TI TPS61176RTER

TPS61176
www.ti.com
SLVSBM5 – DECEMBER 2012
High-Efficiency 6-Channel WLED Driver Supporting Single-Cell Li-Ion Battery Input
Check for Samples: TPS61176
FEATURES
DESCRIPTION
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The TPS61176 is a highly integrated multi-channel
WLED backlight driver for tablet or notebook PCs,
which can support single-cell battery input directly. It
comprises a high efficient boost converter with an
integrated 2A/40V power MOSFET and six current
sink regulators. In total, the device can drive up to 60
WLEDs with high current matching performance. In
addition, the boost automatically adjusts its output
voltage to the WLED forward voltage to improve
efficiency.
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2.7V to 6.5V VIN Voltage Range
2.7V to 24V Boost Input Voltage Range
Integrated 2A/40V MOSFET
1MHz Switching Frequency
Adaptive Boost Output to WLED Voltages
Six Current Sinks of 35mA Capability Each
±2% (Max) Current Accuracy
1.3% (Typ) Current Matching
Wide PWM Dimming Frequency Range
– from 100Hz to 22kHz
Mixed Dimming Mode: Automatic Switch
between Analog Dimming and PWM Dimming
– Programmable Switch Point: 25% / 12.5%
– Programmable PWM Dimming Mode: 22kHz
PWM Dimming / Direct PWM Dimming
Up to 14-bit Dimming Resolution
Support down to 1% Dimming Duty Cycle
Input PWM Glitch Filter
Up to 90% Efficiency
Driver for Input / Output Isolation PFET for
True Shutdown
Built-in Soft Start
Built-in WLED Open / Short Protection
Thermal Shutdown
Support 4.7µH Inductor
16L 3 mm x 3 mm QFN package
APPLICATIONS
•
•
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Tablet Backlight
Notebook Backlight
Backlight for Small and Media Form Factor
LCD Display with Single-Cell or Multi-Cell
Battery Input
TPS61176 adopts mixed dimming mode. The
automatic switch between PWM dimming at low
dimming duty cycle and analog dimming at high
dimming duty cycle increases the overall electrical-tooptical efficiency, reducing the power budget for
backlight remarkably. The switch point can be
programmed to 12.5% or 25% and the PWM dimming
mode can be programmed to fixed frequency
dimming or direct PWM dimming. TPS61176 supports
up to 14-bit dimming resolution, which avoids
potential flickering perception during the low
brightness dimming.
By providing a driver for an external isolation Pchannel MOSFET, TPS61176 can support true
shutdown. When the IC is disabled or the boost
output is short to ground, the isolation PFET can be
turned off to cut off the power path from battery to the
WLEDs, preventing any leakage current from the
battery. TPS61176 also integrates soft start, WLED
open and short protection and thermal shut down.
TPS61176 is in a 16 pin 3mm x 3mm QFN package,
providing a space-saving and high-performance
WLED driver solution.
TYPICAL APPLICATION
L1
4.7uH
2.7V ~ 6.5V
Up to 38V
D1
VIN
C1
2.2uF
SW
R2
1.3M
MODE / FAULT
PGND
C2
4.7uF
R3
1M
OVP
R4
43k
VIN
TPS61176
IFB1
IFB2
IFB3
IFB4
VLDO
C3
1uF
PWM
IFB5
IFB6
PWM / EN
ISET
R1
51k
COMP
GND
C4
0.47uF
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TPS61176
SLVSBM5 – DECEMBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
ORDERING
PACKAGE
PACKAGE
MARKING
TPS61176RTE
16-pin 3x3 QFN - RTE
PZJI
(1)
For the most current package and ordering information, see the
Package Option Addendum at the end of this document, or see the
TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
MIN
Voltage range (2)
ESD rating
UNIT
MAX
VIN, PWM/EN, MODE/FAULT
–0.3
7
V
SW
–0.3
40
V
IFB1 to IFB6
–0.3
20
V
All other pins
–0.3
3.6
V
HBM
4
kV
MM
200
V
2
kV
CDM
See Thermal Information
Table
Continuous power dissipation
Operating junction temperature range
–40
150
°C
Storage temperature range
–65
150
°C
(1)
(2)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
THERMAL METRIC (1)
TPS61176
RTE (16 PINS)
θJA
Junction-to-ambient thermal resistance (2)
θJCtop
Junction-to-case (top) thermal resistance (3)
44.4
θJB
Junction-to-board thermal resistance (4)
14.4
ψJT
Junction-to-top characterization parameter (5)
0.6
ψJB
Junction-to-board characterization parameter (6)
14.3
θJCbot
Junction-to-case (bottom) thermal resistance (7)
3.3
(1)
(2)
(3)
(4)
(5)
(6)
(7)
2
UNITS
43
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
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SLVSBM5 – DECEMBER 2012
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
Bias voltage to IC (Application as Figure 18)
2.7
6.5
V
Input voltage to inductor (Application as Figure 18)
2.7
24
V
VOUT
Output voltage range
Vin
38
V
L
Inductor
4.7
6.8
10
µH
CI
Input capacitor
1.0
2.2
CO
Output capacitor
2.2
4.7
CCOMP
COMP capacitor
FPWM_I
TA
TJ
VIN
µF
10
µF
0.47
1
µF
Input PWM signal frequency range
0.1
22
KHz
Operating ambient temperature
–40
85
°C
Operating junction temperature
–40
125
°C
ELECTRICAL CHARACTERISTICS
VIN = 3.6V, PWM/EN=high, IFB current=20mA, IFB voltage=450mV, TA = -40°C to +85°C, typical values are at TA = 25°C
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
VIN
Input voltage range
VIN_UVLO
VIN under voltage lockout threshold
VIN_HYS
VIN under voltage lockout hysteresis
Iq_VIN
Operating quiescent current into VIN
ISD
Shutdown current
VLDO
VLDO pin output voltage
2.7
VIN ramp down
VIN ramp up
6.5
2.4
2.5
2.65
2.7
250
Device enable, switching 1 MHz and no
load
3
1
4
PWM/EN = low, TA = 25°C
1
2
3.3
3.5
3
V
mV
PWM/EN = low
VIN = 3.6 V
V
mA
µA
V
PWM/EN
VH
PWM/EN Logic high
VL
PWM/EN Logic Low
RPD
PWM/EN pin internal pull-down resistor
tSD
