ETC HYM72V32C736T8-H

32Mx72 bits
PC133 SDRAM Registered DIMM
with PLL, based on 32Mx8 SDRAM with LVTTL, 4 banks & 8K Refresh
HYM72V32C736T8 Series
DESCRIPTION
The HYM72V32C736T8 Series are 32Mx72bits ECC Synchronous DRAM Modules. The modules are composed of nine 32Mx8bits
CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, one 2Kbit EEPROM in 8pin TSSOP package on a 168pin glass-epoxy
printed circuit board. One 0.22uF and one 0.0022uF decoupling capacitors per each SDRAM are mounted on the PCB.
The HYM72V32C736T8 Series are Dual In-line Memory Modules suitable for easy interchange and addition of 256Mbytes memory.
The HYM72V32C736T8 Series are fully synchronous operation referenced to the positive edge of the clock . All inputs and outputs are
synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth.
FEATURES
•
PC133/PC100MHz support
•
SDRAM internal banks : four banks
•
168pin SDRAM Unbuffered DIMM
•
Module bank : one physical bank
•
Serial Presence Detect with EEPROM
•
Auto refresh and self refresh
•
1.50” (38.10mm) Height PCB with double sided
components
•
8192 refresh cycles / 64ms
•
Programmable Burst Length and Burst Type
•
Single 3.3±0.3V power supply
•
All device pins are compatible with LVTTL interface
•
Data mask function by DQM
- 1, 2, 4 or 8 or Full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
•
Programmable CAS Latency ; 2, 3 Clocks
ORDERING INFORMATION
Part No.
Clock
Frequency
Internal
Bank
Ref.
Power
SDRAM
Package
Plating
HYM72V32C736T8-H
133MHz
4 Banks
8K
Normal
TSOP-II
Gold
This document is a general product description and is subject to change without notice. Hynix Semiconductor Inc. does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev. 1.3/Nov. 01
1
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
PIN DESCRIPTION
PIN
PIN NAME
DESCRIPTION
CK0~CK3
Clock Inputs
The system clock input. All other inputs are registered to the SDRAM on the
rising edge of CLK
CKE0
Clock Enable
Controls internal clock signal and when deactivated, the SDRAM will be one
of the states among power down, suspend or self refresh
/S0, /S2
Chip Select
Enables or disables all inputs except CK, CKE and DQM
BA0, BA1
SDRAM Bank Address
Selects bank to be activated during /RAS activity
Selects bank to be read/written during /CAS activity
A0 ~ A12
Address
Row Address : RA0 ~ RA12, Column Address : CA0 ~ CA9
Auto-precharge flag : A10
/RAS, /CAS, /WE
Row Address Strobe, Column
Address Strobe, Write Enable
/RAS, /CAS and /WE define the operation
Refer function truth table for details
REGE
Register Enable
Register Enable pin which permits the DIMM to operateion in Buffered Mode
when REGE input is Low, in Registered Mode when REGE input is High
DQM0~DQM7
Data Input/Output Mask
Controls output buffers in read mode and masks input data in write mode
DQ0 ~ DQ63
Data Input/Output
Multiplexed data input / output pin
CB0 ~ CB7
Check Bit Input/Output
Check bits for ECC
VCC
Power Supply (3.3V)
Power supply for internal circuits and input buffers
VSS
Ground
Ground
SCL
SPD Clock Input
Serial Presence Detect Clock input
SDA
SPD Data Input/Output
Serial Presence Detect Data input/output
SA0~2
SPD Address Input
Serial Presence Detect Address Input
WP
Write Protect for SPD
Write Protect for Serial Presence Detect on DIMM
NC
No Connection
No connection
Rev. 1.3/Nov. 01
2
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
PIN ASSIGNMENTS
FRONT SIDE
PIN NO.
BACK SIDE
NAME
PIN NO.
NAME
FRONT SIDE
PIN NO.
NAME
BACK SIDE
PIN NO.
