RFMD RF2128PCBA

RF2128
2
MEDIUM POWER LINEAR AMPLIFIER
Typical Applications
• PCS Communication Systems
• Commercial and Consumer Systems
• 2.5GHz ISM Band Applications
• Portable Battery Powered Equipment
2
POWER AMPLIFIERS
• Wireless LANs
Product Description
.315
.305
ü
GaAs MESFET
SiGe HBT
Si CMOS
VCC2 1
GND1 2
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P
Si Bi-CMOS
GaAs HBT
BIAS
CIRCUITS
.180 SQ MAX
Metal lid and base, gold plated
4°MAX
0°MIN
.017
.013
.006
.004
Package Style: SOP-8-C
Features
• Single 3.0V to 6.5V Supply
• 100mW Linear Output Power
• 25dB Small Signal Gain
• 30% Efficiency
• Digitally Controlled Power Down Mode
• 1900MHz to 2500MHz Operation
7 RF OUT
6 RF OUT
S
ee
PD 3
8 VCC1
.017
.013
R
F2
12
.050
.004
.000
8P
1
Optimum Technology Matching® Applied
Si BJT
.057 MAX
.166
SQ
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The RF2128 is a medium-power, high-efficiency, linear
amplifier IC. The device is manufactured on an advanced
Gallium Arsenide Heterojunction Bipolar Transistor (HBT)
process, and has been designed for use as the final RF
amplifier in 2.45GHz ISM applications such as WLAN
and POS terminals. The part also will function as the final
stage in digital PCS phone transmitters requiring linear
amplification operating between 1900MHz and
2200MHz, with over 100mW transmitted power, or as the
driver stage for the RF2125 high power amplifier. A simple power down function is included for TDD operation.
RF IN 4
5 GND 2
PACKAGE BASE
Ordering Information
RF2128
RF2128 PCBA
Medium Power Linear Amplifier
Fully Assembled Evaluation Board
GND
Functional Block Diagram
Rev A3 010112
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
2-85
RF2128
Absolute Maximum Ratings
Parameter
Parameter
Rating
Unit
+7.5
+5.5
125
+12
20:1
-40 to +100
-40 to +85
-40 to +150
VDC
V
mA
dBm
°C
°C
°C
Specification
Min.
Typ.
Max.
Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
Unit
T=25 °C, VCC =5V, VPD =5.0V,
Freq=2400MHz
Two-tone Specification
Power Supply
0
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Voltage
Current
dBm
dBc
dBc
dBc
%
PEP-3dB
POUT =+14dBm for each tone
POUT =+14dBm for each tone
POUT =+14dBm for each tone
V
Voltage supplied to the input; device is “on”
1.2
V
Voltage supplied to the input; device is “off”
65
V
V
mA
mA
µA
VCC
Power Down “OFF”
VPD =0.2V
Ω
dB
+17
-24
-36
-44
36
ad
ed
Power Down “ON”
VCC =5.0V, VPD =5.0V, PIN =-3.0dBm
VCC =6.0V, VPD =5.5V, PIN =0dBm
Maximum output
P
Average Two-Tone Power
IM3
IM5
IM7
Two-Tone Power-Added
Efficiency
Power Down Control
MHz
dBm
dBm
%
dB
dBc
dBc
dB
R
F2
12
1900 to 2500
>+20
>+23
30
25
-25
-22
15
2:1
50
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Frequency Range
Maximum Output Power
Maximum Output Power
Total CW Efficiency
Small-signal Gain
Second Harmonic
Third Harmonic
Isolation
Input VSWR
Input Impedance
Noise Figure
8P
Overall
Current
Condition
5
3.0 to 6.5
50
85
10
Specifications
Operating
Operating Idle
At maximum output power
Power Down
S
ee
POWER AMPLIFIERS
2
Supply Voltage (VCC)
Power Down Voltage (VPD)
DC Supply Current
Input RF Power
Output Load VSWR
Operating Case Temperature
Operating Ambient Temperature
Storage Temperature
2-86
Rev A3 010112
RF2128
3
PD
4
RF IN
5
GND2
6
RF OUT
7
8
RF OUT
VCC1
Pkg
Base
GND
2
POWER AMPLIFIERS
GND1
Interface Schematic
Power supply for the driver stage and interstage matching. External
matching on this pin is required to optimize the gain. The matching on
this port also greatly affects the input impedance. A decoupling capacitor of 330pF is required, together with a series RC for tuning for maximum gain at the desired frequency. See the application information for
details.
Ground connection for the driver stage. Keep traces physically short
and connect immediately to the ground plane for best performance.
Power Down control. When this pin is "low", all circuits are shut off. A
"low" is typical 1.2V or less at room temperature. When this pin is
"high", all circuits are operating normally. A "high" is VCC. If PD is below
VCC, output power and performance will be degraded. This could be
used to obtain some gain control, but results are not guaranteed.
RF Input. This is a 50Ω input, but the actual impedance depends on the
matching provided on pin 1. An external DC blocking capacitor is
required if this port is connected to a DC path to ground.
Ground connection for the output stage. Keep traces physically short
and connect immediately to the ground plane for best performance.
RF Output and power supply for the output stage. Bias for the output
stage needs to be provided on this pin. This can be done through a
quarter-wave microstrip that is RF grounded on the other end. For
matching to 50Ω, an external series microstrip line is required.
Same as pin 6.
8P
2
Description
R
F2
12
Function
VCC2
Power supply for the bias circuits. An external RF bypass capacitor of
22pF is required. Keep the traces to the capacitor as short as possible,
and connect the capacitor immediately to the ground plane.
Ground connection. The backside of the package should be connected
to the ground plane through a short path, i.e., vias under the device
may be required.
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Pin
1
P
Application Schematic
2450MHz
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VCC
1 nF
330 pF
22 pF
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L= 250 mil,
W= 20 mil
1.5 Ω
S
ee
VPD
POWER
DOWN
2.4 pF
1
2
22 pF
15 pF
7
3
6
4
5
6.2 pF
L= 175 mil,
W= 10mil
L = quarter wave,
W= 10mil
8
33 pF
RF IN
Rev A3 010112
BIAS
CIRCUITS
RF OUT
L = 220 mil,
W = 25 mil
PCB materials: FR-4
Thickness: 0.031"
PACKAGE BASE
2-87
RF2128
Evaluation Board Schematic
2450MHz Operation
(Download Bill of Materials from www.rfmd.com.)
2128400 Rev P1
2
P1-1
P1-1
C3
1 nF
C4
330 pF
C2
2.4 pF
L=250 mil,
W=20 mil
P1-3
BIAS
CIRCUITS
1
P1-3
C9
1 nF
7
3
6
5
PACKAGE BASE
50 Ω µ strip
GND
3
VPD
C5
22 pF
L=217 mil, W=26 mil C6
16 pF
50 Ω µ strip
RF OUT
J2
(PCB mat'l: FR-4,
Thickness: 0.031")
GND
100 Ω, L=174 mil,
C1
W=10 mil
6.2 pF
2
8
2
4
VCC
R
F2
12
RF IN
J1
C8
330 pF
1
8P
POWER AMPLIFIERS
C7
1 µF
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Evaluation Board Layout
1.547" x 1.068"
2-88
Rev A3 010112