SKYWORKS SKY65152

preliminary data sheet
SKY65152: 2.4–2.5 GHz WLAN Power Amplifier
Block Diagram
IEEE802.11 b/g WLAN
ISM band transmitter
l WCS fixed wireless
l Wireless access nodes
VREF1 VC_BIAS
l
l
RF In
Interstage
Match
Input
Match
Interstage
Match
VCC2
VCC1
Output
Match
V_DET
RF Out
VCC3
GND
GND
1
RF_IN
GND
GND
Package Diagram
20
19
18
17
16
VCC1
2
15
VCC_DET
PA_ENB
3
14
V_DET
VC_BIAS
4
13
VCC2
VREF1
5
12
N/C
VREF2
6
11
VCC3
7
8
9
10
GND
Skyworks SKY65152 is a Microwave Monolithic Integrated Circuit
(MMIC) Power Amplifier (PA) with superior output power, linearity,
and efficiency. These features make the SKY65152 ideal for
Wireless Local Area Network (WLAN) applications. The high linearity (low EVM) and high efficiency of this device makes it ideal
for use in the transmit chain of WLAN access point or modems.
Detector
Active Bias
RF_OUT
Description
RREF3
GND
E VM < 3% for POUT > 27 dBm
l High gain: 31 dB
l Internal RF match with DC block and active bias circuits
l Internal ON/OFF control circuit
l Single DC supply: 5 V
l Operating temperature -40 °C to +85 °C
l Available on tape and reel
l Available lead (Pb)-free and RoHs-compliant
l MCM (20-pin, 6 x 6 mm) lead (Pb)-free package
(MSL-3 @ 260 °C per JEDEC J-STD-020)
l
RREF2
RREF1
VREF3 VCC_DET
GND
Features
VREF2 PA_ENB
VREF3
Applications
The SKY65152 is fabricated using Skyworks high reliability
Aluminum (Al) Gallium Arsenide (GaAs) Heterojunction Bipolar
Transistor (HBT) process, which allows for single supply operation
while maintaining high efficiency and good linearity. The device is
internally matched and mounted in a 20-pin, 6 x 6 mm Multi-Chip
Module (MCM) Surface-Mounted Technology (SMT) package, which
allows for a highly manufacturable low cost solution.
The module can operate over the temperature range of -40 °C to
+85 °C. A populated evaluation board is available upon request.
NEW
Skyworks offers lead (Pb)-free, RoHS (Restriction of
Hazardous Substances)-compliant packaging.
Preliminary Data Sheet: Based on engineering results. Sampling quantities available.
Pin out and package have been determined.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968 Rev. C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 26, 2009
1
preliminary Data Sheet • SKY65152
Electrical Specifications
VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, ZO = 50 W, TC = 25 °C,
Frequency = 2.442 GHz, unless otherwise noted(5)
Parameter
Symbol
Condition
Min.
IEEE802.11b Complimentary Code Keying Input Signal, Data Rate = 11 Mbps
Total supply current
ICC_total
Output power set to POUT
Output power(1)
POUT
Power-added efficiency(2)
PAE
Output power set to POUT
Ramp-up/ramp-down(3)
TS
Small signal
IEEE802.11g Orthogonal Frequency Division Multiplexing Input Signal, Data Rate = 54 Mbps
Total supply current
ICC_total
Output power set to POUT
Output
power(4)
POUT
Output power @ EVM=2.5%
Power-added
efficiency(2)
Continuous Wave Input Signal
Small signal gain
Unit
1070
mA
31
dBm
23
%
<0.5
μs
970
mA
30
dBm
Output power set to POUT
27
dBm
PAE
Output power set to POUT
20
%
POUT
Gain flatness over channel (16.25 MHz)
Max.
POUT_EVM
G
Gain flatness over band
Typ.
POUT_EVM
Pin = –25 dBm
31
dB
From 2.4 GHz to 2.5 GHz
±0.5
dB
Over any 16.25 MHz within band
±0.1
dB
33
dBm
Output power @ 1 dB compression
P1 dB
Output IP3
OIP3
POUT/tone = 23 dBm, DF = 5 MHz
42
dBm
Quiescent current
ICCQ
No RF
465
mA
Noise figure
NF
5
dB
Power-added efficiency
PAE
@ P1 dB
33
%
Thermal resistance
qJC
Junction to case
20
˚C/W
Power Up/Down Control
Power up
PA_ENB On
Power down
PA_ENB Off
Standby current
ISB
3
5
0
PA_ENB = 0 V
V
0.5
5
V
µA
1. Defined as the maximum power level for which the IEEE802.11b transmit mask requirements are met.
2. Measured at the specified average output RF power and modulation type.
3. Ramp-up and ramp-down times are defined from the 10% to 90% power points.
4. Defined as the maximum power level for which the IEEE802.11g transmit mask requirements are met.
5. Voltage measured at evaluation board pins.
Recommended Operating Conditions
Parameter
RF input power
Min.
