DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC3018, 3025
LOW-SATURATION STABILIZED POWER SUPPLY WITH ON/OFF FUNCTION (1 A OUTPUT)
DESCRIPTION
The µPC3018 and 3025 are low-saturation type regulators with an output current of 1 A at respective output voltages of
1.8 and 2.5 V. These regulators are also provided with an ON/OFF function, which reduces the dissipation when there is
no load, making them ideal for systems requiring low power consumption.
PIN CONFIGURATION (Marking Side)
FEATURES
• ON/OFF pin for output control (active-high)
MP-3Z (5 pin), MP-3 (5 pin)
• Output current capacitance: 1 A
1: ON/OFF
2: INPUT
3: GND
4: OUTPUT
5: NC
6: GND (Fin)
• Low minimum voltage difference between input and output
(VDIF = 0.5 V MAX. (when IO = 0.5 A))
6
• Output voltage accuracy: ±2%
• On-chip inrush current protection circuit for when input voltage rises
(when input voltage is low)
• On-chip overcurrent limiter and thermal shutdown circuit
1
• On-chip safe operating area controller
2
3
4
5
ORDERING INFORMATION
Part Number
Package
Marking
MP-3Z (5 pin)
30xx
• In bags
µ PC30xxTJ-E1 MP-3Z (5 pin)
30xx
• 16 mm embossed taping
µ PC30xxTJ
Packing Type
• Pin 1 in tape pull-out direction
• 2000/reel
µ PC30xxTJ-E2 MP-3Z (5 pin)
30xx
• 16 mm embossed taping
• Pin 1 in tape wind-up direction
• 2000/reel
µ PC30xxHB
MP-3 (5 pin)
30xx
• In bags
“xx” in the part number and marking corresponds to the following output voltage.
Example
Output Voltage
Part Number
Marking
1.8 V
µ PC3018TJ
3018
2.5 V
µ PC3025TJ
3025
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G15506EJ2V0DS00 (2nd edition)
Date Published July 2002 NS CP(K)
Printed in Japan
The mark ★ shows major revised points.
©
2001,2002
µPC3018, 3025
BLOCK DIAGRAM
INPUT
Safe operating
area controller
ON/OFF
ON/OFF
circuit
Starter
circuit
Reference
voltage
circuit
Error
amplifier
Driver
Inrush
current
protection
circuit
Thermal
shutdown
circuit
OUTPUT
Overcurrent limiter
GND
2
Data Sheet G15506EJ2V0DS
µPC3018, 3025
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Symbol
Rating
Unit
–0.3 to +20
V
Input Voltage
VIN
ON/OFF pin voltage
VON/OFF
Internal Power Dissipation (TC = 25°C)
PT
10Note
W
Operating Ambient Temperature
TA
–30 to +85
°C
Operating Junction Temperature
TJ
–30 to +150
°C
Storage Temperature
Tstg
–55 to +150
°C
Thermal Resistance (junction to case)
Rth(J-C)
12.5
°C/W
Thermal Resistance (junction to ambient)
Rth(J-A)
125
°C/W
–0.3 to VIN +0.3 V (however, VON/OFF ≤ 20)
Note The total dissipation is limited by an internal circuit. Where TJ > 150°C, an internal protection circuit cuts off the
output.
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge
of suffering physical damage, and therefore the product must be used under conditions that ensure that
the absolute maximum ratings are not exceeded.
TYPICAL CONNECTION
ON/OFF
D1
INPUT
OUTPUT
PC3018, PC3025
+
CIN
COUT
D2
Must be 0.1 µF or more. Determine the capacitance in accordance with the line between the power supply
smoothing circuit and input pin. Be sure to connect this capacitor to prevent abnormal oscillation. Use of a
capacitor with excellent voltage and temperature characteristics, such as a film capacitor, is recommended. Note
that some laminated ceramic capacitors have poor temperature and voltage characteristics. When using a
laminated ceramic capacitor, the capacitance of 0.1 µF or more must be reserved in the voltage and temperature
ranges used.
COUT: Must be 10 µF or more. Be sure to connect this capacitor to prevent oscillation and to improve transient load
stability.
Connect CIN and COUT as close to the IC pins as possible (within 1 to 2 cm). Also, when using the device at 0°C or
less, use an electrolytic capacitor with low impedance characteristics.
D1:
Connect a diode if the voltage on the OUTPUT pin is higher than that on the INPUT pin.
D2:
Connect a Schottky barrier diode if the voltage on the OUTPUT pin is lower than that on the GND pin.
