SHENZHENFREESCALE AO4421

AO4421
60V P-Channel MOSFET
General Description
The AO4421 combines advanced trench MOSFET technology with a low resistance package to provide
extremely low RDS(ON) . This device is ideal for load switch and battery protection applications.
Features
VDS
-60V
-6.2A
ID (at VGS=-10V)
RDS(ON) (at VGS=-10V)
< 40mΩ
RDS(ON) (at VGS = -4.5V)
< 50mΩ
SO8
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TA=25°C
Continuous Drain
Current A
Pulsed Drain Current
TA=70°C
B
Junction and Storage Temperature Range
Maximum Junction-to-Lead
1/4
C
±20
V
ID
-5
IDM
-40
W
2
-55 to 150
TJ, TSTG
Symbol
t ≤ 10s
Steady-State
Steady-State
A
3.1
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Units
V
-6.2
TA=25°C
Power Dissipation A
Maximum
-60
RθJA
RθJL
Typ
24
54
21
°C
Max
40
75
30
Units
°C/W
°C/W
°C/W
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AO4421
60V P-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
Conditions
Min
ID=-250µA, VGS=0V
-60
-1
-5
VDS=0V, VGS=±20V
±100
Gate Threshold Voltage
VDS=VGS ID=-250µA
-1
On state drain current
VGS=-10V, VDS=-5V
-40
VGS=-10V, ID=-6.2A
70
VGS=-4.5V, ID=-5A
40
50
mΩ
VDS=-5V, ID=-6.2A
18
-1
V
-4.2
A
2900
pF
Forward Transconductance
VSD
Diode Forward Voltage
IS=-1A,VGS=0V
IS
Maximum Body-Diode Continuous Current
TJ=125°C
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Gate resistance
V
A
53
gFS
Rg
-3
nA
40
Static Drain-Source On-Resistance
Reverse Transfer Capacitance
-2
µA
32
RDS(ON)
Output Capacitance
Units
V
TJ=55°C
ID(ON)
Crss
Max
VDS=-48V, VGS=0V
VGS(th)
Coss
Typ
S
-0.74
2417
VGS=0V, VDS=-30V, f=1MHz
179
pF
120
VGS=0V, VDS=0V, f=1MHz
mΩ
pF
Ω
1.9
2.3
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge (10V)
46.5
55
Qg(4.5V) Total Gate Charge (4.5V)
22.7
nC
9.1
nC
VGS=-10V, VDS=-30V, ID=-6.2A
nC
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
9.2
nC
tD(on)
Turn-On DelayTime
9.8
ns
tr
Turn-On Rise Time
6.1
ns
VGS=-10V, VDS=-30V, RL=4.7Ω,
RGEN=3Ω
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
44
ns
12.7
ns
trr
Body Diode Reverse Recovery Time
IF=-6.2A, dI/dt=100A/µs
34
Qrr
Body Diode Reverse Recovery Charge IF=-6.2A, dI/dt=100A/µs
47
42
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C.
The value in any a given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal
resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
SOA curve provides a single pulse rating.
2/4
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AO4421
60V P-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: P-CHANNEL
30
25
-10V
-4V
-4.5V
20
-5V
-3.5V
-6V
20
15
-ID(A)
-ID (A)
VDS=-5V
25
15
10
10
125°C
VGS=-3V
5
5
25°C
0
0
0
1
2
3
4
5
1
1.5
45
40
35
VGS=-10V
Normalized On-Resistance
RDS(ON) (mΩ )
2.5
3
3.5
4
2.00
VGS=-4.5V
VGS=-10V
ID=-6.2A
1.80
1.60
VGS=-4.5V
ID=-5A
1.40
1.20
1.00
0.80
30
0
0
5
10
15
20
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1.0E+01
100
90
ID=-6.2A
1.0E+00
125°C
80
1.0E-01
70
125°C
60
-IS (A)
RDS(ON) (mΩ )
2
-VGS(Volts)
Figure 2: Transfer Characteristics
-VDS (Volts)
Fig 1: On-Region Characteristics
1.0E-02
1.0E-03
50
1.0E-04
25°C
40
1.0E-05
25°C
30
1.0E-06
20
2
3/4
3
4
5 -VGS
6 (Volts)
7
8
9
10
Figure 5: On-Resistance vs. Gate-Source Voltage
0.0
0.2
0.4
0.6
0.8
1.0
-VSD (Volts)
Figure 6: Body-Diode Characteristics
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AO4421
60V P-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS: P-CHANNEL
3500
10
VDS=-30V
ID=-6.2A
3000
Capacitance (pF)
-VGS (Volts)
8
6
4
Ciss
2500
2000
1500
1000
2
Coss
Crss
500
0
0
0
10
20
30
40
50
0
-Qg (nC)
Figure 7: Gate-Charge Characteristics
40
50
60
100
1000
TJ(Max)=150°C
TA=25°C
RDS(ON)
limited
100µs
1ms
0.1s
10µs
30
Power (W)
-ID (Amps)
30
40
TJ(Max)=150°C, T A=25°C
1.0
20
-VDS (Volts)
Figure 8: Capacitance Characteristics
100.0
10.0
10
10ms
1s
20
10
10s
DC
0
0.1
0.1
1
10
100
-VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
Zθ JA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=40°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
4/4
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
100
1000
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