA) 80 500 kHz 60 50 40 30 10 1 0.1 20 100 kHz 10 0 100 50 kHz 10 kHz 1000 0.01 1 10000 10 100 Fig. 12 Supply Current vs. Load Capacitance Vcc = 12V 2 MHz 6800 pF 3900 pF 2200 pF 1000 pF 470 pF 100 pF 100 Supply Current (mA) Supply Current (mA) Supply Current vs. Frequency Vcc = 12V 1 Mhz 80 70 60 50 500 kHz 40 30 20 10 1 0.1 100 kHz 50 kHz 10 kHz 10 1000 0.01 10000 1 10 Load Capacitance (pF) Fig. 13 10000 1000 90 0 100 1000 Frequency (kHz) Load Capacitance (pF) Fig. 11 100 Supply Current vs. Load Capacitance Vcc = 8V 100 1000 10000 Frequency (kHz) Supply Current vs. Frequency Vcc = 8V Fig. 14 2 MHz 100 1000 90 70 60 1 MHz 50 40 500 kHz 30 10 1 0.1 20 10 0 100 6800 pF 3900 pF 2200 pF 1000 pF 470 pF 100 pF 100 Supply Current (mA) Supply Current (mA) 80 100 kHz 50 kHz 10HkHz 1000 0.01 1 10000 Load Capacitance (pF) 10 100 Frequency (kHz) 6 1000 10000 IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 Propagation Delay vs. Supply Voltage CL=1000 pF Vin=5V@1KHz Propagation Delay vs. Input Voltage CL = 1000 pF Vcc = 15V Fig. 16 45 50 40 45 35 Propagation Delay (ns) Propagation Delay (ns) Fig. 15 IXDN402PI / N402SI / N402SI-16 tONDLY 30 tOFFDLY 25 20 15 10 40 tONDLY 35 30 25 tOFFDLY 20 15 10 5 5 0 0 8 10 12 14 16 18 2 3 4 5 6 Supply Voltage (V) Fig. 17 8 9 10 11 12 120 140 Quiescent SupplyCurrent vs. Temperature Vcc = 18V, Vin=5V@1kHz, CL = 1000pF Fig. 18 Propagation Delay Times vs. Temperature CL = 1000pF, Vcc = 18V 40 Quiescent Vcc Input Current (mA) 0.8 35 tONDLY 30 Time (ns) 7 Input Voltage (V) tOFFDLY 25 20 15 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -60 10 -60 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 Temperature (C) Fig. 19 40 60 80 100 Temperature (C) P Channel Output Source Current vs. Temperature Vcc = 18V, CL = 1000 pF N Channel Sink Output Current vs. Temperature Vcc = 18V CL = 1000 pF Fig. 20 4 N Channel Output Current (A) P Channel Output Current (A) 4.5 3.5 3 2.5 2 1.5 1 0.5 0 -60 4 3.5 3 2.5 2 1.5 1 0.5 0 -40 -20 0 20 40 60 80 100 120 -60 140 Temperature (C) -40 -20 0 20 40 60 Temperature (C) 7 80 100 120 140 IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 Fig. 22 Fig. 21 High State Output Resistance vs. Supply Voltage Low State Output Resistance vs. Supply Voltage 4.5 Low State Output Resistance (Ohms) 8 High State Output Resistance (Ohms) IXDN402PI / N402SI / N402SI-16 7 6 5 4 3 2 1 4 3.5 3 2.5 2 1.5 1 0.5 0 0 7 9 11 13 15 17 19 21 23 25 7 9 11 Supply Voltage (V) 15 17 19 21 23 25 23 25 Supply Voltage (V) Fig. 24 Vcc vs. P Channel Output Current Fig. 23 13 Vcc vs. N Channel Source Output Current 5 0 N Channel Output Current (A P Channel Output Current (A) 4.5 -0.5 -1 -1.5 -2 -2.5 4 3.5 3 2.5 2 1.5 1 -3 0.5 -3.5 0 7 9 11 13 15 17 19 21 23 25 7 Vcc (V) 9 11 13 15 17 Vcc (V) 8 19 21 IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 IXDN402PI / N402SI / N402SI-16 PIN CONFIGURATIONS 1 NC 2 IN A 3 GND 4 INB NC 8 1 NC OUT A 7 2 IN A VS 6 3 GND OUT B 5 4 INB 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDN402 1 NC NC 16 NC 8 1 NC OUT A 7 2 IN A VS 6 3 GND OUT B 5 4 INB 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDI402 1 NC NC 16 NC 8 OUT A 7 VS 6 OUT B 5 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDF402 1 NC NC 16 2 IN A OUT A 15 2 IN A OUT A 15 2 IN A OUT A 15 3 NC OUT A 14 3 NC OUT A 14 3 NC OUT A 14 4 GND VCC 13 4 GND VCC 13 4 GND VCC 13 5 GND VCC 12 5 GND VCC 12 5 GND VCC 12 6 NC OUT B 11 6 NC OUT B 11 6 NC OUT B 11 7 IN B OUT B 10 7 IN B OUT B 10 7 IN B OUT B 10 8 NC NC 9 16 Pin SOIC IXDN402SI-16 8 NC NC 9 16 Pin SOIC IXDI402SI-16 8 NC NC 