PWM/EN logic low width to shutdown
1.2
V
0.4
400
PWM/EN from high to low
800
1600
20
V
kΩ
ms
CURRENT REGULATION
VISET
ISET pin voltage
PWM/EN logic high
KISET
Current multiplier
IISET = 20 μA
IFBx
Current accuracy
Km
(Imax – Imin) / (2 x IAVG)
IIFBx_leak
IFBx pin leakage current
IIFBx_max
Current sink max output current
IISET = 35 μA, each pin
TFBx_MINON
Current sink minimum on time
IISET = 20 μA, each pin
fdim
PWM dimming frequency
Mode 1 / Mode 3, 0°C to 70°C
IISET = 20 μA, 0°C to 70°C
IISET = 20 µA, –40°C to 85°C
1.02
1.04
1.06
V
1024
–2%
2%
–2.3%
IISET = 20 μA
2.3%
0.65%
VIFBx = 10 V, each pin
1.5
5
VIFBx = 5 V, each pin
0.5
2
35
mA
0.5
20
µA
22
µs
27
kHz
BOOST OUTPUT REGULATION
VIFBx_min
IFBx regulation voltage
Measured on VIFB(min), IISET = 20 μA
450
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ELECTRICAL CHARACTERISTICS (continued)
VIN = 3.6V, PWM/EN=high, IFB current=20mA, IFB voltage=450mV, TA = -40°C to +85°C, typical values are at TA = 25°C
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
0.25
0.4
Ω
2
µA
POWER SWITCH
RDS(on)
Switch MOSFET on-resistance
VIN = 3.6 V
ILEAK_SW
Switch MOSFET leakage current
VSW = 40 V
OSCILLATOR
fSW
Oscillator frequency
Dmax
Maximum boost switch duty cycle
0.8
1
1.2
93
MHz
%
MODE / FAULT
VMODE
MODE/FAULT pin voltage during mode
detection period
Tested as VIN - VMODE when mode
resistor is connected between VIN pin
and MODE/FAULT pin; Tested as VMODE
when mode resistor is connected
between MODE/FAULT pin and GND
IMODE_PD
MODE/FAULT pin pull down current after
mode detection
VMODE = 0.5 V, mode resistor is
connected between VIN pin and
MODE/FAULT pin
0.6
50
80
0.9
V
µA
OC, SC, OVP and SS
ILIM
Switch MOSFET current limit
VOVP_clamp
Output over voltage clamp threshold
2
2.5
3
A
1.47
1.5
1.53
V
OVP ramp up
1.568
1.6
1.632
OVP ramp down
1.519
1.55
1.581
VOVP_sd
Output over voltage shutdown threshold
VOVP_SC
Output short to GND detection threshold
VOVP_IFB
1st level IFB overvoltage threshold
IFBx current sink on
VOVP2_IFB
2nd level IFB overvoltage threshold
IFBx current sink on or off
OVP ramp up
OVP ramp down
90
V
mV
50
70
7
8.5
10
V
16
18
20
V
THERMAL SHUTDOWN
Tshutdown
Thermal shutdown threshold
160
°C
Thys
Thermal shutdown hysteresis
15
°C
4
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SLVSBM5 – DECEMBER 2012
DEVICE INFORMATION
MODE /
FAULT
VIN
SW
PGND
PIN ASSIGNMENT
16 PIN 3mm × 3mm RTE PACKAGE
(TOP VIEW)
16
15
14
13
PWM /
EN
1
12
OVP
VLDO
2
11
IFB1
TPS61176
IFB2
COMP
4
9
IFB3
6
7
8
GND
5
IFB4
10
IFB5
3
IFB6
ISET
PIN FUNCTIONS
PIN
NUMBER
1
PWM/EN
PWM dimming signal input and IC enable / disable control (1)
2
VLDO
Internal pre-regulator output. Connect a 1 µF ceramic capacitor to this pin
3
ISET
Full-scale LED current setting pin. Connect a resistor to the pin to program the full-scale LED current
4
COMP
Connect an external 0.47µF ceramic capacitor to this pin for the boost loop compensation.
IFB4 to IFB6,
IFB1 to IFB3
Regulated current sinks input pins
5~7,
9~11
(1)
DESCRIPTION
NAME
8
GND
Analog ground
12
OVP
This pin monitors the output voltage of the boost converter through external resistor divider
13
PGND
Power ground
14
SW
Drain of the internal power MOSFET
15
VIN
Supply input pin, provides power supply to the IC
16
MODE/FAULT
Multi-function pin. Use this pin to program the dimming mode. It also functions as a driver for external
isolation P-channel MOSFET (1)
See Detailed Description section for details.
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TYPICAL CHARACTERISTICS
Table 1. TABLE OF GRAPHS
TITLE
DESCRIPTION
FIGURE
Dimming Efficiency
VBAT = 3V, 3.6V, 4.2V, 5V; VO = 18V, 6s6p, 20mA/string; PWM Freq = 200Hz; Mode 1; L =
6.8µH
Figure 1
Dimming Efficiency
VBAT = 3V, 3.6V, 4.2V, 5V; VO = 21V, 7s6p, 20mA/string; PWM Freq = 200Hz; Mode 1; L =
6.8µH
Figure 2
Dimming Efficiency
VBAT = 3V, 3.6V, 4.2V, 5V; VO = 24V, 8s5p, 20mA/string; PWM Freq = 200Hz; Mode 1; L =
6.8µH
Figure 3
Dimming Efficiency
VBAT = 3V, 3.6V, 4.2V, 5V; VO = 27V, 9s4p, 20mA/string; PWM Freq = 200Hz; Mode 1; L =
6.8µH
Figure 4
Dimming Efficiency
VIN = 5V; VBAT = 3V, 3.6V, 4.2V, 5V, 7.2V, 9V, 12V, 15V; VO = 18V, 6s6p, 20mA/string; PWM
Freq = 200Hz; Mode 1; L = 6.8µH (refer to Figure 18)
Figure 5
Dimming Linearity
VBAT = 3V, 3.6V, 4.2V, 5V; VO = 21V, 7s6p; RISET = 53kΩ ; PWM Freq = 200Hz; Mode 1
Figure 6
Current Limit vs Input
Voltage
VO = 30V; TA = 25°C
Figure 7
Switching Waveform
VBAT = 3.6V; VO = 18V, 6s6p; RISET = 53kΩ; Duty = 100%; L = 6.8µH
Figure 8
Switching Waveform
VBAT = 3.6V; VO = 18V, 6s6p; RISET = 53kΩ; PWM Freq = 200Hz; Duty = 50%; L = 6.8µH;
Mode 1
Figure 9
Switching Waveform
VBAT = 3.6V; VO = 18V, 6s6p; RISET = 53kΩ; PWM Freq = 200Hz; Duty = 10%; L = 6.8µH;
Mode 1
Figure 10
Switching Waveform
VBAT = 3.6V; VO = 18V, 6s6p; RISET = 53kΩ; PWM Freq = 200Hz; Duty = 50%; L = 6.8µH;
Mode 2
Figure 11
Switching Waveform
VBAT = 3.6V; VO = 18V, 6s6p; RISET = 53kΩ; PWM Freq = 200Hz; Duty = 10%; L = 6.8µH;
Mode 2
Figure 12
Startup Waveform
VBAT = 3.6V; VO = 18V, 6s6p; RISET = 53kΩ; Duty = 100%; L = 6.8µH
Figure 13
Startup Waveform
VBAT = 3.6V; VO = 18V, 6s6p; RISET = 53kΩ; PWM Freq = 200Hz; Duty = 10%; L = 6.8µH;
Mode 1
Figure 14
EFFICIENCY
vs
DIMMING DUTY CYCLE
EFFICIENCY
vs
DIMMING DUTY CYCLE
100
100
VBAT = 5 V
VBAT = 5 V
90
80
VBAT = 3.6 V
Efficiency (%)
Efficiency (%)
90
VBAT = 4.2 V
VBAT = 3 V
70
VO = 18 V, 6s6p,
20 mA/string
60
VBAT = 3.6 V
80
VBAT = 4.2 V
VBAT = 3 V
70
VO = 21 V, 7s6p,
20 mA/string
60
50
50
0
20
40
60
Dimming Duty Cycle (%)
80
100
0
C001
Figure 1.
