EXAR SP6126EK1-L

SP6126
Nov
High-Voltage, Step Down Controller in TSOT6
FEATURES
Wide 4.5V – 29V Input Voltage Range
Internal Compensation
Built-in High Current PMOS Driver
Adjustable Overcurrent Protection
Internal soft-start
600kHz Constant Frequency Operation
0.6V Reference Voltage
1% output setpoint accuracy
Lead Free, RoHS Compliant Package:
Small 6-Pin TSOT
LX
GND
FB
6
5
4
SP6126
6 PinTSOT
1
2
VIN
3
GATE
VDR
DESCRIPTION
The SP6126 is a PWM controlled step down (buck) voltage mode regulator with VIN feedforward and
internal Type-II compensation. It operates from 4.5V to 29V making is suitable for 5V, 12V, and 24V
applications. By using a PMOS driver, this device is capable of operating at 100% duty cycle. The
high side driver is designed to drive the gate 5V below VIN. The programmable overcurrent
protection is based on high-side MOSFET’s ON resistance sensing and allows setting the
overcurrent protection value up to 300mV threshold (measured from VIN-LX). The SP6126 is
available in a space-saving 6-pin TSOT package making it the smallest controller available capable
of operating from 24VDC supplies.
TYPICAL APPLICATION CIRCUIT
VIN
C1
10uF
Q1
Si2343DS
12V
2
1
Gate
GND
Vin
L1, IHLP-2525CZ
6.8uH, 60mOhm, 4.5A
Rs=1k
VOUT
LX
C7
0.1uF
6
SP6126
Ds
MBRA340T3G
3
C4
22uF
RZ
2K
VDR
3.3V
0-2.0A
R1
200k, 1%
CZ
62pF
4
GND
VFB
GND
R2
44.2k, 1%
5
D1 1N4148
SHDN
High=Of f
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SP6126: TSOT-6 PFET Buck Controller
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 2008 Exar Corporation
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only, and functional operation of
the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum rating
conditions for extended periods of time may affect
reliability.
Input Voltage….................................................-0.3V to 30V
Lx………………………………………………….…-2V to 30V
FB……………..................................................-0.3V to 5.5V
Storage Temperature..………………...……-65 °C to 150 °C
Junction Temperature...................................-40°C to 125°C
Lead Temperature (Soldering, 10 sec)….….………..300 °C
ESD Rating……….….…1kV LX, 2kV all other nodes, HBM
ELECTRICAL SPECIFICATIONS
Specifications are for TAMB=TJ=25°C, and those denoted by ♦ apply over the full operating range, -40°C< Tj <125°C. Unless
otherwise specified: VIN =4.5V to 29V, CIN = 4.7µF.
♦
PARAMETER
MIN
TYP
MAX
UNITS
UVLO Turn-On Threshold
4.2
4.35
4.5
V
0°C< Tj <125°C
UVLO Turn-Off Threshold
4.0
4.2
4.4
V
0°C< Tj <125°C
UVLO Hysterisis
Operating
Input
Voltage
Range
Operating
Input
Voltage
Range
Operating VCC Current
Reference Voltage Accuracy
0.2
V
4.5
29
V
7
29
V
0.3
0.5
3
mA
%
Reference Voltage Accuracy
0.5
2
%
Reference Voltage
0.6
Reference Voltage
Switching Frequency
Peak-to-peak ramp Modulator
Minimum Duty Cycle
Maximum Duty Cycle
Gate
Driver
Turn-Off
Resistance
Gate
Driver
Pull-Down
Resistance
Gate
Driver
Pull-up
Resistance
0.6
0.612
V
510
600
VIN/5
690
kHz
V
40
100
ns
0
%
%
50
60
kΩ
4
8
Ω
3
6
Ω
5.5
V
100
VIN - VDR voltage difference
4.5
Overcurrent Threshold
LX pin Input Current
OFF interval during hiccup
270
25
300
30
100
330
35
mV
uA
ms
3
5
9
ms
0.9
1.0
1.1
V
Soft start time
SHDN Threshold
SHDN Threshold Hysteresis
Nov07-08 RevG
0°C< Tj <125°C
♦
VFB=1.2V
♦
V
0.588
Minimum ON-Time Duration
CONDITIONS
100
♦
♦
Internal resistor between GATE and
VIN
VIN=12V,
VFB=0.5V,
Measure
resistance between GATE and VDR
VIN=12V,
VFB=0.7V,
Measure
resistance between GATE and VIN
♦
Measure VIN – VDR, VIN>7V
Measure VIN - LX
VLX = VIN
VFB=0.58V, measure between
