NEC UPC2926T

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC2918,2925,2926
THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR
★
DESCRIPTION
The µPC2918, 2925 and 2926 are three-terminal low dropout voltage regulators with the 1-A output. The µPC2918
outputs 1.8 V, the µPC2925 outputs 2.5 V and the µPC2926 outputs 2.6 V. Since these regulators use a PNP
transistor for the output stage, they achieve a low dropout voltage of 0.7 V TYP. at IO = 1 A and minimize the power
dissipation of the IC. As a result, these regulators can be used to realize sets with lower voltage and power
dissipation.
PIN CONFIGURATION (Marking Side)
FEATURES
• Output current capacity: 1 A
• Low dropout voltage (VDIF = 0.5 V MAX. (at IO = 0.5 A))
4
• Output voltage accuracy: ±2%
• On-chip saturation protector rising edge of input voltage
1
(at low input voltage)
• On-chip overcurrent limiter and thermal protection
2
3
1: INPUT
2: GND
3: OUTPUT
4: GND (Fin)
• On-chip output transistor safe operation area protection
BLOCK DIAGRAM
Saturation protection
Error
Amp.
Safe operation
area protection
Drive circuit
Thermal shut down
Reference voltage
circuit
Startup circuit
INPUT
OUTPUT
Overcurrent
protection
GND
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G14983EJ3V0DS00 (3rd edition)
Date Published May 2001 NS CP(K)
Printed in Japan
The mark ★ shows major revised points.
©
2000,2001
µPC2918, 2925, 2926
★ ORDERING INFORMATION
Part Number
Package
Marking
Packing Type
µ PC29xxT
MP-3Z (SC-63)
29xx
• Bag stuffing
µ PC29xxT-E1
MP-3Z (SC-63)
29xx
• Embossed-type taping (16mm tape)
• Pin 1 on drawout side
• 2000 pcs/reel
µ PC29xxT-E2
MP-3Z (SC-63)
29xx
• Embossed-type taping (16mm tape)
• Pin 1 at takeup side
• 2000 pcs/reel
µ PC29xxT-T1
MP-3Z (SC-63)
29xx
• Adhesive-type taping (32mm tape)
• Pin 1 on drawout side
• 1500 pcs/reel
µ PC29xxT-T2
MP-3Z (SC-63)
29xx
• Adhesive-type taping (32mm tape)
• Pin 1 at takeup side
• 1500 pcs/reel
µ PC29xxHB
MP-3 (SC-64)
29xx
• Bag stuffing
”xx” mark of the part number and marking columns expresses output voltage.
Example
2
Output Voltage
Part Number
Marking
1.8V
µ PC2918T
2918
2.5V
µ PC2925T
2925
2.6V
µ PC2926T
2926
Data Sheet G14983EJ3V0DS
µPC2918, 2925, 2926
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Symbol
Input Voltage
VIN
Rating
Unit
–0.3 to +20
V
Note
10
Internal Power Dissipation (TC = 25°C)
PT
W
Operating Ambient Temperature
TA
–30 to +85
°C
Operating Junction Temperature
TJ
–30 to +150
°C
Storage Temperature
Tstg
–55 to +150
°C
Thermal Resistance (junction to case)
Rth(J-C)
12.5
°C/W
Thermal Resistance (junction to ambient)
Rth(J-A)
125
°C/W
Note Internally limited. When the operating junction temperature rises over 150°C, the internal circuit shuts down the
output voltage.
Caution If the absolute maximum rating of any of the above parameters is exceeded even momentarily, the
quality of the product may be degraded. In other words, absolute maximum ratings specify the
values exceeding which the product may be physically damaged. Be sure to use the product with
these ratings never exceeded.
★ TYPICAL CONNECTION
D1
µ PC2918, 2925, 2926
INPUT
OUTPUT
+
CIN
COUT
D2
CIN: 0.1 µF or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure
to connect CIN to prevent parasitic oscillation. Use of a film capacitor or other capacitor with excellent voltage and
temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure
that CIN is 0.1 µF or higher for the voltage and temperature range to be used.
COUT: 10 µF or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place
CIN and COUT as close as possible to the IC pins (within 2 cm). Also, use an electrolytic capacitor with low
impedance characteristics if considering use at sub-zero temperatures.
D1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode.
D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode.
Caution Make sure that no voltage is applied to the OUTPUT pin from external.
Data Sheet G14983EJ3V0DS
3
µPC2918, 2925, 2926
RECOMMENDED OPERATING CONDITIONS
Parameter
Input Voltage
Symbol
VIN
★
Output Current
Type Number
MIN.
TYP.