6
20
40
60
Dimming Duty Cycle (%)
80
100
C002
Figure 2.
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EFFICIENCY
vs
DIMMING DUTY CYCLE
EFFICIENCY
vs
DIMMING DUTY CYCLE
100
100
VBAT = 5 V
VBAT = 5 V
90
80
Efficiency (%)
Efficiency (%)
90
VBAT = 3.6 V
VBAT = 3 V
VBAT = 4.2 V
70
VO = 24 V, 8s5p,
20 mA/string
60
80
70
VBAT = 3 V
VO = 27 V, 9s4p,
20 mA/string
60
50
50
0
20
40
60
80
100
Dimming Duty Cycle (%)
0
20
40
100
100
C004
DIMMING LINEARITY
140
VBAT = 15 V
120
IO - Output Current (mA)
95
Efficiency (%)
80
Figure 4.
EFFICIENCY
vs
DIMMING DUTY CYCLE
90
VBAT = 5 V
85
VBAT = 7.2 V
VBAT = 4.2 V
80
VBAT = 9 V
VBAT = 3.6 V
VBAT = 12 V
VO = 18 V, 6s6p,
20 mA/string, VIN = 5 V
VBAT = 3 V
VBAT = 5 V
100
80
VBAT = 4.2 V
60
40
VBAT = 3.6 V
20
70
VBAT = 3 V
0
0
20
40
60
80
100
Dimming Duty Cycle (%)
0
40
60
80
100
C006
Figure 6.
SWITCH CURRENT LIMIT
vs
INPUT VOLTAGE
SWITCHING WAVEFORM
2.7
Output
Voltage
100mV/div
AC
VO = 30 V
2.5
20
Dimming Duty Cycle (%)
C005
Figure 5.
ILIM - Switch Current Limit (A)
60
Dimming Duty Cycle (%)
C003
Figure 3.
75
VBAT = 4.2 V
VBAT = 3.6 V
2.3
SW
Voltage
10V/div
DC
2.1
Inductor
Current
1A/div
DC
1.9
1.7
Output
Current
100mA/div
DC
1.5
2.7
3.0
3.3
3.6
3.9
4.2
VI - Input Voltage (V)
4.5
4.8
C007
Figure 7.
DUTY = 100%
t - Time - 1µs/div
Figure 8.
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SWITCHING WAVEFORM
SWITCHING WAVEFORM
Output
Voltage
100mV/div
AC
Output
Voltage
100mV/div
AC
SW
Voltage
10V/div
DC
SW
Voltage
10V/div
DC
Inductor
Current
1A/div
DC
Inductor
Current
1A/div
DC
Output
Current
100mA/div
DC
PWM FREQ = 200HZ; DUTY = 50%; MODE 1
Output
Current
100mA/div
DC
t - Time - 1µs/div
t - Time – 20µs/div
Figure 9.
Figure 10.
SWITCHING WAVEFORM
SWITCHING WAVEFORM
Output
Voltage
100mV/div
AC
Output
Voltage
100mV/div
AC
SW
Voltage
10V/div
DC
SW
Voltage
10V/div
DC
Inductor
Current
1A/div
DC
Inductor
Current
1A/div
DC
Output
Current
100mA/div
DC
Output
Current
50mA/div
DC
PWM FREQ = 200HZ; DUTY = 50%; MODE 2
PWM FREQ = 200HZ; DUTY = 10%; MODE 2
t - Time - 2ms/div
t - Time - 1µs/div
Figure 11.
Figure 12.
STARTUP WAVEFORM
PWM
Voltage
2V/div
DC
Output
Voltage
10V/div
DC
PWM
Voltage
1V/div
DC
Output
Voltage
10V/div
DC
STARTUP WAVEFORM
PWM FREQ = 200HZ; DUTY = 10%; MODE 1
Inductor
Current
500mA/div
DC
Inductor
Current
500mA/div
DC
Output
Current
100mA/div
DC
DUTY = 100%
Output
Current
50mA/div
DC
t - Time - 10ms/div
t - Time - 10ms/div
Figure 13.
8
PWM FREQ = 200HZ; DUTY = 10%; MODE 1
Figure 14.
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SLVSBM5 – DECEMBER 2012
FUNCTIONAL BLOCK DIAGRAM
Optional
L
VIN
C1
2.2uF
R2
82k
Diode
C6
2.2uF
C5
100pF
C3
4.7uF
SW
MODE/FAULT
VIN
VLDO
C2
1uF
VOUT
R3
1M
Dimming Mode
Detection
OVP
Fault protection
OVC
UVLO /
Internal
Regulator
R
OVP
Q
S
OCP
Slope
Compensation
OSC
R4
43k
Short to GND
Protection
VOVP
S
PGND
Detector
Comp
COMP
regulation
Error
Amp VOVP
IFB no use
Open /Short
LED
OVP
C4
0.47uF
IFB1
IFB2
IFB3
IFB4
IFB5
IFB6
Shut Down
IFB1
EN
Disable
Detection
RSET
Dimming Mode
Selection
LED
Current
Current
Mirror
Dimming
Control
Analog
Dimming
R1
51k
PWM/EN
PWM
decoding
circuit
OSC
Duty
Control
Circuit
PWM
dimming
PWM Signal
Generator
EA
Current Sink
GND
Current Sink
IFB2
Current Sink
IFB3
Current Sink
IFB4
Current Sink
IFB5
Current Sink
IFB6
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DETAILED DESCRIPTION
TPS61176 is a high-efficiency, multi-channel WLED driver for tablet and notebook backlighting applications. As
more and more WLED diodes are required to provide high brightness backlighting for high resolution panels, the
WLED diodes must be arranged in parallel strings. Having more WLED diodes in a string reduces the number of
parallel strings and thus improves overall current matching; however, the efficiency of the boost regulator drops
due to the high output voltage. Therefore, six current sink regulators of high current matching capability are
integrated in TPS61176 to provide the WLED connection flexibility and to improve the overall power efficiency.
