AP92T12GI-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
▼ Simple Drive Requirement
D
▼ Lower On-resistance
▼ RoHS Compliant & Halogen-Free
BVDSS
120V
RDS(ON)
8.5mΩ
ID
G
53A
S
Description
Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
G
D
TO-220CFM(I)
S
The TO-220CFM isolation package is widely preferred for
commercial-industrial through hole applications.
Absolute Maximum Ratings
Parameter
Symbol
Rating
Units
VDS
Drain-Source Voltage
120
V
VGS
Gate-Source Voltage
+20
V
ID@TC=25℃
Continuous Drain Current, V GS@10V
53
A
ID@TC=100℃
Continuous Drain Current, V GS@10V
38
A
200
A
60
W
1
IDM
Pulsed Drain Current
PD@TC=25℃
Total Power Dissipation
TSTG
Storage Temperature Range
-55 to 175
℃
TJ
Operating Junction Temperature Range
-55 to 175
℃
Thermal Data
Symbol
Parameter
Value
Units
Rthj-c
Maximum Thermal Resistance, Junction-case
2.5
℃/W
Rthj-a
Maixmum Thermal Resistance, Junction-ambient
65
℃/W
Data and specifications subject to change without notice
1
200911251
AP92T12GI-HF
o
Electrical Characteristics@Tj=25 C(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BVDSS
Drain-Source Breakdown Voltage
VGS=0V, ID=250uA
120
-
-
V
RDS(ON)
Static Drain-Source On-Resistance 2
VGS=10V, ID=30A
-
-
8.5
mΩ
VGS(th)
Gate Threshold Voltage
VDS=VGS, ID=250uA
2
-
5
V
gfs
Forward Transconductance
VDS=10V, ID=30A
-
62
-
S
IDSS
Drain-Source Leakage Current
VDS=96V, VGS=0V
-
-
25
uA
IGSS
Gate-Source Leakage
VGS= +20V, VDS=0V
-
-
+100
nA
ID=30A
-
97
155
nC
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=96V
-
27
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=10V
-
48
-
nC
2
td(on)
Turn-on Delay Time
VDS=60V
-
27
-
ns
tr
Rise Time
ID=30A
-
96
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω,VGS=10V
-
42
-
ns
tf
Fall Time
RD=2Ω
-
60
-
ns
Ciss
Input Capacitance
VGS=0V
-
4600 7360
pF
Coss
Output Capacitance
VDS=25V
-
800
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
260
-
pF
Rg
Gate Resistance
f=1.0MHz
-
2
-
Ω
Min.
Typ.
IS=30A, VGS=0V
-
-
1.3
V
Source-Drain Diode
Symbol
VSD
Parameter
Forward On Voltage
2
2
Test Conditions
Max. Units
trr
Reverse Recovery Time
IS=10A, VGS=0V
-
80
-
ns
Qrr
Reverse Recovery Charge
dI/dt=100A/µs
-
260
-
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP92T12GI-HF
200
160
T C = 175 C
ID , Drain Current (A)
160
ID , Drain Current (A)
o
10V
9.0V
8.0V
o
T C = 25 C
120
7.0V
80
10V
9.0V
8.0V
7.0V
120
80
V GS =6.0V
40
40
V GS =6.0V
0
0
0
4
8
12
16
20
0
24
Fig 1. Typical Output Characteristics
8
12
16
Fig 2. Typical Output Characteristics
3.0
1.2
I D =30A
V G =10V
2.6
1.1
Normalized RDS(ON)
Normalized BVDSS (V)
4
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
1
2.2
1.8
1.4
1.0
0.9
0.6
0.2
0.8
-50
0
50
100
150
-50
200
0
Fig 3. Normalized BVDSS v.s. Junction
100
150
200
Fig 4. Normalized On-Resistance
Temperature
v.s. Junction Temperature
1.6
Normalized VGS(th) (V)
40
30
IS(A)
50
T j , Junction Temperature ( o C)
T j , Junction Temperature ( o C)
T j =175 o C
T j =25 o C
20
1.2
0.8
0.4
10
0
0.0
0
0.2
0.4
0.6
0.8
1
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
1.2
-50
0
50
100
150
200
o
T j , Junction Temperature ( C)
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP92T12GI-HF
f=1.0MHz
6000
I D = 30 A
V DS =96V
10
5000
C iss
4000
8
C (pF)
VGS , Gate to Source Voltage (V)
12
6
3000
4
2000
2
1000
C oxx
C rss
0
0
0
20
40
60
80
100
1
120
5
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
1
1000
Operation in this
area limited by
RDS(ON)
ID (A)
100
Normalized Thermal Response (Rthjc)
Duty factor=0.5
100us
1ms
10ms
10
100ms
1s
1
o
T c =25 C
Single Pulse
DC
0.2
0.1
0.1
0.05
0.02
0.01
PDM
0.01
t
T
Single Pulse
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
0.001
0.1
0.01
0.1
1
10
100
1000
0.00001
0.0001
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
10V
QGS
QGD
10%
VGS
td(on) tr
td(off) tf
Fig 11. Switching Time Waveform
Charge
Q
Fig 12. Gate Charge Waveform
4