PRELIMINARY DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8172TB SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC’s 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conventional µPC8106TB, but operates at higher frequency, higher gain and lower distortion. Consequently this IC is suitable for mobile communications. FEATURES • Recommended operating frequency : fRFout = 0.8 to 2.5 GHz • Higher IP3 : CG = 9.5 dB TYP., OIP3 = +7.5 dBm TYP. @ fRFout = 0.9 GHz • High-density surface mounting : 6-pin super minimold package • Supply voltage : VCC = 2.7 to 3.3 V APPLICATIONS • PCS1900M • 2.4 GHz band transmitter/receiver system (wireless LAN etc.) ORDERING INFORMATION Part Number µPC8172TB-E3 Remark Package Marking 6-pin super minimold C3A Supplying Form • Embossed tape 8 mm wide. • Pin 1, 2, 3 face the tape perforation side. • Qty 3 kpcs/reel. To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC8172TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P14729EJ1V0DS00 (1st edition) Date Published June 2000 N CP(K) Printed in Japan © 2000 µPC8172TB PIN CONNECTIONS 3 2 1 Pin No. Pin Name 1 IFinput 2 GND 3 LOinput 4 PS 5 VCC 6 RFoutput (Bottom View) C3A (Top View) 4 4 3 5 5 2 6 6 1 SERIES PRODUCTS (TA = +25°C, VCC = VPS = VRFout = 3.0 V, ZS = ZL = 50 Ω) CG (dB) ICC (mA) fRFout (GHz) µPC8172TB 9 0.8 to 2.5 µPC8106TB 9 µPC8109TB µPC8163TB Part Number @RF 0.9 GHz Note @RF 1.9 GHz @RF 2.4 GHz 9.5 8.5 8.0 0.4 to 2.0 9 7 − 5 0.4 to.2.0 6 4 − 16.5 0.8 to 2.0 9 5.5 − PO(sat) (dBm) Part Number @RF 0.9 GHz Note OIP3 (dBm) @RF 1.9 GHz @RF 2.4 GHz @RF 0.9 GHz Note @RF 1.9 GHz @RF 2.4 GHz µPC8172TB +0.5 0 −0.5 +7.5 +6.0 +4.0 µPC8106TB −2 −4 − +5.5 +2.0 − µPC8109TB −5.5 −7.5 − +1.5 −1.0 − µPC8163TB +0.5 −2 − +9.5 +6.0 − Note fRFout = 0.83 GHz @ µPC8163TB Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. To know the associated product, please refer to each latest data sheet. BLOCK DIAGRAM (FOR THE µPC8172TB) (Top View) LOinput PS GND VCC RFoutput IFinput 2 Preliminary Data Sheet P14729EJ1V0DS00 µPC8172TB SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEM) Wireless Transceiver Low Noise Tr. DEMOD. RX VCO SW ÷N I Q PLL PLL I 0° Phase shifter TX PA µPC8172TB 90° Q To know the associated products, please refer to each latest data sheet. Preliminary Data Sheet P14729EJ1V0DS00 3 µPC8172TB PIN EXPLANATION Pin No. 1 2 Pin Name IFinput GND Applied Voltage (V) Pin Voltage Note (V) − 1.4 GND − Function and Explanation This pin is IF input to double balanced mixer (DBM). The input is designed as high impedance. The circuit contributes to suppress spurious signal. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. For above reason, double balanced mixer is adopted. GND pin. Ground pattern on the board should be formed as wide as possible. Track Length should be kept as short as possible to minimize ground impedance. − 2.3 VCC 2.7 to 3.3 − Supply voltage pin. 6 RFoutput Same bias as VCC through external inductor − This pin is RF output from DBM. This pin is designed as open collector. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. 4 PS VCC/GND − Power save control pin. Bias controls operation as follows. 3 LOinput 5 Equivalent Circuit 5 6 3 1 Local input pin. Recommendable input level is −10 to 0 dBm. Pin bias 2 VCC 5 Control 4 VCC Operation GND Power Save Note Each pin voltage is measured with VCC = VPS = VRFout = 3.0 V. 4 Preliminary Data Sheet P14729EJ1V0DS00 GND 2 µPC8172TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Rating Unit Supply Voltage VCC TA = +25°C 3.6 V PS pin Input Voltage VPS TA = +25°C 3.6 V Power Dissipation of Package PD Mounted on double-side copperclad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C) 200 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Maximum Input Power Pin +10 dBm RECOMMENDED OPERATING CONDITIONS Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Supply Voltage VCC The same voltage should be applied to pin 5 and 6 2.7 3.0 3.3 V Operating Ambient Temperature TA −40 +25 +85 °C Local Input