NEC UPA1914TE

DATA SHEET
MOS FIELD EFFECT TRANSISTOR
µ PA1914
P-CHANNEL MOS FIELD EFFECT TRANSISTOR
FOR SWITCHING
PACKAGE DRAWING (Unit : mm)
DESCRIPTION
FEATURES
0.16+0.1
–0.06
+0.1
0.65–0.15
0.32 +0.1
–0.05
• Can be driven by a 4 V power source
• Low on-state resistance
RDS(on)1 = 57 mΩ MAX. (VGS = –10 V, ID = –2.5 A)
RDS(on)2 = 86 mΩ MAX. (VGS = –4.5 V, ID = –2.5 A)
RDS(on)3 = 96 mΩ MAX. (VGS = –4.0 V, ID = –2.5A)
6
5
4
1
2
3
1.5
2.8 ±0.2
The µPA1914 is a switching device which can be driven
directly by a 4 V power source.
The µPA1914 features a low on-state resistance and excellent
switching characteristics, and is suitable for applications such
as power switch of portable machine and so on.
0 to 0.1
0.95
0.65
0.95
1.9
0.9 to 1.1
2.9 ±0.2
1, 2, 5, 6 : Drain
3
: Gate
4
: Source
ORDERING INFORMATION
PART NUMBER
PACKAGE
µPA1914TE
6-pin Mini Mold (Thin Type)
EQUIVALENT CIRCUIT
Drain
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage
VDSS
–30
V
Gate to Source Voltage
VGSS
±20
V
Drain Current (DC)
ID(DC)
±4.5
A
ID(pulse)
±18
A
PT1
0.2
W
PT2
2
W
Channel Temperature
Tch
150
°C
Storage Temperature
Tstg
–55 to +150
°C
Drain Current (pulse)
Note1
Total Power Dissipation
Total Power Dissipation
Note2
Body
Diode
Gate
Gate
Protection
Diode
Source
Marking: TF
Notes 1. PW ≤ 10 µs, Duty Cycle ≤ 1 %
2. Mounted on FR-4 Board, t ≤ 5 sec.
Remark
The diode connected between the gate and source of the transistor serves as a protector against ESD.
When this device actually used, an additional protection circuit is externally required if a voltage
exceeding the rated voltage may be applied to this device.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No.
D13810EJ1V0DS00 (1st edition)
Date Published June 1999 NS CP(K)
Printed in Japan
©
1998, 1999
µ PA1914
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
CHARACTERISTICS
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Zero Gate Voltage Drain Current
IDSS
VDS = –30 V, VGS = 0 V
–10
µA
Gate Leakage Current
IGSS
VGS = ±16 V, VDS = 0 V
±10
µA
VGS(off)
VDS = –10 V, ID = –1 mA
–1.0
–1.6
–2.5
V
| yfs |
VDS = –10 V, ID = –2.5 A
1
7.1
RDS(on)1
VGS = –10 V, ID = –2.5 A
43
57
mΩ
RDS(on)2
VGS = –4.5 V, ID = –2.5 A
58
86
mΩ
RDS(on)3
VGS = –4.0 V, ID = –2.5 A
64
96
mΩ
Gate Cut-off Voltage
Forward Transfer Admittance
Drain to Source On-state Resistance
S
Input Capacitance
Ciss
VDS = –10 V
589
pF
Output Capacitance
Coss
VGS = 0 V
210
pF
Reverse Transfer Capacitance
Crss
f = 1 MHz
86
pF
Input Capacitance
Ciss
VDS = –25 V
546
pF
Output Capacitance
Coss
VGS = 0 V
148
pF
Reverse Transfer Capacitance
Crss
f = 1 MHz
65
pF
Turn-on Delay Time
td(on)
VDD = –15 V
16
ns
tr
ID = –2.5 A
57
ns
VGS(on) = –10 V
63
ns
tf
RG = 10 Ω
80
ns
Total Gate Charge
QG
VDD= –24 V
11
nC
Gate to Source Charge
QGS
ID = –4.5 A
1.5
nC
Gate to Drain Charge
QGD
VGS = –10 V
2.8
nC
Rise Time
Turn-off Delay Time
td(off)
Fall Time
Diode Forward Voltage
VF(S-D)
IF = 4.5 A, VGS = 0 V
0.88
V
Reverse Recovery Time
trr
IF = 4.5 A, VGS = 0 V
22
ns
Reverse Recovery Charge
Qrr
di/dt = 100 A/µs
11
nC
TEST CIRCUIT 1 SWITCHING TIME
TEST CIRCUIT 2 GATE CHARGE
D.U.T.
D.U.T.
RL
RG
RG = 10 Ω
PG.
VGS
VGS
Wave Form
0
PG.