CIN:
Caution
Ensure that voltage is not applied to the OUTPUT pin externally.
Supply VIN and VON/OFF from different power supplies.
Design so that VIN and VON/OFF either rise at the same time or VON/OFF rises after VIN.
Data Sheet G15506EJ2V0DS
3
µPC3018, 3025
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Corresponding Model
MIN.
TYP.
MAX.
Unit
16
V
V
Input Voltage
VIN
µ PC3018
2.8
µ PC3025
3.5
16
ON/OFF Pin Voltage
VON/OFF
All models
0
VIN
Output Current
IO
All models
0
1
A
Operating Ambient Temperature TA
All models
− 30
+ 85
°C
Operating Junction Temperature TJ
All models
− 30
+ 125
°C
Caution
The recommended operating range may be exceeded without causing any problems provided the
absolute maximum ratings are not exceeded. However, if the device is operated in a way that exceeds
the recommended operating conditions, the margin between the actual conditions of use and the
absolute maximum ratings is small, and therefore thorough evaluation is necessary.
The recommended operating conditions do not imply that the device can be used with all values at
their maximum values.
ELECTRICAL CHARACTERISTICS
µPC3018 (TJ = 25°°C, VIN = 2.8 V, VON/OFF = 2.8 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified)
Parameter
Output Voltage
Symbol
Conditions
VO
0°C ≤ TJ ≤ 125°C, 2.8 V ≤ VIN ≤ 5 V,
MIN.
TYP.
1.764
1.8
(1.71)
MAX.
Unit
1.836
V
(1.854)
0 mA ≤ IO ≤ 1 A
Line Regulation
REGIN
2.8 V ≤ VIN ≤ 16 V
6
25
mV
Load Regulation
REGL
0 A ≤ IO ≤ 1 A
7
30
mV
Quiescent Current
IBIAS
IO = 0 A
2
4
mA
IO = 1 A
20
60
VIN = 2.4 V, VON/OFF = 2.0 V, IO = 0 A
10
30
Startup Quiescent Current
IBIAS (s)
VIN = 2.4 V, VON/OFF = 2.0 V, IO = 1 A
Quiescent Current Change
∆IBIAS
0°C ≤ TJ ≤ 125°C, 2.8 V ≤ VIN ≤ 16 V
2.9
Output Noise Voltage
Vn
10 Hz ≤ f ≤ 100 kHz
40
Ripple Rejection
R•R
f = 120 Hz, 2.8 V ≤ VIN ≤ 9 V
Dropout Voltage
VDIF
IO = 0.5 A
0.25
0°C ≤ TJ ≤ 125°C, IO = 1 A
0.7
Short Circuit Current
IOshort
VIN = 2.8 V
(45)
1.2
VIN = 16 V
Peak Output Current
IOpeak
∆VO /∆T
ON Voltage
VON/OFF
OFF Voltage
VON/OFF
ON/OFF Pin Current
ION/OFF
Standby Current
IBIAS (OFF)
60
1.7
dB
0.5
V
3.0
A
A
1.0
1.5
3.0
VIN = 3.3 V
1.0
1.7
3.0
1.1
0°C ≤ TJ ≤ 125°C, IO = 5 mA
− 0.4
mV/°C
2.0
VIN = 2.8 V, VON/OFF = 2.8 V
V
0.8
V
90
µA
VIN = 3.3 V, VON/OFF = 3.3 V
110
VIN = 5 V, VON/OFF = 5 V
160
VON/OFF = 0 V
10
Data Sheet G15506EJ2V0DS
mA
µ Vr.m.s.
VIN = 2.8 V
Remark Values in parentheses are reference values obtained during product design.
4
20
1.2
VIN = 16 V
Temperature Coefficient of
Output Voltage
mA
80
µA
µPC3018, 3025
µPC3025 (TJ = 25°°C, VIN = 3.5 V, VON/OFF = 3.5 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified)
Parameter
Output Voltage
Symbol
Conditions
VO
0°C ≤ TJ ≤ 125°C, 3.5 V ≤ VIN ≤ 5 V,
MIN.
TYP.
2.45
2.5
(2.375)
MAX.
