ETC BLT81/T1

DISCRETE SEMICONDUCTORS
DATA SHEET
BLT81
UHF power transistor
Product specification
Supersedes data of November 1992
File under Discrete Semiconductors, SC08b
1996 May 09
Philips Semiconductors
Product specification
UHF power transistor
BLT81
FEATURES
• SMD encapsulation
• Gold metallization ensures excellent reliability.
4
handbook, halfpage
APPLICATIONS
• Hand-held radio equipment in the 900 MHz
communication band.
c
b
DESCRIPTION
e
NPN silicon planar epitaxial transistor encapsulated in a
plastic SOT223 SMD package.
1
PINNING - SOT223
2
3
MAM043 - 1
Top view
PIN
SYMBOL
DESCRIPTION
1
e
emitter
2
b
base
3
e
emitter
4
c
collector
Fig.1 Simplified outline and symbol.
QUICK REFERENCE DATA
RF performance at Ts ≤ 60 °C in a common emitter test circuit (see Fig.7).
MODE OF OPERATION
f
(MHz)
CW, class-B narrow band
900
1996 May 09
VCE
(V)
PL
(W)
Gp
(dB)
ηC
(%)
7.5
1.2
≥6
≥60
6
1.2
typ. 6.5
typ. 77
2
Philips Semiconductors
Product specification
UHF power transistor
BLT81
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
−
20
V
VCEO
collector-emitter voltage
open base
−
9.5
V
VEBO
emitter-base voltage
open collector
−
2.5
V
IC
collector current (DC)
−
500
mA
IC(AV)
average collector current
−
500
mA
Ptot
total power dissipation
−
2
W
Tstg
storage temperature
−65
+150
°C
Tj
operating junction temperature
−
175
°C
Ts = 110 °C; note 1
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
PARAMETER
CONDITIONS
thermal resistance from junction to soldering point
Ptot = 2 W; Ts = 110 °C; note 1
Note to the “Limiting values” and “Thermal characteristics”
1. Ts is the temperature at the soldering point of the collector pin.
MRC094
1
handbook, halfpage
IC
(A)
10−1
1
10
VCE (V)
102
Ts = 110 °C.
Fig.2 DC SOAR.
1996 May 09
3
VALUE
UNIT
32
K/W
Philips Semiconductors
Product specification
UHF power transistor
BLT81
CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V(BR)CBO
collector-base breakdown voltage
open emitter; IC = 1 mA
20
−
−
V
V(BR)CEO
collector-emitter breakdown voltage
open base; IC = 10 mA
9.5
−
−
V
V(BR)EBO
emitter-base breakdown voltage
open collector; IE = 0.1 mA
2.5
−
−
V
mA
ICES
collector leakage current
VCE = 10 V; VBE = 0
−
−
0.1
hFE
DC current gain
VCE = 5 V; IC = 300 mA; note 1;
25
−
−
Cc
collector capacitance
VCB = 7.5 V; IE = ie = 0; f = 1 MHz;
−
2.7
4
pF
Cre
feedback capacitance
VCE = 7.5 V; IC = 0; f = 1 MHz
−
1.7
3
pF
Note
1. Measured under pulsed conditions: tp ≤ 200 µs; δ ≤ 0.02.
MRC090
100
MRC086
6
handbook, halfpage
handbook, halfpage
hFE
Cc
(pF)
80
4
60
40
2
20
0
0
0
100
200
300
400
0
2
4
IC (mA)
DC current gain as a function of collector
current; typical values.
1996 May 09
8
10
VCB (V)
IE = ie = 0; f = 1 MHz; Tj = 25 °C.
VCE = 7.5 V; tp ≤ 200 µs; δ ≤ 0.02; Tj = 25 °C.
Fig.3
6
Fig.4
4
Collector capacitance as a function of
collector-base voltage; typical values.
Philips Semiconductors
Product specification
UHF power transistor
BLT81
APPLICATION INFORMATION
RF performance at Ts ≤ 60 °C in a common emitter test circuit (see note 1 and Fig.7).
MODE OF OPERATION
f
(MHz)
CW, class-B narrow band
900
VCE
(V)
PL
(W)
7.5
1.2
6
1.2
ηC
(%)
Gp
(dB)
≥6
≥60
typ. 8
typ. 77
typ. 6.5
typ. 77
Note
1. Ts is the temperature at the soldering point of the collector pin.
Ruggedness in class-AB operation
The BLT81 is capable of withstanding a load mismatch corresponding to VSWR = 50 : 1 through all phases under the
following conditions: f = 900 MHz; VCE = 9 V; PL = 1.2 W; Ts ≤ 60 °C.
