SHENZHENFREESCALE AO4852

AO4852
60V Dual N-Channel MOSFET
General Description
The AO4852 uses advanced trench technology to provide excellent RDS(ON) and low gate charge. As a pair
these MOSFETs operate very efficiently in Push Pull and Bridge topologies.
Features
VDS (V) = 60V
(VGS = 10V)
ID = 3.5A
RDS(ON) <90mΩ (VGS = 10V)
RDS(ON) <105mΩ (VGS = 4.5V)
SOIC-8
D2
D1
Top View
S2
G2
S1
G1
1
2
3
4
8
7
6
5
D2
D2
D1
D1
G2
G1
S2
S1
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Drain-Source Voltage
Symbol
VDS
Gate-Source Voltage
TA=70°C
ID
B
V
3
2.8
2.4
TA=70°C
Repetitive avalanche energy 0.3mH
Junction and Storage Temperature Range
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
A
Maximum Junction-to-Ambient
Maximum Junction-to-Lead C
2
1.4
1.3
0.9
IAR
B
TJ, TSTG
Steady-State
Steady-State
RθJA
RθJL
W
8
A
9.6
mJ
-55 to 150
°C
EAR
Symbol
t ≤ 10s
A
20
PD
Avalanche Current B
1/4
±20
3.5
IDM
TA=25°C
Power Dissipation
Units
V
VGS
TA=25°C
Continuous Drain
Current A
Pulsed Drain Current
Maximum
10 Sec
Steady State
60
Typ
48
74
33
Max
62.5
90
40
Units
°C/W
°C/W
°C/W
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AO4852
60V Dual N-Channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Min
ID=250µA, VGS=0V
Units
V
1
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS= ±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=250µA
1.7
ID(ON)
On state drain current
VGS=10V, VDS=5V
20
TJ=55°C
VGS=10V, ID=3A
Static Drain-Source On-Resistance
Max
60
VDS=60V, VGS=0V
IDSS
RDS(ON)
Typ
TJ=125°C
VGS=4.5V, ID=2A
5
µA
100
nA
2.3
2.6
V
79
90
146
159
86
105
mΩ
1
V
A
mΩ
gFS
Forward Transconductance
VDS=5V, ID=3A
15
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.8
ISM
Pulsed Body-Diode Current
20
A
IS
Maximum Body-Diode Continuous Current
2.5
A
450
pF
B
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
S
372
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=30V, f=1MHz
31
VGS=0V, VDS=0V, f=1MHz
1.7
2.6
Ω
7.1
9.2
nC
pF
17
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
Qg(4.5V) Total Gate Charge
VGS=10V, VDS=30V, ID=3A
pF
3.6
nC
1
nC
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
2
tD(on)
Turn-On DelayTime
4.1
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
trr
Turn-Off Fall Time
Body Diode Reverse Recovery Time
IF=3A, dI/dt=100A/µs
23.4
Qrr
Body Diode Reverse Recovery Charge IF=3A, dI/dt=100A/µs
23.2
VGS=10V, VDS=30V, RL=10Ω,
RGEN=3Ω
nC
5.3
2.1
ns
ns
15
ns
2.1
ns
29
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The
value in any given application depends on the user's specific board design.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using < 300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
curve provides a single pulse rating.
Rev1: Nov. 2010
2/4
2
FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
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AO4852
60V Dual N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
20
16
10V
4.5V
16
6V
VDS=5V
4V
12
ID(A)
ID (A)
12
8
125°C
8
3.5V
4
4
25°C
VGS=3V
0
0
0
1
2
3
4
5
2
2.4
VDS (Volts)
Fig 1: On-Region Characteristics
3.2
3.6
4
VGS(Volts)
Figure 2: Transfer Characteristics
105
Normalized On-Resistance
2.2
95
VGS=4.5V
RDS(ON) (mΩ )
2.8
85
75
VGS=10V
65
55
45
2
ID=2A
1.8
Vgs=4.5v
1.6
VGS=10V
1.4
ID=3A
1.2
1
0.8
0
2
4
6
8
0
ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
180
1.0E+01
ID=3A
1.0E+00
150
1.0E-01
IS (A)
RDS(ON) (mΩ )
125°C
120
90
25°C
25°C
60
1.0E-03
1.0E-04
30
1.0E-05
0
2
3
4
5
6
7
8
9
10
VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
3/4
125°C
1.0E-02
0.0
0.2
0.4
0.6
0.8
1.0
VSD (Volts)
Figure 6: Body-Diode Characteristics
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AO4852
60V Dual N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
600
10
VDS=30V
ID=3A
500
Capacitance (pF)
VGS (Volts)
8
6
4
2
Ciss
400
300
200
Coss
100
0
Crss
0
0
1
2
3
4
5
6
7
8
0
10
Qg (nC)
Figure 7: Gate-Charge Characteristics
30
50
60
35
TJ(Max)=150°C
TA=25°C
30
10µs
ID (Amps)
25
100µs
1ms
Power (W)
10.0
10ms
0.1s
1.0
1s
TJ(Max)=150°C
TA=25°C
20
15
10
10s
5
DC
0
0.001
0.1
0.1
40
VDS (Volts)
Figure 8: Capacitance Characteristics
RDS(ON)
limited
100.0
20
1
10
100
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
Zθ JA Normalized Transient
Thermal Resistance
10
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=62.5°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
T
10
100
1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
4/4
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