NAME
*CK1
1
VSS
85
VSS
41
VCC
125
2
DQ0
86
DQ32
42
CK0
126
A12
3
DQ1
87
DQ33
43
VSS
127
VSS
4
DQ2
88
DQ34
44
NC
128
CKE0
5
DQ3
89
DQ35
45
/S2
129
NC
6
VCC
90
VCC
46
DQM2
130
DQM6
7
DQ4
91
DQ36
47
DQM3
131
DQM7
8
DQ5
92
DQ37
48
NC
132
NC
9
DQ6
93
DQ38
49
VCC
133
VCC
10
DQ7
94
DQ39
50
NC
134
NC
51
NC
135
NC
52
CB2
136
CB6
Architecture Key
11
DQ8
95
DQ40
53
CB3
137
CB7
12
VSS
96
VSS
54
VSS
138
VSS
13
DQ9
97
DQ41
55
DQ16
139
DQ48
14
DQ10
98
DQ42
56
DQ17
140
DQ49
15
DQ11
99
DQ43
57
DQ18
141
DQ50
16
DQ12
100
DQ44
58
DQ19
142
DQ51
17
DQ13
101
DQ45
59
VCC
143
VCC
18
VCC
102
VCC
60
DQ20
144
DQ52
19
DQ14
103
DQ46
61
NC
145
NC
20
DQ15
104
DQ47
62
NC
146
NC
21
CB0
105
CB4
63
NC
147
REGE
22
CB1
106
CB5
64
VSS
148
VSS
23
VSS
107
VSS
65
DQ21
149
DQ53
24
NC
108
NC
66
DQ22
150
DQ54
25
NC
109
NC
67
DQ23
151
DQ55
26
VCC
110
VCC
68
VSS
152
VSS
27
/WE
111
/CAS
69
DQ24
153
DQ56
28
DQM0
112
DQM4
70
DQ25
154
DQ57
29
DQM1
113
DQM5
71
DQ26
155
DQ58
30
/S0
114
NC
72
DQ27
156
DQ59
31
NC
115
/RAS
73
VCC
157
VCC
32
VSS
116
VSS
74
DQ28
158
DQ60
33
A0
117
A1
75
DQ29
159
DQ61
34
A2
118
A3
76
DQ30
160
DQ62
35
A4
119
A5
77
DQ31
161
DQ63
36
A6
120
A7
78
VSS
162
VSS
37
A8
121
A9
79
CK2
163
*CK3
38
A10/AP
122
BA0
80
NC
164
NC
39
BA1
123
A11
81
WP
165
SA0
40
VCC
124
VCC
82
SDA
166
SA1
83
SCL
167
SA2
84
VCC
168
VCC
Voltage Key
Note : * CK1 ~ CK3 are connected with termination R/C (Rsfer to the block diagram)
Rev. 1.3/Nov. 01
3
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
BLOCK DIAGRAM
Note : 1. The serial resistor values of DQs are 10ohms
2. The padding capacitance of termination R/C for CK1~CK3 is 12pF
Rev. 1.3/Nov. 01
4
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
SERIAL PRESENCE DETECT
BYTE
NUMBER
FUNCTION
DESCRIPTION
FUNCTION
VALUE
-H
-H
BYTE0
# of Bytes Written into Serial Memory at Module
Manufacturer
128 Bytes
80h
BYTE1
Total # of Bytes of SPD Memory Device
256 Bytes
08h
BYTE2
Fundamental Memory Type
BYTE3
BYTE4
SDRAM
04h
# of Row Addresses on This Assembly
13
0Dh
# of Column Addresses on This Assembly
10
0Ah
BYTE5
# of Module Banks on This Assembly
1 Bank
01h
BYTE6
Data Width of This Assembly
72 Bits
48h
BYTE7
Data Width of This Assembly (Continued)
-
00h
BYTE8
Voltage Interface Standard of This Assembly
LVTTL
01h
BYTE9
SDRAM Cycle Time @/CAS Latency=3
7.5
75h
BYTE10
Access Time from Clock @/CAS Latency=3
5.4
54h
BYTE11
DIMM Configuration Type
BYTE12
Refresh Rate/Type
ECC
02h
7.8125us
/ Self Refresh Supported
82h
BYTE13
Primary SDRAM Width
x8
08h
BYTE14
Error Checking SDRAM Width
x8
08h
BYTE15
Minimum Clock Delay Back to Back Random Column
Address
BYTE16
Burst Lenth Supported
BYTE17
# of Banks on Each SDRAM Device
tCCD = 1 CLK
01h
1,2,4,8,Full Page
8Fh
4 Banks
04h
BYTE18
SDRAM Device Attributes, /CAS Lataency
/CAS Latency=3
04h
BYTE19
SDRAM Device Attributes, /CS Lataency
/CS Latency=0
01h
BYTE20
SDRAM Device Attributes, /WE Lataency
/WE Latency=0
01h
BYTE21
SDRAM Module Attributes
Registered/Buffered inputs, with PLL
1Fh
SDRAM Device Attributes, General
+/- 10% voltage tolerence, Burst Read
Single Bit Write, Precharge All, Auto
Precharge, Early RAS Precharge
0Eh
BYTE22
BYTE23
SDRAM Cycle Time @/CAS Latency=2
-
00h
BYTE24
Access Time from Clock @/CAS Latency=2
-
00h
BYTE25
SDRAM Cycle Time @/CAS Latency=1
-
00h
BYTE26
Access Time from Clock @/CAS Latency=1
-
00h
BYTE27