Unit
2.55
V
(2.575)
0 mA ≤ IO ≤ 1 A
Line Regulation
REGIN
3.5 V ≤ VIN ≤ 16 V
6
25
mV
Load Regulation
REGL
0 A ≤ IO ≤ 1 A
7
30
mV
Quiescent Current
IBIAS
IO = 0 A
2
4
mA
Startup Quiescent Current
IBIAS (s)
IO = 1 A
20
60
VIN = 2.4 V, VON/OFF = 2.0 V, IO = 0 A
10
30
VIN = 3.0 V, VON/OFF = 2.0 V, IO = 1 A
Quiescent Current Change
∆IBIAS
0°C ≤ TJ ≤ 125°C, 3.5 V ≤ VIN ≤ 16 V
2.9
Output Noise Voltage
Vn
10 Hz ≤ f ≤ 100 kHz
40
Ripple Rejection
R•R
f = 120 Hz, 3.5 V ≤ VIN ≤ 9 V
Dropout Voltage
VDIF
IO = 0.5 A
Short Circuit Current
IOshort
Peak Output Current
IOpeak
(45)
∆VO /∆T
ON Voltage
VON/OFF
OFF Voltage
VON/OFF
ON/OFF Pin Current
ION/OFF
Standby Current
IBIAS (OFF)
mA
µ Vr.m.s.
dB
0.5
V
3.0
A
A
0.7
1.2
1.7
VIN = 3.5 V
1.0
1.5
3.0
VIN = 5 V
1.0
2.1
3.0
VIN = 16 V
Temperature Coefficient of
Output Voltage
20
60
0.25
0°C ≤ TJ ≤ 125°C, IO = 1 A
VIN = 3.5 V
mA
80
1.2
VIN = 16 V
1.1
0°C ≤ TJ ≤ 125°C, IO = 5 mA
−0.5
mV/°C
2.0
V
0.8
V
VIN = 3.5 V, VON/OFF = 3.5 V
110
µA
VIN = 5 V, VON/OFF = 5 V
160
VON/OFF = 0 V
10
µA
Remark Values in parentheses are reference values obtained during product design.
Data Sheet G15506EJ2V0DS
5
µPC3018, 3025
★ TYPICAL CHARACTERISTICS (Reference Values)
VO vs. VIN ( µPC3018)
PD vs. TA
2.5
TJ = 25˚C
VON/OFF = 2 V
10
W
ith
2.0
VO - Output Voltage - V
PD - Internal Power Consumption - W
12
in
fin
ite
8
he
at
sin
k
6
4
Without
2
IO = 0 A
1.5
IO = 0.5 A
IO = 1.0 A
1.0
0.5
heatsink
1.0
0
0
0
50
100
TA - Operating Ambient Temperature - °C
150
0
1
4
5
6
7
8
IBIAS (IBIAS(s)) vs. VIN ( µ PC3018)
50
TJ = 25˚C
VON/OFF = 2 V
TJ = 25˚C
VON/OFF = 2 V
IBIAS - Quiescent Current - mA
IO = 0 A
VO - Output Voltage - V
3
VIN - Input Voltage - V
VO vs. VIN ( µPC3025)
3.0
2
2.0
IO = 0.5 A
IO = 1.0 A
1.0
40
30
IO = 1.0 A
20
IO = 0.5 A
10
IO = 0 A
0
0
0
1
2
3
4
5
6
7
0
8
5
VIN - Input Voltage - V
IBIAS (IBIAS(s)) vs. VIN ( µ PC3025)
∆VO - Output Voltage Deviation - mV
IBIAS - Quiescent Current - mA
40
30
IO = 1.0 A
20
IO = 0.5 A
10
IO = 0 A
0
6
10
15
VIN - Input Voltage - V
20
VON/OFF = 2 V
TJ = 25˚C
VON/OFF = 2 V
5
15
VO vs. TJ
100
50
0
10
VIN - Input Voltage - V
20
75
50
µPC3025
25
0
µPC3018
–25
–50
–75
–100
–50
–25
0
25
50
75
100
125
TJ - Operating Junction Temperature - °C
Data Sheet G15506EJ2V0DS
150
µPC3018, 3025
VDIF vs. TJ
IOpeak vs. VDIF
1
2.5
TJ = 25˚C
VON/OFF = 2 V
VDIF - Dropout Voltage - V
VDIF - Dropout Voltage - V
µPC3018
0.8
µPC3025
0.6
0.4
0.2
2
µPC3025
µPC3018
1.5
1
0.5
IO = 1.0 A
VON/OFF = 2 V
0
–25
0
0
25
50
75
100
125
150
0
5
TJ - Operating Junction Temperature - °C
R R vs. IO
80
µPC3018
75
µPC3025
R R - Ripple Rejection - dB
R R - Ripple Rejection - dB
70
60
50
40
30
.