VIN=4.5V and first GATE pulse
♦
Apply voltage to FB
mV
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PIN DESCRIPTION
PIN #
PIN
NAME
1
VIN
2
GATE
3
VDR
4
FB
5
GND
6
LX
DESCRIPTION
Input power supply for the controller. Place input decoupling capacitor as close
as possible to this pin.
Connect to the gate terminal of the external P-channel MOSFET.
Power supply for the internal driver. This voltage is internally regulated to
about 5V below VIN. Place a 0.1uF decoupling capacitor between VDR and
VIN as close as possible to the IC.
Regulator feedback input. Connect to a resistive voltage-divider network to set
the output voltage. This pin can be also used for ON/OFF control. If this pin is
pulled above 1V the P-channel driver is disabled and controller resets internal
soft start circuit.
Ground pin.
This pin is used as a current limit input for the internal current limit comparator.
Connect to the drain pin of the external MOSFET through an optional resistor.
Internal threshold is pre-set to 300mV nominal and can be decreased by
changing the external resistor based on the following formula:
VTRSHLD = 300mV – 30uA * R
BLOCK DIAGRAM
VIN
5V
VDR
Oscillator
Vin - 5V LDO
VIN
5V Internal LDO
I = k x VIN
FAULT
PWM Latch
Reset Dominant
VREF
GATE
S
+
FB
R
+
-
PWM Comparator
Error Amplifier
VDR
FAULT
FAULT
ENBL
FAULT
Register
S
+
200ms delay
-
UVLO
LX
4-Bit counter
Overcurrent
Comparator
30uA
VIN - 0.3V
+
-
1V
Nov07-08 RevG
R
GND
POR
R
Set Dominant
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GENERAL OVERVIEW
The SP6126 is a fixed frequency, voltagemode, non-synchronous PWM controller
optimized for minimum component, small form
factor and cost effectiveness. It has been
designed for single-supply operation ranging
from 4.5V to 29V. SP6126 has Type-II internal
compensation
for
use
with
Electrolytic/Tantalum output capacitors. For
ceramic capacitors Type-III compensation can
be implemented by simply adding an R and C
between output and Feedback. A precision
0.6V reference, present on the positive terminal
of the Error Amplifier, permits programming of
the output voltage down to 0.6V via the FB pin.
The output of the Error Amplifier is internally
compared to a feed-forward (VIN/5 peak-topeak) ramp and generates the PWM control.
Timing is governed by an internal oscillator that
sets the PWM frequency at 600kHz.
Creating a Type-III compensation Network
The above condition requires the ESR zero to
be at a lower frequency than the double-pole
from the LC filter. If this condition is not met,
Type-III compensation should be used and can
be accomplished by placing a series RC
combination in parallel with R1 as shown
below. The value of CZ can be calculated as
follows and RZ selected from table 1.
L⋅C
………….. (4)
R1
CZ =
SP6126 contains useful protection features.
Over-current protection is based on high-side
MOSFET’s Rds(on) and is programmable via a
resistor placed at LX node. Under-Voltage
Lock-Out (UVLO) ensures that the controller
starts functioning only when sufficient voltage
exists for powering IC’s internal circuitry.
fESRZERO ÷ fDBPOLE
RZ
50KΩ
40KΩ
30KΩ
10KΩ
2KΩ
1X
2X
3X
5X
>= 10X
SP6126 Loop Compensation
Table1- Selection of RZ
The SP6126 includes Type-II internal
compensation
components
for
loop
compensation.
External
compensation
components are not required for systems with
tantalum or aluminum electrolytic output
capacitors with sufficiently high ESR. Use the
condition below as a guideline to determine
whether or not the internal compensation is
sufficient for your design.
Vout
SP6126
CP1
Type-II internal compensation is sufficient if the