MRC088
10
handbook, halfpage
Gp
(dB)
Gp
(1)
(2)
8
ηC
(4)
100
ηC
(%)
MRC093
2.5
handbook, halfpage
PL
(W)
80
2.0
(1)
(3)
60
6
1.5
(2)
4
40
1.0
2
20
0.5
0
0
0.4
0.8
1.2
1.6
0
2.0
PL (W)
0
0
100
200
Class-B; f = 900 MHz; Ts ≤ 60 °C.
Class-B; f = 900 MHz; Ts ≤ 60 °C.
(1) VCE = 7.5 V.
(2) VCE = 6 V.
(1) VCE = 7.5 V.
Fig.5
(3) VCE = 7.5 V.
(4) VCE = 6 V.
Power gain and collector efficiency as
functions of load power; typical values.
1996 May 09
Fig.6
5
300
400
500
PIN (mW)
(2) VCE = 6 V.
Load power as a function of input
power; typical values.
Philips Semiconductors
Product specification
UHF power transistor
BLT81
Test circuit information
handbook, full pagewidth
50 Ω
input
C1
C2
L1
L2
C3
C4
L4
C6
L5
C5
C7
C8
L6
L8
DUT
C10
L10
C11
C14
50 Ω
output
C13
L7
L9
R1
L3
VCC
R2
C9
C12
MEA899
Fig.7 Common emitter test circuit for class-B operation at 900 MHz.
1996 May 09
6
Philips Semiconductors
Product specification
UHF power transistor
BLT81
List of components used in test circuit (see Figs 7 and 8)
COMPONENT
DESCRIPTION
VALUE
DIMENSIONS
C1, C14
multilayer ceramic chip capacitor; note 1 100 pF
C2
multilayer ceramic chip capacitor; note 1 3 pF
C3, C5, C11, C13
film dielectric trimmer
C4
multilayer ceramic chip capacitor; note 1 5.6 pF
C6, C7, C10
multilayer ceramic chip capacitor; note 1 5.1 pF
C8
multilayer ceramic chip capacitor; note 1 3.6 pF
C9
multilayer ceramic chip capacitor; note 1 220 pF
C12
multilayer ceramic chip capacitor;
1 nF
L1
stripline; note 2
50 Ω
length 26.6 mm
width 4.85 mm
L2
10 turns enamelled 0.6 mm copper wire
250 nH
int. dia. 4.5 mm
leads 2 × 5 mm
L3, L9
grade 3B Ferroxcube wideband
HF choke
L4
stripline; note 2
50 Ω
length 18 mm
width 4.85 mm
L5
stripline; note 2
75 Ω
length 3.5 mm
width 2.5 mm
L6
stripline; note 2
50 Ω
length 10 mm
width 4.85 mm
L7
4 turns enamelled 0.6 mm copper wire
65 nH
int. dia. 4.5 mm
leads 2 × 5 mm
L8
stripline; note 2
50 Ω
length 15 mm
width 4.85 mm
L10
stripline; note 2
50 Ω
length 24.6 mm
width 4.85 mm
R1, R2
metal film resistor
10 Ω, 0.25 W
1.4 to 5.5 pF
CATALOGUE No.
2222 809 09004
4312 020 36640
Notes
1. American Technical Ceramics type 100B or capacitor of same quality.
2. The striplines are on a double copper-clad printed-circuit board, with PTFE fibre-glass dielectric (εr = 2.2); thickness
1⁄ "; thickness of the copper sheet 35 µm.
16
1996 May 09
7
Philips Semiconductors
Product specification
UHF power transistor
BLT81
140
handbook, full pagewidth
strap
strap
80
rivets
(14x)
strap
mounting
screws
(8x)
strap
VCC
L9
L3
C12
C9
R1
C4
C2
C6
L1
C1
C3
R2
L2
L4
C5
L7
L5
L6
C7
C10
L8
C8
L10
C11
C14
C13
MEA898
Dimensions in mm.
The components are situated on one side of the copper-clad PTFE fibre-glass board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by means of fixing screws and copper foil straps under the emitter leads.
Fig.8 Printed-circuit board and component lay-out for 900 MHz class-B test circuit in Fig.7.
1996 May 09
8
Philips Semiconductors
Product specification
UHF power transistor
BLT81
MRC091
10
Zi
(Ω)
MRC092
20
ZL
(Ω)
handbook, halfpage
handbook, halfpage
8
RL
16
ri
6
12
4
8
xi
2
XL
4
0
800
840
880
920
0
800
960
1000
f (MHz)
840
880
920
960
1000
f (MHz)
Class-B; VCE = 7.5 V; PL = 1.2 W; Ts ≤ 60 °C.
Class-B; VCE = 7.5 V; PL = 1.2 W; Ts ≤ 60 °C.