Typ.
Pin
Supply voltages(1)
Reference
Symbol
voltage(1)
Detector supply voltage(1)
Max.
Unit
-3
dBm
VCC, VC_BIAS
5.0
V
VREF
2.5
V
VCC_DET
3.6
V
Operating frequency
FO
2412
Operating case temperature
TC
-40
+25
2462
MHz
+85
˚C
1. Voltage levels measured at the pins of the package. The evaluation board supply voltage
levels may be different. Refer to the evaluation board schematic diagram.
2
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
March 26, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200968 Rev. C
preliminary Data Sheet • SKY65152
Absolute Maximum Ratings
Characteristic
RF output power (POUT)
Supply voltage (VCC, VC_BIAS and PA_ENB)1
Supply current (ICC)
Value
28 dBm
5.5 V
850 mA
Reference voltage (VREF)1
4V
Detector supply voltage (VCC_DET)1
4V
Power dissipation (PDISS)
1.1 W
Operating case temperature (TC)
-40 °C to +85 °C
Storage temperature (TST)
-55 °C to +125 °C
Junction temperature (TJ)
150 °C
1. Voltage levels measured at the pins of the package. The evaluation board supply voltage
levels may be different. Refer to the evaluation board schematic diagram.
Performance is guaranteed only under the conditions listed in the specifications table and is
not guaranteed under the full range(s) described by the Absolute Maximum specifications.
Exceeding any of the absolute maximum/minimum specifications may result in permanent
damage to the device and will void the warranty. Each absolute maximum rating listed is an
individual parameter. Operating the amplifier with more than one condition at its absolute
maximum or minimum rating value may result in permanent damage to the device. Exposure
to maximum rating conditions for extended periods may reduce device reliability.
CAUTION: A lthough this device is designed to be as robust as
possible, ESD (Electrostatic Discharge) can damage
this device. This device must be protected at all
times from ESD. Static charges may easily produce
potentials of several kilovolts on the human body or
equipment, which can discharge without detection.
Industry-standard ESD precautions must be employed
at all times.
Electrical Specifications
VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, ZO = 50 W, TC = 25 °C, CW,
Frequency = 2.442 GHz, unless otherwise noted
Gain vs. Power Out Across Frequency
Small Signal Gain vs. Frequency
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968 Rev. C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 26, 2009
3
preliminary Data Sheet • SKY65152
Electrical Specifications
VCC1 = VCC2 = VCC3 = VREF1 = VREF2 = VREF3 = VC_BIAS = VCC_DET = PA_ENB = 5 V, ZO = 50 W, TC = 25 °C, CW,
Frequency = 2.442 GHz, unless otherwise noted
2442 MHz
2412 MHz
2462 MHz
3.5
1000
3.0
800
2.5
2.0
ICC2
ICC3
Total
600
400
200
1.5
1.0
ICC1
1200
Current (mA)
EVM (%)
4.0
17 18 19 20 21 22 23 24 25 26 27 28 29
0
12
14
16
18
20
22
24
26
POUT (dBm)
POUT (dBm)
eVm vs. pOUt across Frequency
Current vs. pOUt
Spectral Response @ Pout = 30 dBm
(802.11g, OFDM, 64 QAM @ 54 Mbps)
28
Spectral Response @ Pout = 31 dBm
(802.11b, CCK @ 11 Mbps)
PAE vs. Pout
4
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
March 26, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200968 Rev. C
30
32
preliminary Data Sheet • SKY65152
Theory of Operation
The SKY65152 is a three-stage, HBT InGaP device optimized for
high linearity and power efficiency. It contains all of the needed
RF matching and DC biasing circuits. An in-module active bias
circuit is included within the device for all three amplifier stages
providing for excellent gain tracking over temperature and
voltage variations. The first, second and output stages are independently supplied using the VCC1, VCC2 and VCC3 supply lines,
pins 16, 14 and 11,respectively. The DC control voltage that
sets the bias for all 3 stages is supplied via VC_BIAS, pin 4. The
evaluation board includes shunt decoupling caps on these pins to
suppress any possible bias affect on the RF at low frequencies.
The bias reference voltages for stages 1, 2 and 3 are supplied
using common lines VREF1, VREF2 and VREF3 (Pins 5, 6 and 7). The
maximum reference voltage at the package pins is 4 V. Resistors
R1, R2 and R3 on the evaluation board set the correct bias to
these pins when attached to a 5 V power supply.