The six channels can also be combined as 2 or 3 channels to drive high brightness WLED diodes.
TPS61176 has integrated all of the key function blocks to power and control up to 60 WLED diodes. The device
consists of a boost converter with 2A/40V power MOSFET, six 35mA current sink regulators and protection
circuit for over-current, over-voltage, open LED, short LED and output short circuit failures.
TPS61176 accepts PWM dimming signal and implements mixed dimming mode. When the dimming duty cycle is
high, analog dimming mode works, under which the IC controls the DC current of the WLED diodes to realize
brightness dimming; when the dimming duty cycle is low, the IC switches to PWM dimming mode automatically,
so the current of WLED diodes is turned on and off in a high frequency to realize dimming. The automatic switch
between analog and PWM dimming modes can leverage the advantages of the two modes: increasing the
electrical-to-optical efficiency by analog dimming and avoiding potential color shit issue. The switch point can be
programmed to either 25% or 12.5% by the external resistor connected at MODE/FAULT pin.
SUPPLY VOLTAGE
TPS61176 can support single-cell Li-ion battery input directly. It has a built-in linear regulator to generate supply
for internal analog and logic circuits. The VLDO pin, output of the regulator, should be connected to a 1 µF
bypass capacitor for the regulator to be controlled in a stable loop. VLDO pin does not have current sourcing
capability for external use.
If TPS61176 is used in a multi-cell battery system, the battery cannot be connected to VIN pin directly. In this
case, connect a 3.3V or 5V power rail to bias the VIN pin and connect the battery voltage to the inductor. The
VIN pin only consumes less than 3mA for normal operation. Please refer to APPLICATION INFORMATION
section for more details.
BOOST CONVERTER
The boost converter of TPS61176 has a fixed switching frequency of 1MHz and uses current-mode control. A
2A/40V power MOSFET is integrated so TPS61176 has a strong output driving capability. A 0.47µF~1µF
capacitor should be connected at COMP pin to ensure stable output over the full input and output voltage ranges
assuming the recommended inductance and output capacitance values shown in the Recommended Operating
Conditions section are used. COMP pin is very sensitive, so careful layout is required to make sure no noise is
coupled to it.
The output voltage of the boost is automatically set by the IC to minimize the voltage drop across the IFBx (IFB1
~ IFB6) pins. Normally the voltage across each WLED string is not same, so the voltages at IFBx pins are
different. The IC regulates the lowest IFBx voltage to 450mV, and consistently adjusts the boost output voltage to
account for any change of WLED's forward voltage drop. If the input voltage is higher than the strings' forward
voltage drop (e.g. at low duty cycles), the boost converter can’t regulate the output due to its minimum duty cycle
limitation. In this case, increasing the number of WLED diodes in series is helpful to provide enough headroom
for the converter to boost the voltage.
CURRENT SINKS
The six current sink regulators embedded in TPS61176 can output up to 35mA current each. By regulating the
current sinks, TPS61176 controls the current of the WLED strings to realize brightness dimming. The full-scale
current per channel is programmed by the resistor at ISET pin according to Equation 1.
VISET _ full
IFBx _ full =
´ KISET
RISET
(1)
Where:
IFBx_full, full-scale current per channel
KISET = 1024 (Current multiple)
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VISET_full = 1.04V (ISET pin voltage under 100% dimming duty cycle)
RISET = ISET pin resistor
IFBx PIN UNUSED
If less than six channels are used, a user can easily disable the unused channel(s) by shorting the corresponding
IFBx pin(s) to ground. TPS61176 detects IFBx pins' short status during startup process and will disable the
unused channel(s) before the boost converter starts switching.
ENABLE AND STARTUP
TPS61176 receives PWM signal at PWM/EN pin to implement the dimming as well as to enable and disable the
IC. When PWM signal (high logic or PWM pulse) is input, the IC is enabled automatically; when the PWM signal
is pulled low for more than 20ms, the IC is disabled and enters into shutdown mode. In shutdown mode, the
boost converter stops switching, and the MODE/FAULT pin is internally pulled to VIN to turn off external isolation
MOSFET for true shutdown. The input supply current at VIN pin is 4µA (max) in shutdown mode. In order to
avoid fault triggered shut down during dimming, PWM dimming signal should have a higher frequency than
100Hz.
Once enabled by PWM input, TPS61176 enters startup process. The internal regulator is enabled first to supply
current to internal circuits. Then TPS61176 detects the RMODE at MODE/FAULT pin to set the dimming mode.
TPS61176 can detect if the mode resistor is connected between VIN pin and MODE/FAULT pin or connected
between MODE/FAULT pin and GND pin. If the mode resistor is detected to be between VIN pin and
MODE/FAULT pin, which indicates an external isolation P-channel MOSFET is connected, the MODE/FAULT pin
will be pulled down by an internal current sink to turn on the isolation MOSFET after the detection process. The
IC also checks the status of all IFBx pins (short to ground or not) to disable any unused channels. There is no
special time sequence requirement of VIN and PWM signals for startup. If PWM signal is input first, TPS61176
starts up when VIN powers up.
The dimming mode and IFBx status detection process lasts about 4ms, during which the MODE/FAULT pin
outputs a high voltage (VIN – 0.6V typical) to keep the isolation MOSFET off. When the 4ms detection window
ends, an internal current sink pulls MODE/FAULT pin low to turn on the isolation MOSFET. Then another 4ms
time window starts and at the end of the window the IC detects the OVP pin voltage. If the OVP voltage VOVP is
still lower than VOVP_SC ramp up threshold (90mV typ.), which normally indicates output short to ground issue
happens, the boost remains off and the MODE/FAULT pin is pulled up to VIN immediately by an internal resistor
to turn off the isolation MOSFET. In this case, the IC restarts only after a power-on reset (POR) toggling or PWM
toggling. POR toggling means the VIN pin voltage is pulled below UVLO falling threshold first and then pulled
above UVLO rising threshold to restart the IC; PWM toggling means pulling PWM/EN low for more than 20ms to
disable the IC and then apply PWM signal (high logic or PWM pulse) to restart the IC. If OVP voltage VOVP is
higher than VOVP_SC ramp up threshold, indicating no short to ground issue is detected, boost starts switching to
raise the output voltage. Soft start is implemented by gradually ramping up the reference voltage of the error
amplifier to prevent voltage over-shoot and in-rush current. The capacitor at COMP pin can adjust the soft start
speed. Larger capacitance leads to slower start up. 0.47µF~1µF COMP capacitor is recommended.