MAX.
Unit
µ PC2918
2.8
16
V
µ PC2925
3.5
16
V
µ PC2926
3.6
16
V
IO
All
0
1
A
Operating Ambient Temperature TA
All
− 30
+ 85
°C
Operating Junction Temperature TJ
All
− 30
+ 125
°C
Caution Use of conditions other than the above-listed recommended operating conditions is not a problem
as long as the absolute maximum ratings are not exceeded. However, since the use of such
conditions diminishes the margin of safety, careful evaluation is required before such conditions
are used. Moreover, using the MAX. value for all the recommended operating conditions is not
guaranteed to be safe.
ELECTRICAL CHARACTERISTICS
µPC2918 (TJ = 25°°C, VIN = 2.8 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified)
Parameter
Output Voltage
Symbol
Conditions
VO
2.8 V ≤ VIN ≤ 5 V, 0 A ≤ IO ≤ 1 A,
0°C ≤ TJ ≤ 125°C
MIN.
TYP.
MAX.
Unit
1.764
1.8
1.836
V
(1.854)
V
(1.71)
Line Regulation
REGIN
2.8 V ≤ VIN ≤ 16 V
6
25
mV
Load Regulation
REGL
0 A ≤ IO ≤ 1 A
7
30
mV
Quiescent Current
IBIAS
IO = 0 A
2
4
mA
IO = 1 A
20
60
mA
VIN = 2.4 V, IO = 0 A
10
30
mA
80
mA
Startup Quiescent Current
IBIAS (s)
VIN = 2.4 V, IO = 1 A
Quiescent Current Change
∆IBIAS
2.8 V ≤ VIN ≤ 16 V, 0°C ≤ TJ ≤ 125°C
2.9
Output Noise Voltage
Vn
10 Hz ≤ f ≤ 100 kHz
40
Ripple Rejection
R•R
f = 120 Hz, 2.8 V ≤ VIN ≤ 9 V
Dropout Voltage
VDIF
IO = 0.5 A
Short Circuit Current
IOshort
45
VIN = 2.8 V
VIN = 16 V
Peak Output Current
IOpeak
VIN = 2.8 V
VIN = 16 V
Temperature Coefficient of
Output Voltage
∆VO /∆T
IO = 5 mA, 0°C ≤ TJ ≤ 125°C
dB
0.5
0.7
1.2
1.7
1.5
V
V
3.0
1.2
1.0
mA
µ Vr.m.s.
60
0.25
IO = 1 A, 0°C ≤ TJ ≤ 125°C
20
A
A
3.0
A
1.1
A
− 0.4
mV/°C
Remark Values in parentheses have been measured during product design and are provided as reference values.
4
Data Sheet G14983EJ3V0DS
µPC2918, 2925, 2926
µPC2925 (TJ = 25°°C, VIN = 3.5 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified)
Parameter
Output Voltage
Symbol
Conditions
VO
3.5 V ≤ VIN ≤ 5 V, 0 A ≤ IO ≤ 1 A,
0°C ≤ TJ ≤ 125°C
MIN.
TYP.
2.45
2.5
(2.375)
MAX.
Unit
2.55
V
(2.575)
V
Line Regulation
REGIN
3.5 V ≤ VIN ≤ 16 V
6
25
mV
Load Regulation
REGL
0 A ≤ IO ≤ 1 A
7
30
mV
Quiescent Current
IBIAS
IO = 0 A
2
4
mA
Startup Quiescent Current
IBIAS (s)
IO = 1 A
20
60
mA
VIN = 2.4 V, IO = 0 A
10
30
mA
80
mA
VIN = 3.0 V, IO = 1 A
Quiescent Current Change
∆IBIAS
3.5 V ≤ VIN ≤ 16 V, 0°C ≤ TJ ≤ 125°C
2.9
Output Noise Voltage
Vn
10 Hz ≤ f ≤ 100 kHz
40
Ripple Rejection
R•R
f = 120 Hz, 3.5 V ≤ VIN ≤ 9 V
Dropout Voltage
VDIF
IO = 0.5 A
Short Circuit Current
IOshort
Peak Output Current
IOpeak
45
VIN = 3.5 V
1.7
1.0
1.5
VIN = 16 V
∆VO /∆T
IO = 5 mA, 0°C ≤ TJ ≤ 125°C
V
V
3.0
A
3.0
A
1.2
VIN = 3.5 V
VIN = 16 V
Temperature Coefficient of
Output Voltage
dB
0.5
0.7
1.2
mA
µ Vr.m.s.
