ETC BSPD25N06S2-40

SPD25N06S2-40
OptiMOS Power-Transistor
Product Summary
Feature
N-Channel
Enhancement mode
175°C operating temperature
Avalanche rated
dv/dt rated
VDS
55
V
RDS(on)
40
m
ID
29
A
P- TO252 -3-11
Type
Package
Ordering Code
SPD25N06S2-40
P- TO252 -3-11 Q67060-S7427
Marking
2N0640
Maximum Ratings, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current
ID
Value
Unit
A
TC=25°C
29
TC=100°C
20
ID puls
116
EAS
80
Repetitive avalanche energy, limited by Tjmax 1)
EAR
6.8
Reverse diode dv/dt
dv/dt
6
Gate source voltage
VGS
±20
V
Power dissipation
Ptot
68
W
-55... +175
°C
Pulsed drain current
TC=25°C
Avalanche energy, single pulse
ID =25A, VDD =25V, RGS =25
mJ
kV/µs
IS =25A, VDS =44V, di/dt=200A/µs, Tjmax=175°C
TC=25°C
Operating and storage temperature
Tj , Tstg
55/175/56
IEC climatic category; DIN IEC 68-1
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2002-06-10
SPD25N06S2-40
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - case
RthJC
-
1.45
2.2
Thermal resistance, junction - ambient, leaded
RthJA
-
-
100
SMD version, device on PCB:
RthJA
-
-
75
-
-
50
@ min. footprint
@ 6 cm 2 cooling area
2)
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
55
-
-
VGS(th)
2.1
3
4
Static Characteristics
Drain-source breakdown voltage
V
VGS =0V, ID =1mA
Gate threshold voltage, VGS = VDS
ID =26µA
Zero gate voltage drain current
µA
IDSS
VDS =55V, VGS =0V, Tj=25°C
-
0.01
1
VDS =55V, VGS =0V, Tj=125°C
-
1
100
IGSS
-
1
100
nA
RDS(on)
-
30
40
m
Gate-source leakage current
VGS =20V, VDS=0V
Drain-source on-state resistance
VGS =10V, ID =13A
1Defined by design. Not subject to production test.
2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
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2002-06-10
SPD25N06S2-40
Electrical Characteristics
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
8.5
17
-
S
pF
Dynamic Characteristics
Transconductance
gfs
V DS2*ID*R DS(on)max,
ID=20A
Input capacitance
Ciss
V GS=0V, VDS=25V,
-
534
710
Output capacitance
Coss
f=1MHz
-
138
180
Reverse transfer capacitance
Crss
-
40
60
Turn-on delay time
td(on)
V DD=30V, V GS=10V,
-
8.8
13
Rise time
tr
ID=25A,
-
24
36
Turn-off delay time
td(off)
-
24
36
Fall time
tf
-
23
35
-
3
4
-
6
8
-
13
18
V(plateau) V DD=44V, I D=25A
-
5.7
-
V
IS
-
-
29
A
-
-
116
R G=22
ns
Gate Charge Characteristics
Gate to source charge
Q gs
Gate to drain charge
Q gd
Gate charge total
Qg
V DD=44V, I D=25A
V DD=44V, I D=25A,
nC
V GS=0 to 10V
Gate plateau voltage
Reverse Diode
Inverse diode continuous
TC=25°C
forward current
Inv. diode direct current, pulsed
I SM
Inverse diode forward voltage
VSD
V GS=0V, IF=25A
-
0.9
1.3
V
Reverse recovery time
t rr
V R=30V, IF=lS,
-
31
40
ns
Reverse recovery charge
Q rr
diF/dt=100A/µs
-
40
50
nC
Page 3
2002-06-10
SPD25N06S2-40
1 Power dissipation
2 Drain current
Ptot = f (TC )
ID = f (TC )
75
parameter: VGS 10 V
SPD25N06S2-40
32
SPD25N06S2-40
W
A
60
24
50
ID
Ptot
55
45
40
20
16
35
30
12
25
20
8
15
10