BRIGHTNESS DIMMING CONTROL
TPS61176 receives the PWM dimming signal at PWM/EN pin. An internal PWM decoding circuit detects the on
time and the period of the PWM signal and calculates the duty cycle information. Then the IC controls the current
sink regulators' output current according to the duty cycle to realize the brightness dimming.
TPS61176 supports mixed dimming mode, which leverages the advantages of both analog dimming and PWM
dimming modes. When the dimming duty cycle is high, analog dimming mode is auto-implemented, increasing
the electrical-to-optical efficiency and reducing the power budget for the backlight; when the dimming duty cycle
is low, PWM dimming mode is auto-implemented, eliminating potential color shift effect which normally happens
when the DC current of WLED diode goes low. The switch point between analog dimming mode and PWM
dimming mode can be programmed by the mode resistor connected at MODE/FAULT pin.
TPS61176 provides four dimming mode options as shown in Table 2. Besides two different switch point options:
25% or 12.5%, TPS61176 also offers two different PWM dimming mode options: direct PWM dimming or 22kHz
fixed frequency PWM dimming. Please refer to DIMMING MODE for the details of different dimming modes.
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Different mode resistor values set the different dimming modes. 5% or higher precision resistor should be used
for the mode resistor. When an isolation P-channel MOSFET is connected, the mode resistor must be connected
between VIN pin and MODE/FAULT pin; when the isolation MOSFET is not connected, the mode resistor should
be connected between MODE/FAULT pin and ground. If there is no resistor connected at MODE/FAULT pin,
which is only allowed when the isolation MOSFET is not connected, default mode (Mode 1) will be selected.
Please refer to APPLICATION INFORMATION section for more details.
Table 2. Dimming Mode Setting
SWITCH POINT BETWEEN
ANALOG AND PWM DIMMING
MODE
MODE RESISTOR
DIMMING MODE
Mode 1
(Default mode)
1.3 MΩ (5%)
Analog dimming + 22 kHz fixed frequency PWM
dimming
Mode 2
620 kΩ (5%)
Analog dimming + Direct PWM dimming
Mode 3
220 kΩ (5%)
Analog dimming + 22 kHz fixed frequency PWM
dimming
12.5%
Mode 4
82 kΩ (5%)
Analog dimming + Direct PWM dimming
12.5%
25%
25%
DIMMING MODE
ANALOG DIMMING MODE
In analog dimming mode, the brightness dimming is realized by controlling the DC current of WLED diodes.
Since the forward voltage of a WLED diode drops when its DC current reduces, the required output voltage can
become lower when dimming duty cycle goes low, reducing the power budget for the backlight and allowing more
system power saving.
In analog dimming mode, the current of IFBx is regulated according to Equation 2:
VISET _ full
V
IFBx = ISET ´ KISET =
´ KISET ´ Duty
RISET
RISET
(2)
Where:
IFBx, current per string
VISET, (ISET pin voltage during analog dimming)
KISET = 1024 (Current multiple)
VISET_full = 1.04V (ISET pin voltage with 100% dimming duty cycle)
RISET = ISET pin resistor
Duty = duty cycle of the PWM signal
PWM DIMMING
When the dimming duty cycle is below the switch point, PWM dimming mode is automatically implemented. In
this mode, the current sink regulators are turned on and off according to the PWM duty cycle information, so the
illumination of WLEDs is intermittent. At frequencies higher than human eyes' critical flicker frequency, the
brightness is the same as the average brightness of the fluctuating light, thus controlling the duty cycle can
realize the brightness dimming.
While a current sink regulator is turned on during PWM dimming, its output current is equal to the DC current at
the switch point. For example, if the switch point is set to 25%, the regulator's output current during the "ON"
phase is equal to IFBx_full x 25%, and the "ON" phase's duty cycle Duty' is equal to Duty / 25%, where Duty is the
input PWM signal's duty cycle information. Then the average current during PWM dimming can be still equal to
IFBx_full x Duty. This design is in order to keep the brightness consistency between analog dimming and PWM
dimming and avoid any abrupt brightness change around the switch point. If the switch point is set to 12.5%, the
regulator's output current during the "ON" phase is equal to IFBx_full x 12.5%, and the "ON" phase's duty cycle
Duty' is equal to Duty / 12.5%. Refer to Figure 15 for a graphical explanation.
12
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PWM Dimming
Analog Dimming
D=100%
D=80%
D=60%
D=25%
D=12.5%
D=6.25%
PWM Input
TON
TPER
IFBx_Full
80%
60%
IFBx
50%
D’=25%
D’=50%
25%
0A
(a). Mixed Dimming Mode with switch point = 25%
Analog
Dimming
D=100%
D=80%
D=60%
PWM
Dimming
D=25%
D=12.5%
D=6.25%
PWM Input
TON
TPER
IFBx_Full
80%
60%
IFBx
50%
D’=50%
25%
12.5%
0A
(b). Mixed Dimming Mode with switch point = 12.5%
Figure 15. Mixed Dimming Mode
Generally, the average current of an LED string in PWM dimming mode is equal to
VISET_full
IFBx_PWM =
´ KISET ´ Duty
RISET
(3)
Where:
IFBx_PWM, average current per string in PWM dimming mode
VISET_full = 1.04V (ISET pin voltage with 100% dimming duty cycle)
KISET = 1024 (Current multiple)
RISET = ISET pin resistor
Duty = duty cycle of the PWM signal
The frequency of the current sink regulators' ON and OFF control depends on which PWM dimming mode is set.
TPS61176 provides two different PWM dimming modes: direct PWM dimming mode and 22kHz fixed frequency
PWM dimming mode.
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In direct PWM dimming mode, the current sinks are turned ON and OFF with the same frequency detected from
the input PWM signal. The advantage of this mode is the dimming frequency can be adjusted freely. In addition,
it is easy to achieve high dimming resolution in direct PWM dimming mode: with lower input PWM frequency, the
higher dimming resolution can be detected and output. For example, when the input PWM frequency is 100Hz,
14-bit resolution can be achieved; when the input PWM frequency is 20kHz, 9-bit resolution achieved. So if high
resolution is required, 100Hz or 200Hz dimming frequency is recommended. TPS61176 is designed to minimize
the AC ripple on the output capacitor during PWM dimming. Careful passive component selection is also crucial
to minimize AC ripple on the output capacitor. In order to further avoid the potential audible noise, input PWM
frequency out of audible frequency range is recommended. See APPLICATION INFORMATION for more
information.
In 22kHz fixed frequency PWM dimming mode, current sinks are turned on and off according to the duty cycle
information detected from the input PWM signal but with an internally fixed frequency – 22kHz. This mode
facilitates the application where the input PWM signal frequency can’t be adjusted outside the audio frequency
range. So in this mode the audible noise can be eliminated completely.