90 %
90 %
ID
VGS
0
ID
10 %
0 10 %
Wave Form
τ
τ = 1µ s
Duty Cycle ≤ 1 %
tr
td(on)
ton
RL
50 Ω
VDD
90 %
VDD
ID
2
VGS(on)
10 %
IG = 2 mA
td(off)
tf
toff
Data Sheet D13810EJ1V0DS00
µ PA1914
TYPICAL CHARACTERISTICS (TA = 25°C)
FORWARD BIAS SAFE OPERATING AREA
DERATING FACTOR OF FORWARD BIAS
SAFE OPERATING AREA
−100
80
ID - Drain Current - A
dT - Derating Factor - %
100
60
40
20
0
30
60
90
120
TA - Ambient Temperature - ˚C
−10
V
(@
PW
PW
−1
−0.1
PW
PW
ID (DC)
=1
0
=1
ms
ms
=1
00
ms
=5
s
Single Pulse
2
Mounted on 250mm x 35µm Copper Pad
Connected to Drain Electrode in
50mm x 50mm x 1.6mm FR-4 Board
−0.01
−0.1
150
ID (pulse)
d
ite )
im 10 V
−
)L
on =
S(
RD GS
−1
−10
−100
VDS - Drain to Source Voltage - V
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
TRANSFER CHARACTERISTICS
−100
VGS = −10 V
VGS = −4.5 V
−12
−8
VDS = −10 V
−10
VGS = −20 V
−16
VGS = −4.0 V
−4
ID - Drain Current - A
ID - Drain Current - A
−20
−1
−0.1
TA = 125˚C
TA = 75˚C
−0.01
TA = 25˚C
TA = −25˚C
−0.001
−0.0001
0
0.0
−0.2
−0.6
−0.4
−0.8
−1.0
−0.00001
−0.5
−1.0
GATE TO SOURCE CUT-OFF VOLTAGE vs.
CHANNEL TEMPERATURE
VDS = −10 V
ID = − 1 mA
100
−1.5
−1.0
−50
0
50
100
−2.0
−2.5
−3.0
−3.5
−4.0
FORWARD TRANSFER ADMMITTANCE Vs.
DRAIN CURRENT
| yfs | - Forward Transfer Admittance - S
VGS(off) - Gate to Source Cut-off Voltage - V
VDS - Drain to Source Voltage - V
−2.0
−1.5
VGS - Gate to Sorce Voltage - V
150
VDS = −10V
10
TA = −25 ˚C
TA = 25 ˚C
TA = 75 ˚C
TA = 125 ˚C
1
0.1
0.01
−0.01
Tch - Channel Temperature - ˚C
−0.1
−1
−10
−100
ID - Drain Current - A
Data Sheet D13810EJ1V0DS00
3
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
120
VGS = −4.0 V
100
TA = 125˚C
80
TA = 75˚C
TA = 25˚C
60
TA = −25˚C
40
−0.01
−1
−0.1
−10
−100
RDS(on) - Drain to Source On-State Resistance - mΩ
RDS(on) - Drain to Source On-State Resistance - mΩ
µ PA1914
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
100
VGS = −4.5 V
80
TA = 125˚C
TA = 75˚C
60
TA = 25˚C
TA = −25˚C
40
−0.01
60
TA = 125˚C
TA = 75˚C
TA = 25˚C
40
TA = −25˚C
30
−0.01
−0.1
−1
−10
−100
RDS (on) - Drain to Source On-state Resistance - mΩ
RDS(on) - Drain to Source On-State Resistance - mΩ
VGS = −10 V
50
100
ID = −2.5 A
VGS = −4.0 V
80
VGS = −4.5 V
60
VGS = −10 V
40
20
−50
0
50
100
Tch - Channel Temperature -˚C
10000
ID = −2.5 A
80
60
40
f = 1 MHz
VGS = 0V
1000
Ciss
Coss
100
Crss
10
−0.1
−8
−16
−12
−4
VGS - Gate to Source Voltage - V
150
CAPACITANCE vs. DRAIN TO
SOURCE VOLTAGE
Ciss, Coss, Crss - Capacitance - pF
RDS (on) - Drain to Source On-state Resistance - mΩ
4
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
GATE TO SOURCE VOLTAGE
20
0
−100
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
ID - Drain Current - A
100
−10
ID - Drain Current - A
DRAIN TO SOURCE ON-STATE RESISTANCE vs.
CHANNEL TEMPERATURE
70
−1
−0.1
ID - Drain Current - A
−20
Data Sheet D13810EJ1V0DS00
−1
−10
VDS - Drain to Source Voltage - V
−100
µ PA1914
SWITCHING CHARACTERISTICS
SOURCE TO DRAIN DIODE FORWARD VOLTAGE
100
IF - Source to Drain Current - A
td(on), tr, td(off), tf - Swwitchig Time - ns
1000
tr
tf
100
td(off)
td(on)
10
VDD = −15V
VGS(on) = −10V
RG = 10Ω
1
−0.1
−1
ID - Drain Current - A
10
1
0.1
0.01
0.4
−10
0.6
0.8
1.0
1.2
VF(S-D) - Source to Drain Voltage - V
DYNAMIC INPUT CHARACTERISTICS
ID = −4.5 A
10
VDD = −24 V
−15 V
−6 V
8
6
4
2
0
0
2
4
6
8
10
12
Qg - Gate Charge - nC
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH
1000
rth(ch-A) - Transient Thermal Resistance - ˚C/W
VGS - Gate to Source Voltage - V
12
Without Board
100
Mounted on 250mm2 x 35 µm
Copper Pad
Connected to Drain Electrode
in 50mm x 50mm x 1.6mm
FR-4 Board Single Pulse
10
1
0.1
0.001
0.01
0.1
1
10
100
1000
PW - Pulse Width - S
Data Sheet D13810EJ1V0DS00
5
µ PA1914
[MEMO]
6
Data Sheet D13810EJ1V0DS00
µ PA1914
[MEMO]
Data Sheet D13810EJ1V0DS00
7
µ PA1914
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
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"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8