Minimum Row Precharge Time (tRP)
20ns
14h
BYTE28
Minimum Row Active to Row Active Delay (tRRD)
15ns
0Fh
BYTE29
Minimum /RAS to /CAS Delay (tRCD)
20ns
14h
BYTE30
Minimum /RAS Pulse Width (tRAS)
45ns
2Dh
BYTE31
Module Bank Density
256MB
40h
BYTE32
Command and Address Signal Input Setup Time
1.5ns
15h
BYTE33
Command and Address Signal Input Hold Time
0.8ns
08h
BYTE34
Data Signal Input Setup Time
1.5ns
15h
BYTE35
Data Signal Input Hold Time
0.8ns
08h
BYTE36
~61
Superset Information (may be used in future)
-
00h
BYTE62
SPD Revision
Intel SPD1.2B
12h
BYTE63
Checksum for Byte 0~62
-
01h
BYTE64
Manufacturer JEDEC ID Code
Hynixi JEDED ID
ADh
BYTE65
~71
....Manufacturer JEDEC ID Code
Unused
FFh
Hynix (Korea Area)
HSA (United States Area)
HSE (Europe Area)
HSJ (Japan Area)
HSS(Singapore)
ASIA Area
0*h
1*h
2*h
3*h
4*h
5*h
BYTE72
Manufacturing Location
Rev. 1.3/Nov. 01
NOTE
1
2
3, 8
9
5
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
Continued
BYTE
NUMBER
FUNCTION
DESCRIPTION
BYTE73
Manufacturer’s Part Number (Component)
BYTE74
Manufacturer’s Part Number (256Mb based)
BYTE75
Manufacturer’s Part Number (Voltage Interface)
BYTE76
BYTE77
FUNCTION
VALUE
-H
-H
7 (SDRAM)
37h
4, 5
NOTE
2
32h
4, 5
V (3.3V, LVTTL)
56h
4, 5
Manufacturer’s Part Number (Memory Width)
3
33h
4, 5
....Manufacturer’s Part Number (Memory Width)
2
32h
4, 5
BYTE78
Manufacturer’s Part Number (Module Type)
C
43h
BYTE79
Manufacturer’s Part Number (Data Width)
7
37h
4, 5
BYTE80
....Manufacturer’s Part Number (Data Width)
3
33h
4, 5
BYTE81
Manufacturer’s Part Number (Refresh, SDRAM Bank)
6(8K Refresh, 4Banks)
36h
4, 5
BYTE82
Manufacturer’s Part Number (Package Type)
T
54h
4, 5
BYTE83
Manufacturer’s Part Number (Component Configuration)
BYTE84
Manufacturer’s Part Number (Hyphen)
BYTE85
Manufacturer’s Part Number (Min. Cycle Time)
BYTE86
~90
Manufacturer’s Part Number
8 (x8 based)
48h
4, 5
- (Hyphen)
2Dh
4, 5
H
48h
4, 5
Blanks
20h
4, 5
BYTE91
Revision Code (for Component)
Process Code
-
4, 6
BYTE92
....Revision Code (for PCB)
Process Code
-
4, 6
BYTE93
Manufacturing Date
Year
-
3, 6
BYTE94
....Manufacturing Date
Work Week
-
3, 6
Serial Number
-
6
None
00h
BYTE95
~98
BYTE99
~125
Assembly Serial Number
Manufacturer Specific Data (may be used in future)
BYTE126
Reserved
Refer to Note9
64h
7, 8, 9
BYTE127
Intel Specification detail for 100MHz support
Refer to Note7
85h
7, 8, 9
BYTE128
~256
Unused Storage Locations
-
00h
Note :
1. The bank address is excluded
2. 1, 2, 4, 8 for Interleave Burst Type
3. BCD adopted
4. ASCII adopted
5. Basically Hynix writes Part No. except for ‘HYM’ in Byte 73~90 to use the limited 18 bytes from byte 73 to byte 90
6. Not fixed but dependent
7. CK0 connected to DIMM, TBD junction temp, CL2(3) support, Intel defined Concurrent Auto Precharge suport
8. Refer to Intel SPD Specification 1.2B
9. Refet to Hynix web site
Rev. 1.3/Nov. 01
6
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Unit
Ambient Temperature
TA
0 ~ 70
°C
Storage Temperature
TSTG
-55 ~ 125
°C
Voltage on Any Pin relative to VSS
VIN, VOUT
-1.0 ~ 4.6
V
Voltage on VDD relative to VSS
VDD, VDDQ
-1.0 ~ 4.6
V
Short Circuit Output Current
IOS
50
mA
Power Dissipation
PD
1
W
Soldering Temperature ⋅ Time
TSOLDER
260 ⋅ 10
°C ⋅ Sec
Note : Operation at above absolute maximum rating can adversely affect device reliability.