4
5
0
0
20
40
60
80
0
0
100 120 140 160 °C 190
20
40
60
80
100 120 140 160 °C 190
TC
TC
3 Safe operating area
4 Max. transient thermal impedance
ID = f ( VDS )
ZthJC = f (tp )
parameter : D = 0 , TC = 25 °C
parameter : D = tp /T
10
10 1
3 SPD25N06S2-40
SPD25N06S2-40
K/W
A
/I
D
10 0
=
10 µs
10 -1
R
DS
(o
n
)
ID
Z thJC
DS
tp = 7.5µs
V
10 2
D = 0.50
10
10
100 µs
1
-2
0.20
0.10
0.05
10 -3
1 ms
0.02
single pulse
0.01
10 ms
10
0
10
-1
10
0
10
1
DC
V
10
2
10 -4 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
VDS
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2002-06-10
SPD25N06S2-40
5 Typ. output characteristic
6 Typ. drain-source on resistance
ID = f (VDS ); Tj=25°C
RDS(on) = f (ID )
parameter: tp = 80 µs
parameter: VGS
120
60
A
m
Vgs = 7.5V
Vgs = 10V
50
100
Vgs = 7V
40
RDS(on)
ID
45
Vgs = 6.5V
35
30
90
Vgs=5V
Vgs=5.5V
Vgs=6V
Vgs=6.5V
Vgs=7V
Vgs=7.5V
Vgs=10V
80
70
Vgs = 6V
25
60
20
Vgs = 5.5V
50
15
0.5
1
1.5
2
2.5
3
3.5
4
20
0
V 5
VDS
7 Typ. transfer characteristics
ID= f ( VGS ); VDS 2 x ID x RDS(on)max
parameter: tp = 80 µs
S
40
16
35
14
30
10
20
8
15
6
10
4
5
2
4
5
6
60
12
25
3
A
40
parameter: gfs
A
2
30
gfs = f(ID ); Tj=25°C
20
1
20
8 Typ. forward transconductance
50
0
0
10
ID
g fs
ID
30
Vgs = 4.5V
5
0
0
40
Vgs = 5V
10
0
0
8
V
VGS
Page 5
4
8
12
16
20
24
32
A
ID
2002-06-10
SPD25N06S2-40
9 Drain-source on-resistance
10 Typ. gate threshold voltage
RDS(on) = f(Tj )
VGS(th) = f (Tj)
parameter: ID = 13 A, VGS = 10 V
parameter: VGS = VDS
4
90
m
V
V GS(th)
RDS(on)
70
60
98 %
130 A
3
50
26 A
40
2.5
typ.
30
20
2
10
0
-60
-20
20
60
100
°C
1.5
-60
180
-20
20
60
100
Tj
°C
180
Tj
11 Typ. capacitances
12 Forward character. of reverse diode
C = f (VDS)
I F = f (VSD)
parameter: VGS =0V, f=1 MHz
parameter: Tj , tp = 80 µs
10
4
10 3
pF
SPD25N06S2-40
A
10 3
10 2
C
IF
Ciss
Coss
10 2
10 1
Crss
Tj = 25 °C typ
Tj = 175 °C typ
Tj = 25 °C (98%)
Tj = 175 °C (98%)
10 1
0
5
10
15
20
V
30
10 0
0
0.4
0.8
1.2
1.6
2
2.4 V
3
VSD
VDS
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2002-06-10
SPD25N06S2-40
13 Typ. avalanche energy
14 Typ. gate charge
EAS = f (Tj)
VGS = f (Q Gate)
parameter: ID = 29 A pulsed
par.: ID=25A, V DD = 25 V, RGS = 25 80
16
mJ
V
12
VGS
60
E AS
SPD25N06S2-40
50
40
8
30
6
20
4
10
2
0
25
45
65
85
105
125
145
°C 185
Tj
0,2 VDS max
10
0
0
2
4
6
8
10
12
0,8 VDS max
14
16 nC 19
QGate
15 Drain-source breakdown voltage
V(BR)DSS = f (Tj )
parameter: ID=10 mA
66
SPD25N06S2-40
V (BR)DSS
V
62
60
58
56
54
52
50
-60
-20
20
60
100
140
°C
200
Tj
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2002-06-10
SPD25N06S2-40
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
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of the user or other persons may be endangered.
Further information
Please notice that the part number is BSPD25N06S2-40, for simplicity the device is referred to by the term
SPD25N06S2-40 throughout this documentation.
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2002-06-10