60
0.25
IO = 1 A, 0°C ≤ TJ ≤ 125°C
20
A
1.1
A
− 0.5
mV/°C
Remark Values in parentheses have been measured during product design and are provided as reference values.
★ µPC2926 (TJ = 25°°C, VIN = 3.6 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified)
Parameter
Output Voltage
Symbol
Conditions
VO
3.6 V ≤ VIN ≤ 5 V, 0 A ≤ IO ≤ 1 A,
0°C ≤ TJ ≤ 125°C
MIN.
TYP.
MAX.
Unit
2.548
2.6
2.652
V
(2.678)
V
(2.470)
Line Regulation
REGIN
3.6 V ≤ VIN ≤ 16 V
6
25
mV
Load Regulation
REGL
0 A ≤ IO ≤ 1 A
7
30
mV
Quiescent Current
IBIAS
IO = 0 A
2
4
mA
IO = 1 A
20
60
mA
VIN = 2.4 V, IO = 0 A
10
30
mA
80
mA
Startup Quiescent Current
IBIAS (s)
VIN = 3.0 V, IO = 1 A
Quiescent Current Change
∆IBIAS
3.6 V ≤ VIN ≤ 16 V, 0°C ≤ TJ ≤ 125°C
2.9
Output Noise Voltage
Vn
10 Hz ≤ f ≤ 100 kHz
40
Ripple Rejection
R•R
f = 120 Hz, 3.6 V ≤ VIN ≤ 9 V
Dropout Voltage
VDIF
IO = 0.5 A
Short Circuit Current
IOshort
Peak Output Current
IOpeak
45
VIN = 3.6 V
1.7
1.0
1.5
VIN = 16 V
VIN = 3. 6 V
VIN = 16 V
Temperature Coefficient of
Output Voltage
∆VO /∆T
IO = 5 mA, 0°C ≤ TJ ≤ 125°C
dB
0.5
0.7
1.2
mA
µ Vr.m.s.
60
0.25
IO = 1 A, 0°C ≤ TJ ≤ 125°C
20
V
V
3.0
A
3.0
A
1.2
A
1.1
A
− 0.5
mV/°C
Remark Values in parentheses have been measured during product design and are provided as reference values.
Data Sheet G14983EJ3V0DS
5
µPC2918, 2925, 2926
TYPICAL CHARACTERISTICS (Reference Values)
∆VO vs. TJ
PD vs. TA
12
50
∆VO - Output Voltage Deviation - mV
PD - Total Power Dissipation - W
IO = 5 mA
W
10
ith
in
fin
ite
8
he
at
sin
k
6
4
Without
2
heatsink
1.0
0
0
50
100
25
0
µPC2918
µPC2925
–25
–50
–50
150
TA - Operating Ambient Temperature - °C
VO vs. VIN (µPC2918)
100
150
50
TJ = 25˚C
IO = 5 mA
TJ = 25˚C
IBIAS - Quiescent Current - mA
IO = 0.5 A
VO - Output Voltage - V
50
IBIAS (IBIAS(s)) vs. VIN (µPC2918)
2.0
1.5
0
TJ - Operating Junction Temperature - °C
IO = 1 A
1.0
0.5
40
30
20
IO = 1 A
10
IO = 0.5 A
IO = 0 A
0
0
0
1
2
3
4
5
6
7
0
8
5
VIN - Input Voltage - V
15
20
VIN - Input Voltage - V
IBIAS (IBIAS(s)) vs. VIN (µPC2925)
VO vs. VIN (µPC2925)
3.0
50
TJ = 25˚C
IBIAS - Quiescent Current - mA
TJ = 25˚C
IO = 5 mA
VO - Output Voltage - V
10
IO = 0.5 A
2.0
IO = 1 A
1.0
40
30
20
IO = 1 A
10
IO = 0.5 A
IO = 0 A
0
0
0
1
2
3
4
5
6
7
8
6
0
5
10
15
VIN - Input Voltage - V
VIN - Input Voltage - V
Data Sheet G14983EJ3V0DS
20
µPC2918, 2925, 2926
VDIF vs. TJ
IOpeak vs. VDIF (µPC2918)
2.5
IOpeak - Peak Output Current - A
VDIF - Dropout Voltage - V
1
0.8
0.6
0.4
0.2
2
TJ = 0˚C
TJ = 25˚C
1.5
TJ = 125˚C
1
0.5
IO = 1 A
0
–25
0
25
50
75
100
125
0
150
0
5
TJ - Operating Junction Temperature - °C
10
20
.