DC OPERATING CONDITION (TA=0 to 70°C)
Parameter
Symbol
Min
Typ
Max
Unit
Note
Power Supply Voltage
VDD, VDDQ
3.0
3.3
3.6
V
1
Input High voltage
VIH
2.0
3.0
VDDQ + 0.3
V
1,2
Input Low voltage
VIL
-0.3
0
0.8
V
1,3
Note
Note :
1.All voltages are referenced to VSS = 0V
2.VIH(max) is acceptable 5.6V AC pulse width with <=3ns of duration.
3.VIL(min) is acceptable -2.0V AC pulse width with <=3ns of duration.
AC OPERATING TEST CONDITION (TA=0 to 70°C, VDD=3.3±0.3V, VSS=0V)
Parameter
Symbol
Value
Unit
AC Input High / Low Level Voltage
VIH / VIL
2.4/0.4
V
Vtrip
1.4
V
Input Rise / Fall Time
tR / tF
1
ns
Output Timing Measurement Reference Level Voltage
Voutref
1.4
V
CL
50
pF
Input Timing Measurement Reference Level Voltage
Output Load Capacitance for Access Time Measurement
1
Note :
1.Output load to measure access times is equivalent to two TTL gates and one capacitor (50pF). For details, refer to AC/DC output
load circuit
Rev. 1.3/Nov. 01
7
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
CAPACITANCE (TA=25°C, f=1MHz)
-H
Parameter
Pin
Input Capacitance
Data Input / Output Capacitance
Symbol
Unit
Min
Max
CK0
CI1
-
30
pF
CKE0
CI2
-
15
pF
/S0, /S2
CI3
-
15
pF
A0~12, BA0, BA1
CI4
-
15
pF
/RAS, /CAS, /WE
CI5
-
15
pF
DQM0~DQM7
CI6
-
15
pF
DQ0 ~ DQ63
CI/O
-
15
pF
OUTPUT LOAD CIRCUIT
Vtt=1.4V
RT=250 Ω
Output
Output
50pF
DC Output Load Circuit
Rev. 1.3/Nov. 01
50pF
AC Output Load Circuit
8
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
DC CHARACTERISTICS I (TA=0 to 70°C, VDD=3.3±0.3V)
Parameter
Symbol
Min.
Max
Unit
Note
Input Leakage Current
ILI
-10
10
uA
1
Output Leakage Current
ILO
-1
1
uA
2
Output High Voltage
VOH
2.4
-
V
IOH = -4mA
Output Low Voltage
VOL
-
0.4
V
IOL = +4mA
Note :
1.VIN = 0 to 3.6V, All other pins are not tested under VIN =0V
2.DOUT is disabled, VOUT=0 to 3.6
DC CHARACTERISTICS II
Parameter
Operating Current
Symbol
IDD1
Speed
Test Condition
-H
Burst length=1, One bank active
tRC ≥ tRC(min), IOL=0mA
1400
CKE ≤ VIL(max), tCK = min
338
CKE ≤ VIL(max), tCK = ∞
76
IDD2N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK = min
Input signals are changed one time during
2clks. All other pins ≥ VDD-0.2V or ≤ 0.2V
780
IDD2NS
CKE ≥ VIH(min), tCK = ∞
Input signals are stable.
230
IDD3P
CKE ≤ VIL(max), tCK = min
480
IDD3PS
CKE ≤ VIL(max), tCK = ∞
153
IDD3N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK = min
Input signals are changed one time during
2clks. All other pins ≥ VDD-0.2V or ≤ 0.2V
940
IDD3NS
CKE ≥ VIH(min), tCK = ∞
Input signals are stable.
