TI TS3USB30RSWR

TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS237 – JUNE 2007
FEATURES
D1–
D2–
6
D–
VCC
9
4
GND
S
10
3
D+
1
2
D2+
5
D1+
8
S
10
VCC
9
OE
8
1
2
7
6
D2–
Routes Signals for USB 1.0, 1.1, and 2.0
D2+
RSW PACKAGE
(BOTTOM VIEW)
APPLICATIONS
•
7
OE
D1+
•
•
•
•
•
•
•
RSW PACKAGE
(TOP VIEW)
VCC Operation at 3.0 V and 4.3 V
1.8-V Compatible Control-Pin Inputs
IOFF Supports Partial Power Down Mode
Operation
ron = 10 Ω Max
∆ron <0.35 Ω Typ
Cio(on) = 7 pF Typ
Low Power Consumption (1 µA Max)
6KV ESD protection
-3dB Bandwidth = 955-MHz Typ
Packaged in 10-pin TQFN (1.4mm x 1.8mm)
D1–
•
•
•
3
D+
4
GND
5
D–
DESCRIPTION/ORDERING INFORMATION
The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in
handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or
controllers with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with
minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one
of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed
signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is
compatible with various standards, such as high-speed USB 2.0 (480 Mbps).
ORDERING INFORMATION
PACKAGE (1) (2)
TA
–40°C to 85°C
(1)
(2)
RSW
ORDERABLE PART NUMBER
Tape and reel
TS3USB30RSWR
TOP-SIDE MARKING
L6O
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
PIN DESCRIPTION
NAME
DESCRIPTION
OE
Bus-switch enable
S
Select input
D+, D–, Dn+, Dn–
Data ports
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS237 – JUNE 2007
TRUTH TABLE
S
OE
FUNCTION
X
H
Disconnect
L
L
D = D1n
H
L
D = D2n
BLOCK DIAGRAM
D1+
D+
D2+
D1–
D–
D2–
S
OE
Control
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
–0.5
4.6
V
VIN
Control input voltage
range (2) (3)
–0.5
VCC
V
VI/O
Switch I/O voltage range (2) (3) (4)
–0.5
VCC
V
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
±64
mA
VCC
IIO
Supply voltage range
ON-state switch
current (5)
±100
Continuous current through VCC or GND
θJA
Package thermal impedance (6)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
2
UNIT
mA
°C/W
RSW package
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
The package thermal impedance is calculated in accordance with JESD 51-7.
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TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS237 – JUNE 2007
Recommended Operating Conditions
VCC
Supply voltage
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
Data input/output voltage
TA
Operating free-air temperature
(1)
(1)
MIN
MAX
3.0
4.3
VCC = 3.0 V to 3.6 V
1.3
VCC = 4.3 V
1.7
UNIT
V
V
VCC = 3.0 V to 3.6 V
0.5
VCC = 4.3 V
0.7
V
0
VCC
V
–40
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS237 – JUNE 2007
Electrical Characteristics (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
UNIT
–1.2
V
±1
µA
Switch OFF,
VIN = GND
±2
µA
VO = 0 to 4.3 V,
VI = 0
VIN = VCC or GND
±2
µA
VCC = 4.3 V,
II/O = 0,
Switch ON or OFF,
VIN = VCC or GND
1
µA
10
µA
II = –18 mA
VCC = 4.3 V, 0 V
VIN = 0 to 4.3 V
IOZ (3)
VCC = 4.3 V,
VO = 0 to 3.6 V,
VI = 0,
IOFF
VCC = 0 V,
ICC
Control
inputs
IIN
∆ICC (4)
Control
inputs
VCC = 4.3 V,
VIN = 2.6 V
Cin
Control
inputs
VCC = 0 V,
VIN = VCC or GND
Cio(OFF)
VCC = 3.3 V
Switch OFF,
VIN = VCC
Cio(ON)
VCC = 3.3 V,
ron (5)
∆ron
ron(flat)
(1)
(2)
(3)
(4)
(5)
TYP (2)
MAX
VCC = 3.0 V,
MIN
1
pF
VI/O = 3.3 V or 0
2
pF
Switch ON,
VIN = GND,
VI/O = 3.3 V or 0
7
pF
VCC = 3 V
VI = 0.4
IO = -8 mA
VCC = 3 V
VI = 0.4
IO = -8 mA
0.35
Ω
VCC = 3 V
VI = 0 V or 1 V
IO = -8 mA
2
Ω
Ω
10
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Dynamic Electrical Characteristics
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V
PARAMETER
MIN
TYP (1)
MAX
UNIT
XTALK
Crosstalk
RL = 50 Ω, f = 240 MHz, See Figure 9
–56
dB
OIRR
OFF isolation
RL = 50 Ω, f = 240 MHz, See Figure 8
–39
dB
BW
Bandwidth (–3 dB)
RL = 50 Ω, CL = 5 pF, See Figure 10
955
MHz
(1)
4
TEST CONDITIONS
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
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TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS237 – JUNE 2007
Switching Characteristics
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
tpd
Propagation delay (2) (3)
RL = 50 Ω, CL = 5 pF,
See Figure 11
tON
Line enable time, SEL to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 7
30
ns
tOFF
Line disable time, SEL to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 7
25
ns
tON
Line enable time, OE to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 7
30
ns
tOFF
Line disable time, OE to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 7
25
ns
tSK(O)
Output skew between center port to any other
port (2)
RL = 50 Ω, CL = 5 pF,
See Figure 12
50
ps
tSK(P)
Skew between opposite transitions of the same
output
(tPHL – tPLH) (2)
RL = 50 Ω, CL = 5 pF,
See Figure 12
20
ps
tJ
Total Jitter (2)
RL = 50 Ω, CL = 5 pF,
tR = tF = 500 ps at 480
Mbps (PRBS = 215 -1)
20
ps
(1)
(2)
(3)
0.25
ns
For max or min conditions, use the appropriate value specified under "electrical characteristics" for the applicable device type.