following condition is met:
2pF
RZ
CZ
CZ2
130pF
RZ2
200k
R1
200k, 1%
VFB
f ESRZERO < f DBPOLE ………………. (1)
+
where:
Vref =0.6V
R2
Error Amplif ier
f ESRZERO =
f DBPOLE =
1
2.π .R ESR .C OUT
1
2.π . L ⋅ C OUT
Nov07-08 RevG
……….. (2)
Figure 1- RZ and CZ in conjunction with
internal compensation components form
a Type-III compensation
………… (3)
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GENERAL OVERVIEW
Loop Compensation Example 1- A converter
utilizing a SP6126 has a 6.8uH inductor and
a 22uF/5mΩ ceramic capacitor. Determine
whether Type-III compensation is needed.
Loop Compensation Example 2- A converter
utilizing a SP6126 has a 6.8uH inductor and
a 150uF, 82mΩ Aluminum Electrolytic
capacitor. Determine whether Type-III
compensation is needed.
From equation (2) fESRZERO = 1.45MHz. From
equation (3) fDBPOLE = 13 kHz. Since the
condition specified in (1) is not met, Type-III
compensation has to be used by adding
external components RZ and CZ. Using
equation (4) CZ is calculated 61.2pF (use 62
pF). Following the guideline given in table 1,
a 2kΩ RZ should be used.
The steps followed in example 1 were used
to compensate the typical application circuit
shown on page 1. Satisfactory frequency
response of the circuit, seen in figure 2,
validates the above procedure.
From equation (2) fESRZERO = 13kHz. From
equation (3) fDBPOLE = 5 kHz. Since the
condition specified in (1) is not met, Type-III
compensation has to be used by adding
external components RZ and CZ. Using
equation (4) CZ is calculated 160pF (use
150 pF). Since fESRZERO ÷ fDBPOLE is
approximately 3, RZ has to be set at 30kΩ.
Figure 2- Satisfactory frequency response of typical application circuit shown on page
1. Crossover frequency fc is 80kHz with a corresponding phase margin of 65 degrees.
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GENERAL OVERVIEW
Overcurrent Protection
Using the above equation there is good
agreement between calculated and test results
when an RS in the range of 0.5k to 3k is used.
For RS larger than 3k test results are lower than
those predicted by (5), due to circuit parasitics.
Vin
SP6126
Using the ON/OFF Function
Gate
Q1
Ov er-Current Comparator
LX
Rs
+
Ds
30uA
Vin - 0.3V
Feedback pin serves a dual role of ON/OFF
control. The MOSFET driver is disabled when a
voltage greater than 1V is applied at FB pin.
Maximum voltage rating of this pin is 5.5V. The
controlling signal should be applied through a
small signal diode as shown on page 1. Please
note that an optional 10kΩ bleeding resistor
across the output helps keep the output
capacitor discharged under no load condition.
Programming the Output Voltage
To program the output voltage, calculate R2
using the following equation:
Figure 3- Overcurrent protection circuit
R2 =
The overcurrent protection circuit functions by
monitoring the voltage across the high-side FET
Q1. When this voltage exceeds 0.3V, the
overcurrent comparator triggers and the
controller enters hiccup mode. For example if
Q1 has Rds(on)=0.1Ω, then the overcurrent will
trigger at I = 0.3V/0.1Ω=3A. To program a lower
overcurrent use a resistor Rs as shown in figure
1. Calculate Rs from:
0.3 − (1.15 × Iout × Rds (on) )
Rs =
…..…… (5)
30uA
The overcurrent circuit triggers at peak current
through Q1 which is usually about 15% higher
than average output current. Hence the
multiplier 1.15 is used in (5).
Example: A switching MOSFET used with
SP6126 has Rds(on) of 0.1Ω. Program the overcurrent circuit so that maximum output is 2A.
Rs =
0.3 − (1.15 × 1A × 0.1Ohm )
30uA
R1
 Vout 