The SKY65152 includes an internal PA Enable control pin (Pin
3) for fast RF On/Off control of < 0.5 µs. Zero volts turns off the
PA while 3–5 V will turn on the PA. The device also provides an
output power detector voltage VDET at Pin 14. A bias voltage is
required to operate the detector. The detector supply voltage
is supplied via VCC_DET (Pin 15). The maximum voltage at the
package pin is 4 V. Resistor R5 on the evaluation board sets the
correct bias to this pin when attached to a 5 V power supply.
Pin 18 is the RF input and Pin 9 is the RF output. External DC
blocking or RF matching is not required on the RF input and
output. Ground is achieved through several ground pins and the
package backside, center ground.
These features make the device suitable for wideband digital
applications, where PA linearity and power consumption are of
critical importance (e.g., WLANs). The device has been characterized with the highest specified data rates for 802.11b (11 Mbps)
and 802.11g (54 Mbps). Under these stringent test conditions,
the device exhibits excellent spectral purity and power efficiency.
Application Circuit Notes
Center Ground. It is extremely important that the device paddle
be sufficiently grounded for both thermal and stability reasons.
Multiple small vias are acceptable and will work well under the
device if solder migration is an issue.
Ground (Pins 1, 2, 8, 10, 17, 19, 20). Attach all ground pins to
the RF ground plane with the largest diameter and lowest inductance via that the layout will allow. Multiple small vias are also
acceptable and will work well under the device if solder migration is an issue.
PA_ENB (Pin 3). PA_ENB is the internal PA Enable control pin
for fast RF On/Off control of < 0.5 µs. Zero volts turns off the PA
while 3–5 V will turn on the PA.
VC_BIAS (Pin 4). VC_BIAS is the bias supply voltage for stages 1
and 2, typically set to 5 V.
VREF1 (Pin 5). Bias reference voltage for amplifier stage 1. VREF1
should be operated over the same voltage range as VCC, with a
nominal voltage of 5 V.
VREF2 (Pin 6). Bias reference voltage for amplifier stage 2. VREF2
should be operated over the same voltage range as VCC, with a
nominal voltage of 5 V.
VREF3 (Pin 7). Bias reference voltage for amplifier stage 3. VREF3
should be operated over the same voltage range as VCC, with a
nominal voltage of 5 V.
RF_OUT (Pin 9). Amplifier RF Output Pin. ZO = 50 W. The
module includes an onboard internal DC blocking capacitor. All
impedance matching is provided internal to the module.
VCC3 (Pin 11). Supply voltage for the output (final) stage collector
bias (typically 5 V). bypassing of VCC3 is accomplished with C10
and C17 and should be placed in the approximate location shown
on the evaluation board, but placement is not critical.
No Connect (Pin 12). The pin is open and may or may not be
connected to ground.
VCC2 (Pin 13). Supply voltage for the second stage collector bias
(typically 5 V). Bypassing of VCC2 is accomplished with C8 and
C16 and should be placed in the approximate location shown on
the evaluation board, but placement is not critical.
VDET (Pin 14). Output power detector voltage pin. The detector
load and settling time constant are set external to the device.
Inductor L2 and capacitor C7 are set to yield a settling time of
less than 0.5 µs.
VCC_DET (Pin 15). Power detector supply voltage. Proper bias
and bypassing is VCC_DET is accomplished with Resistor R5 and
capacitor C5 provided. VCC_DET may be connected to PA_ENB
supply. The benefit of doing this is the current draw consumed
by the detector will not be wasted with the PA in the “Off” state.
VCC1 (Pin 16). Supply voltage for the first stage collector bias
(typically 5 V). Bypassing of VCC1 is accomplished with C5 and
C15 and should be placed in the approximate location shown on
the evaluation board, but placement is not critical.
RF_IN (Pin 18). Amplifier RF Input Pin. ZO = 50 W. The module
includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968 Rev. C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 26, 2009
5
preliminary Data Sheet • SKY65152
Package and Handling Information
Electrostatic Discharge (ESD) Sensitivity
Since the device package is sensitive to moisture absorption, it
is baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.
The SKY65152 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
Please refer to Skyworks Solder Reflow application note, available at www.skyworksinc.com, for instructions on mounting the
SKY65152 to a printed circuit board.
Production quantities of this product are shipped in a standard tape and reel format. For packaging details, refer to the
Skyworks Application Note, Tape and Reel, document number
101568.