Human eyes are much more sensitive to the brightness change at low brightness compared to at high
brightness, so in order to improve the visual experience and avoid any potential flickering perception, high
resolution dimming is implemented in PWM dimming mode. TPS61176 can achieve up to 14-bit dimming
resolution during the PWM dimming. Generally, higher resolution can be achieved with lower input PWM
frequency. Please refer to Table 3 for detailed dimming resolution information.
Table 3. Dimming Resolution Information in PWM Dimming Mode
DIMMING MODE
INPUT PWM FREQUENCY
DIMMING RESOLUTION IN PWM DIMMING MODE
100Hz ~ 4.5kHz
12-bit
4.5kHz ~ 9kHz
11-bit
9kHz ~ 18kHz
10-bit
18kHz ~ 20kHz
9-bit
100Hz ~ 1kHz
14-bit
Mode 1
Mode 2
Mode 3
Mode 4
1kHz ~2kHz
13-bit
2kHz ~ 4kHz
12- bit
4kHz ~ 8kHz
11-bit
8kHz ~ 16kHz
10-bit
16kHz ~ 20kHz
9 -bit
100Hz ~ 5kHz
12-bit
5kHz ~ 10kHz
11-bit
10kHz ~ 20kHz
10-bit
100Hz ~ 1.2kHz
14-bit
1.2kHz ~2.4kHz
13-bit
2.4kHz ~ 4.8kHz
12- bit
4.8kHz ~ 9.6kHz
11-bit
9.6kHz ~ 20kHz
10-bit
OVER VOLTAGE PROTECTION
The output voltage of the boost converter is detected by OVP pin. The Over-Voltage-Protection threshold can be
programmed by an external resistor divider (R3 and R4 in Typical Application Circuits), allowing the usage of low
voltage rating Schottky diode in low output voltage application. The correct divider ratio is important for optimum
operation of TPS61176. Use the following guidelines to choose the divider value. It can be noise sensitive if
Rupper and Rdown have high impedance. Careful layout is required. Also, choose lower resistance values for Rupper
and Rdown when power dissipation allows.
Step1. Determine the maximum output voltage, VOUT, for the system according to the number of series WLEDs.
Step2. Select Rupper resistor value (1 MΩ for a typical application; a lower value such as 100 kΩ for a noisy
environment).
Step3. Calculate Rdown by using Equation 4.
14
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æ Rupper
ö
VOUT = çç
+ 1÷÷ ´ VOVP _ clamp
è Rdown
ø
(4)
Where: VOVP_clamp = 1.5 V
When the over-voltage threshold VOVP_clamp is reached, TPS61176 detects if there is any LED string open first by
sensing whether there is current on IFBx pin. If any string is open, the corresponding current sink is disabled and
removed from regulation. Subsequently, the output voltage drops down and will be regulated to a voltage for the
connected WLED strings. The IFBx current of the connected WLED strings keeps in regulation during the whole
transition. If an open string is reconnected again, a POR toggling or PWM toggling is required to reactivate a
previously deactivated string. TPS61176 shuts down and keeps off when it detects that all of the WLED strings
are open. In this case, a POR toggling or PWM toggling is required to restart the IC. If there isn’t any string open,
TPS61176 regulates the boost output at the over-voltage threshold.
If the output voltage can’t be regulated at the value set by Equation 4 and keeps rising, once the OVP pin voltage
exceeds VOVP_sd rising threshold (1.6V typical), the boost stops switching. When the OVP voltage falls below
VOVP_sd falling threshold (1.55V typical), the boost recovers to switch. During the process, the IFBx current of the
connected WLED strings keeps in regulation.
CURRENT SINK OPEN PROTECTION
If any IFBx pin voltage is detected to exceed the 1st level IFB over-voltage threshold (8.5V typical) when its
current sink is turned on, TPS61176 turns off this current sink and removes it from output regulation loop. The
current regulation of the remaining IFBx pins is not affected. This situation often occurs when there are several
shorted WLED diodes in one string. WLED mismatch typically does not create such large voltage difference
among WLED strings. TPS61176 shuts down when it detects that all of the IFBx pin voltages exceed the
threshold. In this case, a POR toggling or PWM toggling is required to restart the IC.
If any IFBx pin voltage is detected to exceed the 2nd level IFB over-voltage threshold (18V typical) no matter the
current sink is turned on or off, TPS61176 shuts down immediately to avoid potential over stress damage at IFBx
pin. A POR toggling or PWM toggling is required to restart the IC.
OVER CURRENT AND SHORT CIRCUIT PROTECTION
TPS61176 has a pulse-by-pulse over-current limit of 2.0A (min). The boost power MOSFET is turned off when
the inductor current reaches this current limit threshold and it remains off until the beginning of the next switching
cycle. This protects TPS61176 and external component under overload conditions.
Under severe over-load or short circuit conditions, if the OVP pin voltage is detected below VOVP_SC ramp down
threshold (70mV typical), TPS61176 shuts down and the MODE/FAULT pin is pulled to VIN by an internal switch
immediately. As a result, the external isolation MOSFET can be turned off at once, cutting off the power path
from input to output. The IC restarts after a POR toggling or PWM toggling.
THERMAL PROTECTION
An internal thermal shutdown turns off the device when the typical junction temperature of 160°C is exceeded.
The device is released from shutdown automatically when the junction temperature decreases by 15°C.
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APPLICATION INFORMATION
INDUCTOR SELECTION
Because the selection of the inductor affects power supply’s steady state operation, transient behavior, loop
stability and the boost converter efficiency, the inductor is the most important component in switching power
regulator design. There are three specifications most important to the performance of the inductor: inductance
value, DC resistance and saturation current. TPS61176 is designed to work with inductor values between 4.7µH
and 10µH. A 4.7µH inductor is typically available in a smaller or lower profile package, while a 10µH inductor
produces lower inductor ripple. If the boost output current is limited by the over-current protection of the IC, using
a 10µH inductor can maximize the controller’s output current capability.
In a boost regulator, the inductor DC current can be calculated as Equation 5.
IDC =
Vout ´ Iout
Vin ´ h
(5)
Where
Vout = boost output voltage
Iout = boost output current
Vin = boost input voltage
η = power conversion efficiency, use 85% for TPS61176 normal applications
The inductor current peak to peak ripple can be calculated as Equation 6.
IPP =
1
1
1 ö
æ
L´ç
+
÷ ´ FS
è Vout - Vin Vin ø
(6)
Where
IPP = inductor peak-to-peak ripple
L = inductor value
FS = Switching frequency
Vout = boost output voltage
Vin = boost input voltage
Therefore, the peak current seen by the inductor is calculated with Equation 7.
IP = IDC +
IPP
2
(7)
Select the inductor with saturation current over the calculated peak current. To calculate the worse case inductor
peak current, use minimum input voltage, maximum output voltage and maximum load current.