− 1
 Vref

Where: Vref=0.6 is the reference voltage of the
SP6126
R1=200kΩ is a fixed-value resistor that, in
addition to being a voltage divider, it is part of
the compensation network. In order to simplify
compensation calculations, R1 is fixed at 200kΩ.
Soft Start
Soft Start is preset internally to 5ms (nominal).
Internal Soft Start eliminates the need for the
external capacitor CSS that is commonly used to
program this function.
MOSFET Gate Drive
P-channel drive is derived through an internal
regulator that generates VIN-5V. This pin (VDR)
has to be connected to VIN with a 0.1uF
decoupling capacitor. The gate drive circuit
swings between VIN and VIN-5 and employs
powerful drivers for efficient switching of the Pchannel MOSFET.
Rs = 2333Ω
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GENERAL OVERVIEW
Power MOSFET Selection
where:
Select the Power MOSFET for Voltage rating
BVDSS, On resistance RDS(ON), and thermal
resistance Rthja. BVDSS should be about twice
as high as VIN in order to guard against
switching transients. Recommended MOSFET
voltage rating for VIN of 5V, 12V and 24V is
12V, 30V and 40V respectively. RDS(ON) has to
be selected such that when operating at peak
current
and
junction
temperature
the
Overcurrent threshold of the SP6126 is not
exceeded. Allowing 50% for temperature
coefficient of RDS(ON) and 15% for inductor
current ripple, the following expression can be
used:
Vf is diode forward voltage at IOUT
Schottky’s AC losses due to its switching
capacitance are negligible.
Inductor Selection
Select the Inductor for inductance L and
saturation current ISAT. Select an inductor with
ISAT higher than the programmed overcurrent.
Calculate inductance from:
 Vout   1   1 

L = (Vin − Vout ) × 
 ×   × 
 Vin   f   Irip 
300mV


RDS (ON ) ≤ 

 1.5 × 1.15 × Iout 
where:
Within this constraint, selecting MOSFETs with
lower RDS(ON) will reduce conduction losses at
the expense of increased switching losses. As
a rule of thumb select the highest RDS(ON)
MOSFET that meets the above criteria.
Switching losses can be assumed to roughly
equal the conduction losses. A simplified
expression for conduction losses is given by:
VIN is converter input voltage
VOUT is converter output voltage
f is switching frequency
IRIP is inductor peak-to-peak current ripple
(nominally set to 30% of IOUT)
Keep in mind that a higher IRIP results in a
smaller inductor which has the advantages of
small size, low DC equivalent resistance DCR,
high saturation current ISAT and allows the use
of a lower output capacitance to meet a given
step load transient. A higher IRIP, however,
increases the output voltage ripple and
increases the current at which converter enters
Discontinuous Conduction Mode. The output
current at which converter enters DCM is ½ of
IRIP. Note that a negative current step load that
drives the converter into DCM will result in a
large output voltage transient. Therefore the
lowest current for a step load should be larger
than ½ of IRIP.
 Vout 
Pcond = Iout × RDS (ON ) × 

 Vin 
MOSFET’s junction
estimated from:
temperature
can
be
T = (2 × Pc × Rthja ) + Tambient
Schottky Rectifier selection
Select the Schottky for Voltage rating VR,
Forward voltage Vf, and thermal resistance
Rthja. Voltage rating should be selected using
the same guidelines outlined for MOSFET
voltage selection. For a low duty cycle
application such as the circuit shown on first
page, the Schottky is conducting most of the
time and its conduction losses are the largest
component of losses in the converter.
Conduction losses can be estimated from:
Output Capacitor Selection
Select the output capacitor for voltage rating,
capacitance and Equivalent Series Resistance
(ESR). Nominally the voltage rating is selected
to be twice as large as the output voltage.
Select the capacitance to satisfy the
specification
for
output
voltage
overshoot/undershoot caused by current step
load. A steady-state output current IOUT
2
corresponds to inductor stored energy of ½ L IOUT .
 Vout 
Pc = Vf × Iout × 1 −