Application Circuit
5
6
R3 180 Ω
C2
3300 pF
6
17
GND
19
VCC2
VREF1
NC
VREF2
VCC3
7
R2 180 Ω
VC_BIAS
15
14
RF Output
Collector Voltage 1 (5 V)
Detector Supply Voltage (5 V)
R5
300 Ω
L2 27 nH
C6
3300 pF
C7
8.2 pF
13
12
C15
10 µF
C8
8.2 pF
C16
10 µF
C10
8.2 pF
C17
10 µF
Detector Output
Collector Voltage 2 (5 V)
11
10 GND
R1 680 Ω
VDET
RF_Out
Reference Voltage (5 V)
4
VCC1 16
PA_ENB
9
Bias Voltage (5 V)
C1
3300 pF
GND
3
C11
10 µF
C5
8.2 pF
VCC_DET
GND
8
PA Enable (0–5 V)
VREF1
2
RF_In 18
1 GND
GND
20
GND
GND
21
RF Input
Collector Voltage 3 (5 V)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
March 26, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200968 Rev. C
preliminary Data Sheet • SKY65152
Pin Assignments
Pin #
Name
1
GND
Ground
Description
2
GND
Ground
3
PA_ENB
PA ON/OFF control signal;
OFF: 0 V to 0.5 V; ON: 3 V to VCC
4
VC_BIAS
Bias voltage
5
VREF1
Bias reference voltage 1
6
VREF2
Bias reference voltage 2
7
VREF3
Bias reference voltage 3
8
GND
Ground
9
RF_OUT
RF output
10
GND
Ground
11
VCC3
Stage 3 collector voltage
12
NC
13
VCC2
No connection
Stage 2 collector voltage
14
VDET
Detector output signal
15
VCC_DET
Detector supply voltage
16
VCC1
Stage 1 collector voltage
17
GND
Ground
18
RF_IN
RF input
19
GND
Ground
20
GND
Ground
Center attachment pad must have a low inductance and low thermal resistance connection to
the customer’s printed circuit board ground plane.
Bill of Material for Evaluation Board
Component
Value
Units
Qty.
Size
Product Number
Manufacturer
Manufacturer’s Part
Number
Characteristics
C1, C2, C6
3300
pF
3
0603
5404R28-015
Murata
GRM188R71H332KD01J
X7R, 50 V, ± 10%
C5, C7, C8,
C10
8.2
pF
4
0603
5404R98-010
Murata
GRM1885C1H8R2CZ01D
C0G, 50 V, ± 0.25 pF
C11, C15,
C16, C17
10
µF
4
0603
5404R91-005
TDK
C3216X5R0J106KT
X5R, 6 V, ± 10%
L2
27
nH
1
0603
5332R34-030
Taiyo-Yuden
HK160827NJ-T
± 5%, SRF 2200 MHz
R1
680
W
1
0603
5424R20-045
Rohm
MCR03EZHUJ680
50 V, 0.063 W, ± 5%
R2, R3
180
W
2
0603
5424R20-031
Rohm
MCR03EZHUJ180
50 V, 0.063 W, ± 5%
R5
300
W
1
0603
5424R20-036
Rohm
MCR03EZHUJ300
50 V, 0.063 W, ± 5%
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968 Rev. C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 26, 2009
7
preliminary Data Sheet • SKY65152
Evaluation Board Description
4. Connect a spectrum analyzer to the RF signal output port.
The Skyworks SKY65152 Evaluation Board is used to test the
performance of the SKY65152 power amplifier module. The following design considerations are general in nature and must be
followed regardless of final use or configuration.
5. Enable the power supply.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65152 power amplifier module has
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since
the circuit board acts as the heat sink, it must shunt as much
heat as possible from the amplifiers. As such, design the connection to the ground pad to dissipate the maximum wattage
produced to the circuit. Multiple vias to the grounding layer are
required.
3. Bypass capacitors should be used on the DC supply lines. RF
inductor is required on the Vcc supply line to block RF signal
from the DC supply. See Evaluation Board schematic drawing
for more details.
4. The RF lines should be well separated from each other, with
solid ground in between traces, to maximize input-to-output
isolation.
NOTE: J unction temperature (TJ) of the device increases with a
poor connection to the slug and ground. This reduces the
lifetime of the device.
6. Enable the RF signal.
7. Take measurements.
CAUTION: If the input signal exceeds the rated power, the
SKY65152 Evaluation Board can be permanently
damaged.
NOTE: It is important that the VCC voltage source be adjusted
such that 5 V is measured at the board. The high collector
currents will drop the collector voltage significantly if long
leads are used. Adjust the bias voltage to compensate.