9 16 Pin SOIC IXDF402SI-16 Supply Bypassing, Grounding Practices And Output Lead inductance GROUNDING In order for the design to turn the load off properly, the IXDN402 must be able to drain this 1.5A of current into an adequate grounding system. There are three paths for returning current that need to be considered: Path #1 is between the IXDN402 and its load. Path #2 is between the IXDN402 and its power supply. Path #3 is between the IXDN402 and whatever logic is driving it. All three of these paths should be as low in resistance and inductance as possible, and thus as short as practical. In addition, every effort should be made to keep these three ground paths distinctly separate. Otherwise, the returning ground current from the load may develop a voltage that would have a detrimental effect on the logic line driving the IXDN402. When designing a circuit to drive a high speed MOSFET utilizing the IXDN402/IXDI402/IXDF402, it is very important to observe certain design criteria in order to optimize performance of the driver. Particular attention needs to be paid to Supply Bypassing, Grounding, and minimizing the Output Lead Inductance. Say, for example, we are using the IXDN402 to charge a 1500pF capacitive load from 0 to 25 volts in 25ns. Using the formula: I= ∆V C / ∆t, where ∆V=25V C=1500pF & ∆t=25ns, we can determine that to charge 1500pF to 25 volts in 25ns will take a constant current of 1.5A. (In reality, the charging current won’t be constant, and will peak somewhere around 2A). OUTPUT LEAD INDUCTANCE Of equal importance to Supply Bypassing and Grounding are issues related to the Output Lead Inductance. Every effort should be made to keep the leads between the driver and its load as short and wide as possible. If the driver must be placed farther than 2” (5mm) from the load, then the output leads should be treated as transmission lines. In this case, a twistedpair should be considered, and the return line of each twisted pair should be placed as close as possible to the ground pin SUPPLY BYPASSING In order for our design to turn the load on properly, the IXDN402 must be able to draw this 1.5A of current from the power supply in the 25ns. This means that there must be very low impedance between the driver and the power supply. The most common method of achieving this low impedance is to bypass the power supply at the driver with a capacitance value that is an order of magnitude larger than the load capacitance. Usually, this would be achieved by placing two different types of bypassing capacitors, with complementary impedance curves, very close to the driver itself. (These capacitors should be carefully selected and should have low inductance, low resistance and high-pulse current-service ratings). Lead lengths may radiate at high frequency due to inductance, so care should be taken to keep the lengths of the leads between these bypass capacitors and the IXDN402 to an absolute minimum. of the driver, and connected directly to the ground terminal of the load. 9 IXDN402PI / N402SI / N402SI-16 IXDF402PI / F402SI / F402SI-16 IXDN402PI / N402SI / N402SI-16 IXYS Corporation 3540 Bassett St; Santa Clara, CA 95054 Tel: 408-982-0700; Fax: 408-496-0670 e-mail: [email protected] www.ixys.com IXYS Semiconductor GmbH Edisonstrasse15 ; D-68623; Lampertheim Tel: +49-6206-503-0; Fax: +49-6206-503627 e-mail: [email protected] Directed Energy, Inc. An IXYS Company 2401 Research Blvd. Ste. 108, Ft. Collins, CO 80526 Tel: 970-493-1901; Fax: 970-493-1903 e-mail: [email protected] www.directedenergy.com 10 Doc #9200-0254 R1