Converter efficiency is dependent on the resistance of its high current path and switching losses associated with
the internal switch and external power diode. Although TPS61176 has optimized the internal switch resistance,
the overall efficiency is affected by the inductor’s DC resistance (DCR). Lower DCR improves efficiency.
However, there is a trade off between DCR and inductor footprint. Furthermore, shielded inductors typically have
higher DCR than unshielded ones.
Note that inductor values can have ±20% tolerance with no current bias. When the inductor current approaches
saturation level, its inductance can decrease 20% to 35% from the 0A value depending on how the inductor
vendor defines saturation. Table 4 lists the recommended inductors.
Table 4. Recommended Inductor for TPS61176
16
Part Number
L (µH)
DCR (mΩ)
Isat (A)
Size (L x W x H mm)
Vendor
PCMB051H-4R7MS
PCMB051H-6R8MS
4.7
78
4.0
5.4 x 5.2 x 1.8
Cyntec
6.8
107
3.4
5.4 x 5.2 x 1.8
Cyntec
PCMB051H-100MS
10
140
3
5.4 x 5.2 x 1.8
Cyntec
LPS4018-472ML
4.7
125
1.9
4.0 x 4.0 x 1.8
Coilcraft
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Table 4. Recommended Inductor for TPS61176 (continued)
Part Number
L (µH)
DCR (mΩ)
Isat (A)
Size (L x W x H mm)
Vendor
LPS4018-103ML
10
200
1.3
4.0 x 4.0 x 1.8
Coilcraft
A915AY – 4R7M
4.7
38
1.87
5.2 x 5.2 x 3
TOKO
A915AY – 100M
10
75
1.24
5.2 x 5.2 x 3
TOKO
OUTPUT CAPACITOR SELECTION
The output capacitor is mainly selected to meet the requirement for the loop stability and the output ripple. The
loop is designed to be stable with an output capacitor within 2.2µF ~ 10µF range. This output ripple is related to
the capacitor’s capacitance and its equivalent series resistance (ESR). Due to its low ESR, the ripple caused by
ESR could be neglected for ceramic capacitors. Assuming a capacitor with zero ESR, the minimum capacitance
needed for a given ripple can be calculated with Equation 8.
Cout =
(Vout - Vin) ´ Iout
Vout ´ FS ´ Vripple
(8)
Where: Vripple = peak-to-peak output ripple.
Note that capacitor degradation increases the ripple much. Select the capacitor which has less degradation at
the output voltage. If the output ripple is too large, change a bigger capacitor could be helpful. Normally, X5R
±10% or better capacitors are recommended.
SCHOTTKY DIODE SELECTION
TPS61176 demands a low forward voltage, high-speed rectification and low capacitance schottky diode for
optimum efficiency. Ensure that the diode average and peak current rating exceeds the average output current
and peak inductor current. In addition, the diode’s reverse breakdown voltage must exceed the open LED
protection voltage. Vishay SS2P5, MSS1P4 and NXP PMEG4010EPK are recommended for TPS61176.
ISOLATION FET SELECTION
TPS61176 provides a gate driver at MODE/FAULT pin to drive an external P-channel MOSFET which can act as
an isolation MOSFET. When the IC is disabled or output short to ground issue happens, MODE/FAULT pin can
turn off the isolation MOSFET to cut off the power path from the battery to the output. The source of the
MOSFET should be connected to the battery input, and an external resistor must be connected between the
source and gate of the MOSFET to keep the FET off when TPS61176 is disabled. This gate resistor also acts as
a mode resistor to select the dimming mode. To turn on the isolation MOSFET, an internal current sink pulls
MODE/FAULT pin low. When output short to ground fault happens, an internal switch pulls up the MODE/FAULT
pin to VIN, turning off the isolation MOSFET immediately.
When the isolation FET is turned on during startup, an inrush current will flow through the MOSFET from battery
to charge the output capacitor. If the peak current is too large, a capacitor can be connected between the source
and the gate of the isolation MOSFET to control the turning on speed (C5 in Figure 16), thus controlling the
inrush current. Normally, 100pF ~ 1nF capacitor is recommended.
During output short to ground protection process, the catch diode (D2 in Figure 16) may be forward biased to
provide the continuous current of the inductor when the isolation FET is turned off. In this case, the drain of the
isolation FET swings below ground. The voltage across the isolation FET can be momentarily greater than the
input voltage. Therefore, select at least 10V maximum input MOSFET. Adding a capacitor parallel with D2 (refer
to Figure 16) could also help reduce the voltage across MOSFET when this failure happens. The on resistance
of the MOSFET has large impact on power conversion efficiency since the MOSFET carries the input current.
Select a MOSFET with Rds(on) less than 100mΩ to limit the power losses. In order to detect larger than 1M
RMode correctly, the gate leakage of isolation MOSFET should be less than 0.1µA.
In multi-cell battery input applications, if the isolation MOSFET is connected, the voltage at MODE/FAULT pin
may exceed its maximum rating voltage 7V when the IC is disabled or output short to ground issue happens. In
order to prevent this over stress damange, isolation MOSFET can't be connected.
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AUDIBLE NOISE REDUCTION
The controller’s output voltage also ripples due to the load transient that occurs during PWM dimming. If the
PWM dimming frequency is in the audible frequency range, the ripple can produce audible noises on the output
ceramic capacitor. There are two ways of reducing or eliminating the audible noise. The first way is to reduce the
amount of the output ripple, and therefore minimize the audible noise. TPS61176 adopts a patented technology
to limit this type of output ripple even with the minimum recommended output capacitance. The second way is to
select PWM dimming frequency outside the audible frequency range to eliminate the audible noise completely.
However, in some applications, the input PWM signal’s frequency range couldn’t be adjusted outside the audible
frequency range. To solve this problem, TPS61176 provides the 22kHz fixed frequency PWM dimming mode. In
this dimming mode, no matter what the input PWM frequency is, the PWM dimming is implemented at 22kHz,
which is outside the audible frequency range, saving the effort to adjust the input PWM frequency.
LAYOUT CONSIDERATION
As for all switching power supplies, especially those providing high current and using high switching frequencies,
layout is an important design step. If layout is not carefully done, the regulator could show instability as well as
EMI problems. Therefore, use wide and short traces for high current paths. The input capacitor, C1 in the typical
application circuit Figure 16, needs not only to be close to the VIN pin, but also to the GND pin in order to reduce
the input ripple seen by the IC. It should also be placed close to the inductor. C3 is the filter and noise
decoupling capacitor for the internal linear regulator powering the internal digital circuits. It should be placed as
close as possible between the VLDO and GND pins to prevent any noise insertion to the digital circuits. The SW
pin carries high current with fast rising and falling edges. Therefore, the connection between the SW pin to the
inductor and schottky diode should be kept as short and wide as possible. The trace between schottky diode and
the output capacitor C2 should also be as short and wide as possible. It is also beneficial to have the ground of
the output capacitor C2 close to the PGND pin since there is a large ground return current flowing between them.