IOpeak vs. VDIF (µPC2925)
R R vs. f
2.5
70
TJ = 25˚C
IO = 1 A
60
2
R R - Ripple Rejection - dB
IOpeak - Peak Output Current - A
15
VDIF - Dropout Voltage - V
TJ = 0˚C
TJ = 25˚C
1.5
TJ = 125˚C
1
.
0.5
µPC2918
50
µPC2925
40
30
20
10
0
10
0
0
5
10
15
20
100
1000
10000
100000
f - Frequency - Hz
VDIF - Dropout Voltage - V
.
R R vs. IO
VDIF vs. IO
80
1
.
70
VDIF - Dropout Voltage - V
R R - Ripple Rejection - dB
TJ = 25˚C
µPC2925
60
µPC2918
50
40
TJ = 25˚C, f = 120 Hz
2.8 V < VIN < 9 V (µPC2918)
3.5 V < VIN < 9 V (µPC2925)
30
0
0.2
0.4
0.6
0.8
0.8
0.6
0.4
0.2
1
IO - Output Current - A
0
0
0.2
0.4
0.6
0.8
1
IO - Output Current - A
Data Sheet G14983EJ3V0DS
7
µPC2918, 2925, 2926
★
★
VO vs. IO (µPC2918)
VO vs. IO (µPC2925)
3
2
1.8
1.4
VO - Output Voltage - V
VO - Output Voltage - V
VIN = 5 V
2.5
1.6
VIN = 16 V
VIN = 5 V
VIN = 2.8 V
1.2
1
0.8
0.6
0.4
2
VIN = 16 V
1.5
1
VIN = 3.5 V
0.5
0.2
TJ = 25˚C
0
8
0
0.5
1
1.5
IO - Output Current - A
0
2
2.5
Data Sheet G14983EJ3V0DS
TJ = 25˚C
0
0.5
1
1.5
2
IO - Output Current - A
2.5
µPC2918, 2925, 2926
PACKAGE DRAWINGS
MP-3Z (SC-63) (Unit: mm)
2.3±0.2
1.5+0.2
–0.1
6.5±0.2
5.0±0.2
0.5±0.1
3
0.9 MAX.
1.1±0.2
2.3
★
0.5
0.8
2.0 MIN.
2
1.0 MIN.
1.5 TYP.
1
10.0 MAX.
5.5±0.2
4.3 MAX.
4
0.8 MAX.
2.3
0.8
MP-3 (SC-64) (Unit: mm)
1.5 +0.2
−0.1
2.3±0.2
6.5±0.2
5.0±0.2
0.5±0.1
2
3
7.0 MIN.
1
13.7 MIN.
5.5±0.2
1.6±0.2
4
1.1±0.1
0.5 +0.2
−0.1
2.3
0.75
2.3
0.5 +0.2
−0.1
'
Data Sheet G14983EJ3V0DS
9
µPC2918, 2925, 2926
★ RECOMMENDED SOLDERING CONDITIONS
The µPC2918, 2925 and 2926 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact our sales representative.
Type of Surface Mount Device
µPC2918T, µPC2925T, µPC2926T: MP-3Z(SC-63)
Process
Infrared Ray Reflow
Conditions
Peak temperature: 235°C or below (Package surface temperature),
Symbol
IR35-00-3
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 times or less.
Vapor Phase Soldering
Peak temperature: 215°C or below (Package surface temperature),
VP15-00-3
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 times or less.
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Partial Heating Method
Pin temperature: 300°C or below,
–
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µPC2918HB, µPC2925HB, µPC2926HB: MP-3(SC-64)
Process
Conditions
Wave Soldering
Solder temperature: 260°C or below,
(only to leads)
Flow time: 10 seconds or less
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
10
Data Sheet G14983EJ3V0DS
µPC2918, 2925, 2926
NOTES ON USE
When the µPC2918, 2925, and 2926 are used with an input voltage that is lower than the value indicated in
the recommended operating conditions, a large quiescent current flows through the device due to saturation
of the transistor of the output stage. (Refer to the IBIAS (IBIAS(S)) vs. VIN curves in TYPICAL CHARACTERISTICS).
These products have saturation protector, but a current of up to 80 mA MAX. may flow through the device.
Thus the power supply on the input side must have sufficient capacity to allow this quiescent current to pass
when the device starts up.
REFERENCE DOCUMENTS
Document Name
Usage of Three-Terminal Regulators
Voltage Regulator of SMD
Document No.
User’s Manual
G12702E
Information
G11872E
Semiconductor Device Mounting Technology Manual
Information
SEMICONDUCTOR SELECTION GUIDE - Products and Packages-
Data Sheet G14983EJ3V0DS
C10535E
X13769X
11
µPC2918, 2925, 2926
• The information in this document is current as of May, 2001. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4