Specified by design
The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
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TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS237 – JUNE 2007
APPLICATION INFORMATION
0
0
–1
–10
–20
Attenuation (dB)
–2
Gain (dB)
–3
–4
–5
–30
–40
–50
–60
-6
–70
–7
–80
–90
–8
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
100.0E+3
10.0E+9
1.0E+6
10.0E+6
Frequency (Hz)
Figure 1. Gain vs Frequency
1.0E+9
10.0E+9
Figure 2. OFF Isolation
0
9
–10
8
–20
7
–30
Attenuation (dB)
100.0E+6
Frequency (Hz)
6
–40
5
–50
4
–60
3
–70
2
–80
1
–90
–100
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
10.0E+9
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Frequency (Hz)
Figure 3. Crosstalk
Figure 4. ron
VCC
TS3USB30
1D+
D+
USB2.0
Controller
1D–
Set Top Box
(STB) CPU
or DSP
Processor
USB
Connector
D–
2D+
DVR or
Mass Storage
Controller
2D–
Control
S
Figure 5. Application Diagram
6
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OE
5.0
TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS237 – JUNE 2007
PARAMETER MEASUREMENT INFORMATION
VCC
1D or 2D VOUT1
VIN
TEST
RL
CL
VIN
tON
50 Ω
5 pF
VCC
tOFF
50 Ω
5 pF
VCC
D
1D or 2D VOUT2
CL(2)
RL
S
OE
VSEL(1)
GND
(2)
50%
50%
0
tON
VOE(1)
(1)
1.8 V
Logic
RL
Input
(VSEL or V OE)
CL(2)
tOFF
Switch
Output
(VOUT1 or V OUT2)
90%
90%
VOH
VOL
All input pulses are supplied by generators having the following characteristics: PRR
≤ 10 MHz, ZO = 50Ω, tr < 5 ns, tf < 5 ns.
CL includes probe and jig capacitance.
Figure 6. Turn-On (tON) and Turn-Off Time (tOFF)
VCC
Network Analyzer
Channel OFF: 1D to D
50 W
VOUT1 1D
VSEL = VCC
D
Source
Signal
50 W
VIN
2D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
VSEL S
50 W
+
GND
DC Bias = 350 mV
Figure 7. OFF Isolation (OISO)
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TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS237 – JUNE 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
Network Analyzer
Channel ON: 1D to D
50 W
VOUT1 1D
Channel OFF: 2D to D
VIN
Source
Signal
VSEL = VCC
VOUT2 2D
50 W
Network Analyzer Setup
50 W
VSEL S
+
Source Power = 0 dBm
(632-mV P-P at 50-W load)
GND
DC Bias = 350 mV
Figure 8. Crosstalk (XTALK)
VCC
Network Analyzer
50 W
VOUT1
1D
Channel ON: 1D to D
D
Source
Signal
VIN
VCTRL = GND
2D
Network Analyzer Setup
50 W
VSEL
Source Power = 0 dBm
(632-mV P-P at 50-W load)
S
GND
GND
DC Bias = 350 mV
Figure 9. Bandwidth (BW)
400 mV
Figure 10. Propagation Delay
8
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TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
SCDS237 – JUNE 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VOH
VOL
Pulse Skew tSK(P)
VOH
VOL
VOH
VOL
Output Skew tSK(P)
Figure 11. Skew Test
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TS3USB30
HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS237 – JUNE 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
VOUT1 1D
D
+
VIN
Channel ON
VOUT2 2D
r on +
VSEL
IIN
S
VIN * VOUT2 or VOUT1
W
IIN
VSEL = VIH or VIL
+
GND
Figure 12. ON-State Resistance ®on)
VCC
VOUT1 1D
VIN
D
+
VOUT2 2D
VSEL
+
S
OFF-State Leakage Current
Channel OFF
VSEL = VIH or VIL
+
GND
Figure 13. OFF-State Leakage Current
VCC
VOUT1 1D
Capacitance
Meter
VBIAS
VBIAS = VCC or GND
VOUT2 2D
VSEL = VCC or GND
VIN D
Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.
VSEL S
GND
Figure 14. Capacitance
10
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