Fig.9
Fig.10 Load impedance as a function of frequency
(series components); typical values.
Input impedance as a function of frequency
(series components); typical values.
MRC089
10
handbook, halfpage
Gp
(dB)
8
6
handbook, halfpage
4
Zi
2
0
800
840
880
920
ZL
MBA451
960
1000
f (MHz)
Class-B; VCE = 7.5 V; PL = 1.2 W; Ts ≤ 60 °C.
Fig.11 Power gain as a function of
frequency; typical values.
1996 May 09
Fig.12 Definition of transistor impedance.
9
Philips Semiconductors
Product specification
UHF power transistor
BLT81
PACKAGE OUTLINE
0.95
0.85
handbook, full pagewidth
S
0.1 S
seating plane
0.32
0.24
6.7
6.3
3.1
2.9
B
4
A
0.10
0.01
16 o
max
16
3.7
3.3
10 o
max
2
0.80
0.60
2.3
4.6
Dimensions in mm.
Fig.13 SOT223.
1996 May 09
7.3
6.7
o
1
1.80
max
0.2 M A
10
3
0.1 M B
(4x)
MSA035 - 1
Philips Semiconductors
Product specification
UHF power transistor
BLT81
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 May 09
11
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02) 805 4455, Fax. (02) 805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. (01) 60 101-1256, Fax. (01) 60 101-1250
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211,
Volodarski Str. 6, 220050 MINSK,
Tel. (172) 200 733, Fax. (172) 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. (359) 2 689 211, Fax. (359) 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:
Tel. (800) 234-7381, Fax. (708) 296-8556
Chile: see South America
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. (852) 2319 7888, Fax. (852) 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300
COPENHAGEN S, Tel. (032) 88 2636, Fax. (031) 57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. (358) 0-615 800, Fax. (358) 0-61580 920
France: 4 Rue du Port-aux-Vins, BP317,
92156 SURESNES Cedex,
Tel. (01) 4099 6161, Fax. (01) 4099 6427
Germany: P.O. Box 10 51 40, 20035 HAMBURG,
Tel. (040) 23 53 60, Fax. (040) 23 53 63 00
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (01) 4894 339/4894 911, Fax. (01) 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block,
Dr. Annie Besant Rd. Worli, BOMBAY 400 018
Tel. (022) 4938 541, Fax. (022) 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01) 7640 000, Fax. (01) 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. (03) 645 04 44, Fax. (03) 648 10 07
Italy: PHILIPS SEMICONDUCTORS,
Piazza IV Novembre 3, 20124 MILANO,
Tel. (0039) 2 6752 2531, Fax. (0039) 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108, Tel. (03) 3740 5130, Fax. (03) 3740 5077
Korea: Philips House, 260-199 Itaewon-dong,
Yongsan-ku, SEOUL, Tel. (02) 709-1412, Fax. (02) 709-1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03) 750 5214, Fax. (03) 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO,
TEXAS 79905, Tel. 9-5(800) 234-7831, Fax. (708) 296-8556
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. (040) 2783749, Fax. (040) 2788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09) 849-4160, Fax. (09) 849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022) 74 8000, Fax. (022) 74 8341
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC,
MAKATI, Metro MANILA,
Tel. (63) 2 816 6380, Fax. (63) 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. (022) 612 2831, Fax. (022) 612 2327
Portugal: see Spain
Romania: see Italy
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65) 350 2000, Fax. (65) 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd.,
195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430 Johannesburg 2000,
Tel. (011) 470-5911, Fax. (011) 470-5494
South America: Rua do Rocio 220 - 5th floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil,
P.O. Box 7383 (01064-970),
Tel. (011) 821-2333, Fax. (011) 829-1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03) 301 6312, Fax. (03) 301 4107
Sweden: Kottbygatan 7, Akalla. S-16485 STOCKHOLM,
Tel. (0) 8-632 2000, Fax. (0) 8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (01) 488 2211, Fax. (01) 481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. (66) 2 745-4090, Fax. (66) 2 398-0793
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0212) 279 2770, Fax. (0212) 282 6707
Ukraine: PHILIPS UKRAINE,
2A Akademika Koroleva str., Office 165, 252148 KIEV,
Tel. 380-44-4760297, Fax. 380-44-4766991
United Kingdom: Philips Semiconductors LTD.,
276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. (0181) 730-5000, Fax. (0181) 754-8421
United States: 811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800) 234-7381, Fax. (708) 296-8556
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. (381) 11 825 344, Fax. (359) 211 635 777
Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,
Marketing & Sales Communications, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Fax. +31-40-2724825
SCDS48
© Philips Electronics N.V. 1996
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
127061/1200/02/pp12
Document order number:
Date of release: 1996 May 09
9397 750 00835