Level PLOin ZS = 50 Ω (without matching) −10 −5 0 dBm RF Output Frequency fRFout With external matching circuit 0.8 − 2.5 GHz 50 − 400 MHz IF Input Frequency fIFin ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = VRFout = 3.0 V, fIFin = 240 MHz, PLOin = −5 dBm, and VPS ≥ 2.7 V unless otherwise specified) Parameter Symbol Circuit Current Test Conditions Note MIN. TYP. MAX. Unit ICC No Signal 5.5 9.0 13 mA Circuit Current In Power Save Mode ICC(PS) VPS = 0 V − − 2 µA Conversion Gain CG1 fRFout = 0.9 GHz, PIFin = −30 dBm 6.5 9.5 12.5 dB CG2 fRFout = 1.9 GHz, PIFin = −30 dBm 5.5 8.5 11.5 dB CG3 fRFout = 2.4 GHz, PIFin = −30 dBm 5 8.0 11.0 dB Saturated RF Output Power PO(sat)1 fRFout = 0.9 GHz, PIFin = 0 dBm −2.5 +0.5 − dBm PO(sat)2 fRFout = 1.9 GHz, PIFin = 0 dBm −3.5 0 − dBm PO(sat)3 fRFout = 2.4 GHz, PIFin = 0 dBm −4 −0.5 − dBm Note fRFout < fLoin @ fRFout = 0.9 GHz fLoin < fRFout @ fRFout = 1.9 GHz/2.4 GHz Preliminary Data Sheet P14729EJ1V0DS00 5 µPC8172TB OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25°C, VCC = VRFout = 3.0 V, PLOin = −5 dBm, and VPS ≥ 2.7 V unless otherwise specified) Parameter Output Third-Order Distortion Intercept Point OIP31 Power Save Response Time fRFout = 1.9 GHz OIP33 fRFout = 2.4 GHz IIP31 fRFout = 0.9 GHz fIFin1 = 240 MHz fIFin2 = 241 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz Data Unit +7.5 dBm +6.0 dBm +4.0 dBm −2.0 dBm −2.5 dBm IIP32 fRFout = 1.9 GHz IIP33 fRFout = 2.4 GHz −4.0 dBm SSB•NF1 fRFout = 0.9 GHz, fIFin = 240 MHz 9.5 dB SSB•NF2 fRFout = 1.9 GHz, fIFin = 240 MHz 10.4 dB SSB•NF3 fRFout = 2.4 GHz, fIFin = 240 MHz 10.6 dB Rise time TPS(rise) VPS: GND → VCC 1 µs Fall time TPS(fall) VPS: VCC → GND 1.5 µs Note fRFout < fLoin @ fRFout = 0.9 GHz fLoin < fRFout @ fRFout = 1.9 GHz/2.4 GHz 6 Note fRFout = 0.9 GHz OIP32 Input Third-Order Distortion Intercept Point SSB Noise Figure Test Conditions Symbol Preliminary Data Sheet P14729EJ1V0DS00 µPC8172TB TEST CIRCUIT 1 (fRFout = 900 MHz) Strip Line Spectrum Analyzer 100 pF 100 pF 1 pF 6 50 Ω RFoutput IFinput 1 50 Ω 10 nH 5 VCC GND 2 100 pF 1 000 pF Signal Generator 4 PS LOinput Signal Generator 3 50 Ω 1 000 pF VCC 1 µF 68 pF 1 µF TEST CIRCUIT 2 (fRFout = 1.9 GHz) Strip Line Spectrum Analyzer 100 pF 100 pF 6 50 Ω RFoutput IFinput 1 50 Ω 470 nH 2.75 pF 5 VCC GND 2 100 pF 1 000 pF 4 VCC Signal Generator PS LOinput Signal Generator 3 50 Ω 1 000 pF 1 µF 30 pF 1 µF TEST CIRCUIT 3 (fRFout = 2.4 GHz) Strip Line Spectrum Analyzer 100 pF 100 pF 6 50 Ω 1.75 pF RFoutput IFinput 1 50 Ω 470 nH 5 VCC GND 2 100 pF 1 000 pF Signal Generator 4 PS LOinput Signal Generator 3 50 Ω VCC 1 000 pF 1 µF 10 pF 1 µF Preliminary Data Sheet P14729EJ1V0DS00 7 µPC8172TB PACKAGE DIMENSIONS 6-pin super minimold (Unit: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 2.0±0.2 1.25±0.1 8 Preliminary Data Sheet P14729EJ1V0DS00 0.15+0.1 –0 0 to 0.1 0.7 0.9±0.1 0.1 MIN. µPC8172TB NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as wide as possible to keep the minimum ground impedance (to prevent undesired oscillation). (3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. (4) Connect a matching circuit to the RF output pin. (5) The DC cut capacitor must be each attached to the input and output pins. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None IR35-00-3 VPS Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None VP15-00-3 Wave Soldering Soldering bath temperature: 260°C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None WS60-00-1 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per side of device) Note Exposure limit: None − Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Preliminary Data Sheet P14729EJ1V0DS00 9 µPC8172TB [MEMO] 10 Preliminary Data Sheet P14729EJ1V0DS00 µPC8172TB [MEMO] Preliminary Data Sheet P14729EJ1V0DS00 11 µPC8172TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES • The information in this document is current as of June, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. 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