When laying out signal grounds, it is recommended to use short traces separated from power ground traces, and
connect them together at a single point, for example on the thermal pad. The thermal pad needs to be soldered
on to the PCB and connected to the GND pin of the IC. An additional thermal via can significantly improve power
dissipation of the IC.
18
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TPS61176
www.ti.com
SLVSBM5 – DECEMBER 2012
TYPICAL APPLICATION CIRCUITS
SINGLE-CELL BATTERY INPUT APPLICATION
TPS61176's VIN pin voltage range is from 2.7V to 6.5V, so it can support single-cell battery input directly. If
isolation MOSFET is connected, the mode resistor must be connected between VIN pin and MODE/FAULT pin
as shown in Figure 16; if isolation MOSFET is not connected, the mode resistor can be connected between VIN
pin and GND as shown in Figure 17. If there is no resistor connected at MODE/FAULT pin, which is only allowed
when the isolation MOSFET is not connected, default mode (Mode 1) will be selected.
2.7V ~ 6.5V
L1
4.7uH
Q1
Up to 38V
D1
VIN
C1
2.2uF
R2
1.3M
C6
2.2uF
C5
D2
100pF
SW
MODE / FAULT
C2
4.7uF
R3
1M
PGND
OVP
R4
43k
VIN
TPS61176
IFB1
IFB2
IFB3
IFB4
VLDO
C3
1uF
PWM
IFB5
IFB6
PWM / EN
ISET
R1
51k
COMP
C4
0.47uF
GND
Figure 16. Typical Applications (single-cell battery input application)
L1
4.7uH
2.7V ~ 6.5V
Up to 38V
D1
VIN
C1
2.2uF
SW
R2
1.3M
MODE / FAULT
C2
4.7uF
R3
1M
PGND
OVP
R4
43k
VIN
TPS61176
IFB1
IFB2
IFB3
IFB4
VLDO
C3
1uF
PWM
IFB5
IFB6
PWM / EN
ISET
R1
51k
COMP
GND
C4
0.47uF
Figure 17. Typical Applications (single-cell battery input without isolation MOSFET application)
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19
TPS61176
SLVSBM5 – DECEMBER 2012
www.ti.com
MULTI-CELL BATTERY INPUT APPLICATION
In multi-cell battery input applications, because normally the input voltage is higher than VIN pin and
MODE/FAULT pin’s maximum rating voltage 7V, the battery input can't be connected to VIN pin directly and the
isolation MOSFET can't be connected either. A 3.3V or 5V bias is required to power VIN pin of the IC with up to
3mA current consumption, and the mode resistor should be connected between MODE/FAULT pin and ground.
Please refer to Figure 18 as below.
L1
4.7uH
2.7V ~ 24V
Up to 38V
D1
VBAT
C1
2.2uF
C2
4.7uF
SW
MODE / FAULT
2.7V ~ 6.5V
R2
1.3M
R3
1M
PGND
OVP
R4
43k
VIN
C5
1uF
TPS61176
IFB1
IFB2
IFB3
IFB4
VLDO
C3
1uF
PWM
IFB5
IFB6
PWM / EN
ISET
R1
51.2k
COMP
C4
0.47uF
GND
Figure 18. Typical Applications (Multi-cell battery input application)
COMBINED STRING APPLICATION
TPS61176 provides six current sinks with up to 35mA current capability each. If high brightness WLED diodes
are used, the current sinks can be combined as two or three channels to support higher current capability
requirement. Please refer to Figure 19 as below.
L1
4.7uH
2.7V ~ 24V
D1
Up to 38V
VBAT
C1
2.2uF
SW
MODE / FAULT
2.7V ~ 6.5V
R2
1.3M
C2
4.7uF
R3
1M
PGND
OVP
R4
43k
VIN
C5
1uF
TPS61176
IFB1
IFB2
IFB3
IFB4
VLDO
C3
1uF
PWM
ISET
R1
51.2k
Up to 60mA per string
IFB5
IFB6
PWM / EN
COMP
GND
C4
0.47uF
Figure 19. Typical Applications (combined string to support high brightness WLED diodes)
20
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TPS61176
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SLVSBM5 – DECEMBER 2012
SEPARATE PWM AND EN SIGNALS APPLICATION
TPS61176 can be enabled or disabled automatically according to the PWM signal’s status. However, if the user
wants to use separate EN and PWM signals to control the driver, the application circuit in Figure 20 or Figure 21
are recommended.
L1
4.7uH
2.7V ~ 24V
Up to 38V
D1
VBAT
C1
2.2uF
C2
4.7uF
SW
MODE / FAULT
R2
1.3M
2.7V ~ 6.5V
R3
1M
PGND
OVP
R4
43k
VIN
C5
1uF
TPS61176
IFB1
IFB2
IFB3
IFB4
VLDO
C3
1uF
Q2
PWM
C6
100pF
R5
10k
EN
R6
470k
IFB5
IFB6
PWM / EN
ISET
R1
51.2k
COMP
C4
0.47uF
GND
Q2: BSS138 / FDV301N
Figure 20. Typical Applications (to support separate 3.3V logic PWM and EN signals)
L1
4.7uH
2.7V ~ 24V
Up to 38V
D1
VBAT
C1
2.2uF
SW
MODE / FAULT
R2
1.3M
2.7V ~ 6.5V
C2
4.7uF
PGND
OVP
R4
43k
VIN
C5
1uF
TPS61176
IFB1
IFB2
IFB3
IFB4
VLDO
C3
1uF
R5
82k
R3
1M
R6
82k
PWM
IFB5
IFB6
PWM / EN
Q2
ISET
R1
51.2k
COMP
GND
C4
0.47uF
Q2: MMBT3904
EN
Figure 21. Typical Applications (to support separate 1.8V logic PWM and EN signals)
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Product Folder Links: TPS61176
21
PACKAGE OPTION ADDENDUM
www.ti.com
19-Dec-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
TPS61176RTER
ACTIVE
Package Type Package Pins Package Qty
Drawing
WQFN
RTE
16
3000
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
CU NIPDAU
MSL Peak Temp
Samples
(3)
(Requires Login)
Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Dec-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPS61176RTER
Package Package Pins
Type Drawing
WQFN
RTE
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
330.0
12.4
Pack Materials-Page 1
3.3
B0
(mm)
K0
(mm)
P1
(mm)
3.3
1.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Dec-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS61176RTER
WQFN
RTE
16
3000
367.0
367.0
35.0
Pack Materials-Page 2
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