### AVAGO HEDS-6500

```HEDS-5500, HEDS-6500 and HEDS-9000, 9100, 9200 Series
Motion Sensing Products, Optical Encoder Modules
Reliability Data
Description
Failure Rate Prediction
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accordance with the latest revision of MIL- STD-883.
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The relationship between ambient temperature and actual junction
temperature is given by the following:
Avago tests parts at the absolute maximum rated conditions recommended for the device. The actual performance you obtain from Avago parts depends on the
electrical and environmental characteristics of your application but will probably be better than the performance outlined in Table 1.
TJ (°C) = TA (°C) + θJA PAVG
where TA = ambient temperature in °C
θJA = thermal resistance of
junction-to-ambient in °C/watt
PAVG = average power dissipated in watts
The estimated MTBF and failure rate at temperatures
lower than the actual stress temperature can be determined by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the
table on the following page using an activation energy of
0.43 eV (reference MIL-HDBK-217).
Table 1. Life Tests
Demonstrated Performance
Point Typical Performance
Stress Test
Conditions
Total
Device Hrs.
Units
Tested
Total
Failed
MTBF
Failure Rate
(% /1K Hours)
High Temperature
Operating Life
VCC = 5.5 V,
VA = VB = 3.5 V
TA = 100°C
1000 hours
1,405,000
1,405
2
702,500
0.142
Temperature
Humidity
Operating Life
VCC = 5.5 V
VA = VB = 3.5 V
1,000 hours
TA = 85°C
RH = 85%
1,495,000
1,495
10
149,500
0.669
Test Name
Table 2.
Point Typical Performance [1]
in Time
Performance in Time [2]
(90% Confidence)
Ambient
Temperature (°C)
Junction
Temperature (°C)
MTBF [1]
Failure Rate
(%/1K Hours)
MTBF [2]
Failure Rate
(%/1K Hours)
+100
+110
703,000
0.142
264,000
0.379
+90
+100
996,000
0.100
374,000
0.267
+80
+90
1,440,000
0.069
541,000
0.185
+70
+80
2,126,000
0.047
799,000
0.125
+60
+70
3,210,000
0.031
1,206,000
0.083
+50
+60
4,968,000
0.020
1,867,000
0.054
+40
+50
7,901,000
0.013
2,969,000
0.034
+30
+40
12,942,000
0.008
4,863,000
0.021
+20
+30
21,903,000
0.005
8,230,000
0.012
Notes:
1. The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number of failures. In the case of zero
failures, one failure is assumed for this calculation.
2. The 90% Confidence MTBF represents the minimum level of reliability performance which is expected from 90% of all samples. This confidence
interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is
commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology.
3. Failures are catastrophic or parametric. Catastrophic failures are open, short, no logic output, no dynamic parameters while parametric failures
are failures to meet an electrical characteristic as specified in product catalog such as output voltage, duty or state errors.
Example of Failure Rate Calculation
Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168 hours/week is: (8 hours/day) x (5 days/week) / (168 hours/week) = 0.25
The point failure rate per year (8760 hours) at 50°C ambient temperature is: (0.020% / 1K hours) x 0.25 x (8760 hours/year) = 0.044% per year
Similarly, 90% confidence level failure rate per year at 50°C: (0.054% / 1K hours) x 0.25 x (8760 hours/year) = 0.118% per year
Table 3. Environmental Tests
Test Name
MIL-STD-883C
Reference
Temperature Cycle
1010
Test Conditions
Units
Tested
Units
Failed
-40°C to +100°C, 15 minute dwell,
5 minute transfer,
5 cycles
200 cycles
500 cycles
9,512
1,570
1,570
0
3
9
Solder Heat Resistance
2003
Sn/Pb 60/40 Solder; 260°C peak;
10 sec., 20 temp cycles @ -40°C to 85°C
38
0
High Temperature
N/A
TA = +105°C
77
0
Storage Life
2,000 hours
Table 4. Mechanical Tests
Test Name
MIL-STD-883C
Reference
Test Conditions
Units
Tested
Units
Failed
Mechanical Shock
2002
5 blows; X, Y, Z axes, 1500 g, 0.5 msec.
5
0
Vibration Variable Frequency
2007
3 cycles, 4 min. each X, Y, Z axes, 20 g min.
20 to 2000 Hz
5 to 1000 Hz
26
10
0
0
Terminal Strength
2004 Condition A 1 lb. for 30 seconds
15
0
2004, Cond. B
15
0
3 bends, 15° minimum
Table 5. Electrical Tests
Test Name
MIL-STD-883C
Reference
ESD - Human Body Model
3015.2
Test Conditions
1.5 KΩ, 100 pF, 5 positive and 5 negative discharges per pin. VZ = 3.0 KV
Units
Tested
Units
Failed
35
0
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