20
TJ = 25˚C
IO = 1.0 A
VON/OFF = 2 V
10
70
100
1000
10000
µPC3025
65
60
µPC3018
55
50
45
TJ = 25˚C, f = 120 Hz
µ PC3018: 2.8 V ≤ VIN ≤ 9 V
µ PC3025: 3.5 V ≤ VIN ≤ 9 V
VON/OFF = 2 V
40
35
30
0
10
100000
0
0.2
0.4
0.8
0.6
1
IO - Output Current - A
f - Frequency - Hz
VDIF vs. IO ( µ PC3018)
VDIF vs. IO ( µ PC3025)
1
1
TJ = 25˚C
VON/OFF = 2 V
TJ = 25˚C
VON/OFF = 2 V
0.8
VDIF - Dropout Voltage - V
VDIF - Dropout Voltage - V
20
.
.
R R vs. f
80
.
10
15
VIN - Input Voltage - V
0.6
0.4
0.8
0.6
0.4
0.2
0.2
0
0
0
0.2
0.8
0.4
0.6
IO - Output Current - A
1
0
0.2
0.4
0.6
0.8
1
IO - Output Current - A
Data Sheet G15506EJ2V0DS
7
µPC3018, 3025
VO vs. VON/OFF ( µ PC3025)
VO vs. VON/OFF ( µ PC3018)
3.0
2.0
VO - Output Voltage - V
VO - Output Voltage - V
2.5
1.5
1.0
0.5
VIN = 20 V
IO = 0.5 A
TJ = 25˚C
0
2.0
1.5
1.0
0
0
5
10
15
VIN = 20 V
IO = 0.5 A
TJ = 25˚C
0.5
20
0
10
15
VON/OFF - ON/OFF pin Voltage - V
VON/OFF - ON/OFF pin Voltage - V
8
5
Data Sheet G15506EJ2V0DS
20
µPC3018, 3025
PACKAGE DRAWINGS
MP-3Z (5 pin) (Unit: mm)
2.3±0.2
0.5±0.1
0.9 MAX.
0.5
2.0 MIN.
1.0 MIN.
1.5 TYP.
10.0 MAX.
5.5±0.2
4.3 MAX.
5.0±0.2
1.5+0.2
–0.1
6.5±0.2
0.8 MAX.
1.27 1.27
0.8
'
MP-3 (5 pin) (Unit: mm)
+0.2
0.5±0.1
13.7 MIN.
7.0 MIN.
1.6 }0.2
5.5±0.2
5.0±0.2
2.3±0.2
1.5 –0.1
6.5±0.2
1.27 1.27
0.5
{0.2
|0.1
0.5
{0.2
|0.1
0.75
1.1 }0.1
Data Sheet G15506EJ2V0DS
9
µPC3018, 3025
RECOMMENDED SOLDERING CONDITIONS
The µPC3018, 3025 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact our sales representative.
Type of Surface Mount Device
µPC3018TJ, µPC3025TJ: MP-3Z (5 pin)
Process
Infrared Ray Reflow
Conditions
Peak temperature: 235°C,
Symbol
IR35-00-3
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 times or less.
Vapor Phase Soldering
Peak temperature: 215°C,
VP15-00-3
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 times or less.
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C MAX. (Package surface temperature).
Partial Heating Method
Pin temperature: 300°C or below,
–
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Remark It is recommended to use a rosin-type flux with a low chlorine element (chlorine: 0.2 Wt% or less).
Type of Through-hole Device
µPC3018HB, µPC3025HB: MP-3 (5 pin)
Process
Conditions
Wave Soldering
Solder temperature: 260°C or below,
(only to leads)
Flow time: 10 seconds or less
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
10
Data Sheet G15506EJ2V0DS
µPC3018, 3025
CAUTION ON USE
If the µPC3018 and µPC3025 Series are used with an input voltage that is lower than the recommended
operating conditions, a large circuit current flows because the transistor in the output stage is saturated. The
specification of this characteristic is the circuit operating current at startup, IBIAS
(S).
In this product, the circuit
current flowing at startup is limited by an on-chip inrush current protection circuit, but a circuit current of up to
80 mA may still flow. The power supply on the input side must therefore have sufficient capacitance to handle
this circuit current at startup.
REFERENCE DOCUMENTS
Document Name
Usage of Three-Terminal Regulators
Voltage Regulator of SMD
Document No.
User’s Manual
G12702E
Information
Semiconductor Device Mounting Technology Manual
G11872E
Information
SEMICONDUCTOR SELECTION GUIDE - Products and Packages-
Data Sheet G15506EJ2V0DS
C10535E
X13769X
11
µPC3018, 3025
• The information in this document is current as of July, 2002. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4