Vin 

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GENERAL OVERVIEW
A sudden decrease in IOUT forces the energy
surplus in L to be absorbed by COUT. This
causes an overshoot in output voltage that is
corrected by power switch reduced duty cycle.
Use the following equation to calculate COUT:
Input Capacitor Selection
Select the input capacitor for Voltage,
Capacitance, ripple current, ESR and ESL.
Voltage rating is nominally selected to be twice
the input voltage. The RMS value of input
capacitor current, assuming a low inductor
ripple current (IRIP), can be calculated from:
 I 2 2 − I12 

Cout = L × 
2
2 
Vos
Vout


Icin = Iout × D(1 − D )
Where:
L is the output inductance
I2 is the step load high current
I1 is the step load low current
Vos is output voltage including overshoot
VOUT is steady state output voltage
In general total input voltage ripple should be
kept below 1.5% of VIN (not to exceed 180mV).
Input voltage ripple has three components:
ESR and ESL cause a step voltage drop upon
turn on of the MOSFET. During on time
capacitor discharges linearly as it supplies
IOUT-Iin. The contribution to Input voltage ripple
by each term can be calculated from:
Output voltage undershoot calculation is more
complicated. Test results for SP6126 buck
circuits show that undershoot is approximately
equal to overshoot. Therefore above equation
provides a satisfactory method for calculating
COUT.
∆V , Cin =
Iout × Vout × (Vin − Vout )
fs × Cin × Vin 2
∆V , ESR = ESR(Iout − 0.5Irip )
Select ESR such that output voltage ripple
(VRIP) specification is met. There are two
components to VRIP: First component arises
from charge transferred to and from COUT
during each cycle. The second component of
VRIP is due to inductor ripple current flowing
through output capacitor’s ESR. It can be
calculated from:
∆V , ESL = ESL
(Iout − 0.5Irip )
Trise
Where Trise is the rise time of current through
capacitor
Total input voltage ripple is sum of the above:


1

Vrip = Irip × ESR 2 + 
 8 × Cout × fs 
2
∆V , Tot = ∆V , Cin + ∆V , ESR + ∆V , ESL
Where:
IRIP is inductor ripple current
fs is switching frequency
COUT is output capacitor calculated above
Note that a smaller inductor results in a higher
IRIP, therefore requiring a larger COUT and/or
lower ESR in order to meet VRIP.
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APPLICATION CIRCUITS
VIN
C1
10uF
Q1
Si2343DS
12V
2
1
Gate
GND
Vin
L1, IHLP-2525CZ
6.8uH, 60mOhm, 4.5A
Rs=1k
VOUT
LX
C7
0.1uF
6
SP6126
Ds
MBRA340T3G
3
C4
22uF
RZ
2K
VDR
3.3V
0-2.0A
R1
200k, 1%
CZ
62pF
4
GND
VFB
GND
R2
44.2k, 1%
5
D1 1N4148
SHDN
High=Of f
Figure 4- Application circuit for VIN=12V
VIN
C1
2.2uF
C2
2.2uF
M1, Si4447DY
72mOhm, 40V
GND
2
1
24-29V
Gate
C1, C2 CERAMIC, 50V
Vin
L1, Vishay IHLP-2525CZ
6.8uH, 4.5A, 60mOhm
Rs 1k
VOUT
LX
C7
0.1uF
6
SP6126
Ds, MBRA340T3
3A, 40V
3
RZ
2K
VDR
C4, ceramic
22uF, 6.3V
R1
200k, 1%
CZ
62pF
4
3.3V
0-2.0A
GND
VFB
GND
5
R2
44.2k, 1%
SHDN
D1 1N4148
Figure 5- Application circuit for VIN = 24-29V
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VIN
C1
10uF
C2
10uF
M1, Si2335DS
51mOhm, 12V
C3
10uF
4.5-5.5 V
GND
2
Gate
1
Vin
L1, Vishay IHLP-2525CZ
3.3uH, 6A, 30mOhm
Rs 1k
VOUT
LX
C7
0.1uF
6
SP6126
Ds, MBRA340T3
3A, 40V
3
C4, ceramic
22uF, 6.3V
RZ
2K
R1
200k, 1%
VDR
CZ
33pF
4
3.3V
0-3A
GND
VFB
GND
5
R2
44.2k, 1%
SHDN
D1 1N4148
High=Of f
Figure 6- Application circuit for VOUT = 4.5-5.5 V
TYPICAL PERFORMANCE CHARACTERISTICS
SP6126 Efficiency versus Iout, Vin=12V,Ta=25C
100
Efficiency (%)
90
80
70
Vout=3.3V
Vout=5V
Vout=2.5V
60
0.0
0.5
1.0
1.5
2.0
2.5
Iout (A)
Figure 7- Efficiency at VIN = 12 V
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 2008 Exar Corporation
TYPICAL PERFORMANCE CHARACTERISTICS
SP6126 Efficiency versus Iout, Vin=24V,Ta=25C
90
Efficiency (%)
80
70
Vout=3.3V
Vout=5V
60
50
0.0
0.5
1.0
1.5
2.0
2.5
Iout (A)
Figure 8- Efficiency at VIN = 24 V
SP6126 Efficiency versus Iout, Vin=5V,Ta=25C
100
Vout=2.5V
Vout=3.3V
Efficiency (%)
95
90
85
80
75
70
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Iout (A)
Figure 9- Efficiency at VIN = 5 V
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TYPICAL PERFORMANCE CHARACTERISTICS
Figure 10- Step load 1-2A,
ch1: VIN; ch2: VOUT; ch3: IOUT
Figure 11- Step load 0.3-2A,
ch1: VIN; ch2: VOUT; ch3: IOUT
Figure 12- Startup no load,
ch1: VIN ch2: VOUT, ch3: IOUT
Figure 13- Start up 2A,
ch1: VIN; ch2: VOUT; ch3: IOUT
Figure 14- Output ripple at 0A is 11mV,
ch1: VIN; ch2: VOUT; ch3: IOUT
Figure 15- Output ripple at 2A is 18mV,
ch1: VIN; ch2: VOUT; ch3: IOUT
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PACKAGE: 6PIN TSOT
EXAR
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ORDERING INFORMATION
Part Number
Temperature Range
Package
SP6126EK1-L………………………………….-40°C to +125°C…………….…(Lead Free) 6 Pin TSOT
SP6126EK1-L/TR..…………………………....-40°C to +125°C….………...….(Lead Free) 6 Pin TSOT
/TR = Tape and Reel
Pack Quantity for Tape and Reel is 2500
For further assistance:
Email:
EXAR Technical Documentation:
[email protected]
http://www.exar.com/TechDoc/default.aspx?
Exar Corporation
Headquarters and
Sales Office
48720 Kato Road
Fremont, CA 94538
main: 510-668-7000
fax: 510-668-7030
EXAR Corporation reserves the right to make changes to the products contained in this publication
in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility
for the use of any circuits described herein, conveys no license under any patent or other right, and
makes no representation that the circuits are free of patent infringement. Charts and schedules
contained here in are only for illustration purposes and may vary depending upon a user’s specific
application. While the information in this publication has been carefully checked; no responsibility,
however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications
where the failure or malfunction of the product can reasonably be expected to cause failure of the life
support system or to significantly affect its safety or effectiveness. Products are not authorized for
use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction
that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c)
potential liability of EXAR Corporation is adequately protected under the circumstances.
Nov07-08 RevG
SP6126: TSOT-6 PFET Buck Controller
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 2008 Exar Corporation