Evaluation Board
PA_ENB
VC_BIAS
VREF
GND
GND
Evaluation Board Test Procedure
Use the following procedure to set up the SKY65152 evaluation
board for testing.
1. Connect a 5.0 V supply to VCC1, VCC2, VCC3, VREF1, VREF2,
VREF3, VC_BIAS, VCC_DET, PA_ENB. If available, enable the current limiting function of the power supply of the VCC supply to
850 mA.
2. If desired, connect a voltage meter to VDET.
3. Connect a signal generator to the RF signal input port. Set it to
the desired RF frequency at a power level of -15 dBm or less
to the evaluation board, but do NOT enable the RF signal.
8
Recommended Solder Reflow Profiles
Refer to the “Recommended Solder Reflow Profile”
Application Note.
Tape and Reel Information
Refer to the “Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation” Application Note.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
March 26, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200968 Rev. C
VCC1
VCC_DET
VDET
VCC2
VCC3
preliminary Data Sheet • SKY65152
Evaluation Board Layer Detail
Evaluation Board Stack-Up
Cross Section
Name Thickness (mils) Material
εr
L1
1.4
–
Lam1
12
L2_GND
1.4
Cu, 1 oz.
–
4
FR4-4
4.35
L3_GND
1.4
Cu, 1 oz.
–
Lam3
12
FR4-12
4.35
L4
1.4
Cu, 1 oz.
–
Lam2
Layer 1: Silk Screen
Cu
Rogers 4003-12 3.38
Branding Specifications
Mark Pin 1
Identifier
Manufacturing Part Number
Revision Number
SKY65152-NP
EXXXXX.XX
YYWW MX
Lot Number
YY = Manufacture Year
WW = Week Packaged
Sealed
MX = Country Code
Layer 1: Top Metal
Layer 2 and 3: Ground
Layer 4: Backside Ground
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968 Rev. C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 26, 2009
9
preliminary Data Sheet • SKY65152
Evaluation Board Layer Detail
Recommended Footprint
6
Pin 1
Indicator
Thermal Via Array Ø0.3 mm
On 0.6 mm Pitch Will
Improve Thermal Performance
Top
13X 0.75 mm
0.25 mm
Typ.
Pin 20
Pin 1
6
13X 0.5 mm
0.6 mm Typ.
6.3 mm
Pin 20
1 mm Typ.
(0.3) Solder Mask Opening
(2.075)
4X 0.5
2X 1.9
4X 1.5
12X 2.9
1.45 ± 0.1
Ø0.15 Metal Pad
Pin 1
(2.75)
4X 2.5
Pin 1
Package Outline
4X 1.5
0.6 mm Typ.
6.3 mm
4X 0.5
Solder Mask
A
2X 1.9
20X SMT Pad
8X 2.9
4X R0.2
Pin 20
Solder Mask Opening
20X 0.85 mm
Pin 1
0.5 ± 0.1
20X 0.6 mm
0.1
2X 1.7 mm
0.5 ± 0.05
6.4 mm
Metal Pad
Edge
1 mm Typ.
Detail A
All dimensions are in millimeters
Dimensioning and tolerancing according
to ASME Y14.5M-1994
Package Outline
2X 1.7 mm
6.4 mm
Stencil Pattern
Pin 20
20X 0.75 mm
Pin 1
20X 0.5 mm
2X 1.7 mm
6.3 mm
1 mm Typ.
Package Outline
2X 1.7 mm
Stencil Aperture Size of
80 to 100% of the
Module/Pkg. Solder
Mask Opening
6.3 mm
10
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected]com • www.skyworksinc.com
March 26, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200968 Rev. C
preliminary Data Sheet • SKY65152
Tape and Reel Dimensions
8.00 (P1)
0.3 ± 0.02
Ø1.50 ± 0.10
4.00 (Po)
2.00 ± 0.05
B
Pin 1
1.75 ± 0.10
5.50 ± 0.05
A
A
12.00 ± 0.30
6.35 (Bo)
7° max
B
1.59 (Ko)
Section B-B
Ø1.50 Min.
6.35 (Ao)
8° Max.
Section A-A
1. Carrier tape: black conductive polystyrene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. All dimensions are in millimeters
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200968 Rev. C • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • March 26, 2009
11
preliminary Data Sheet • SKY65152
Ordering Information
Model Name
SKY65152: 2.4–2.5 GHz
WLAN Power Amplifier
Manufacturing Part Number
Evaluation Kit Part Number
SKY65152-NP (Pb-free package)
TW17-D560-001
Copyright © 2008, 2009, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided
by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
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THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
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POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any
damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
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Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands
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incorporated by reference.
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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
March 26, 2009 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200968 Rev. C