620
Burst Mode Operating
Current
IDD4
tCK ≥ tCK(min), IOL=0mA
All banks active
Auto Refresh Current
IDD5
tRRC ≥ tRRC(min), All banks active
Self Refresh Current
IDD6
CKE ≤ 0.2V
IDD2P
Precharge Standby Current
in Power Down Mode
IDD2PS
Precharge Standby Current
in Non Power Down Mode
Active Standby Current
in Power Down Mode
Active Standby Current
in Non Power Down Mode
Unit
Note
mA
1
mA
mA
mA
CL=3
mA
2100
mA
1
4480
mA
2
270
mA
Note :
1. IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open
2. Min. of tRRC (Refresh RAS cycle time) is shown at AC CHARACTERISTICS II
3. All values are measured with Registered and PLL
Rev. 1.3/Nov. 01
9
PC133 SDRAM Registered DIMM
AC CHARACTERISTICS I (AC operating conditions unless otherwise noted)
HYM72V32C736T8 Series
-H
Parameter
Symbol
Unit
Note
1000
ns
1
2.5
-
ns
2
tCLW
2.5
-
ns
2
tAC3
-
5.4
ns
3
Data-Out Hold Time
tOH
2.7
-
ns
Data-Input Setup Time
tDS
1.5
-
ns
2
Data-Input Hold Time
tDH
0.8
-
ns
2
Address Setup Time
tAS
1.5
-
ns
2
Address Hold Time
tAH
0.8
-
ns
2
CKE Setup Time
tCKS
1.5
-
ns
2
CKE Hold Time
tCKH
0.8
-
ns
2
Command Setup Time
tCS
1.5
-
ns
2
Command Hold Time
tCH
0.8
-
ns
2
CLK to Data Output in Low-Z Time
tOLZ
1
-
ns
CLK to Data
Output in High-Z
Time
tOHZ3
2.7
5.4
ns
Min
Max
tCK3
7.5
Clock High Pulse Width
tCHW
Clock Low Pulse Width
Access Time
From Clock
System Clock
Cycle Time
CAS Latency = 3
CAS Latency = 3
CAS Latency = 3
Note :
1. In Registered DIMM, data is delayed an additional clock cycle due to the register (this is, Device CL + 1 = DIMM CL)
2. Assume tR / tF (input rise and fall time ) is 1ns, If tR & tF > 1ns, then [(tR+tF)/2-1]ns should be added to the parameter
3. Access times to be measured with input signals of 1v/ns edge rate, from 0.8v to 2.0v
If tR > 1ns, then (tR/2-0.5)ns should be added to the parameter
Rev. 1.3/Nov. 01
10
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
AC CHARACTERISTICS II
-H
Parameter
Symbol
Unit
Min
Max
Operation
tRC
65
-
ns
Auto Refresh
tRRC
65
-
ns
RAS to CAS Delay
tRCD
20
-
ns
RAS Active Time
tRAS
45
100K
ns
RAS Precharge Time
tRP
20
-
ns
RAS to RAS Bank Active Delay
tRRD
15
-
ns
CAS to CAS Delay
tCCD
1
-
CLK
Write Command to Data-In Delay
tWTL
0
-
CLK
Data-In to Precharge Command
tDPL
2
-
CLK
Data-In to Active Command
tDAL
5
-
CLK
DQM to Data-Out Hi-Z
tDQZ
2
-
CLK
DQM to Data-In Mask
tDQM
0
-
CLK
MRS to New Command
tMRD
2
-
CLK
Precharge to Data
CAS Latency = 3
Output Hi-Z
tPROZ3
4
-
CLK
Power Down Exit Time
tPDE
1
-
CLK
Self Refresh Exit Time
tSRE
1
-
CLK
Refresh Time
tREF
-
64
ms
Note
RAS Cycle Time
1
Note :
1. Timing delay due to the register is considered in a registered DIMM
2. A new command can be given tRRC after self refresh exit
Rev. 1.3/Nov. 01
11
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
DEVICE OPERATING OPTION TABLE
HYM72V32C736T8-H
CAS Latency
tRCD
tRAS
tRC
tRP
tAC
tOH
133MHz(7.5ns)
3CLKs
3CLKs
6CLKs
9CLKs
3CLKs
5.4ns
2.7ns
125MHz(8ns)
3CLKs
3CLKs
6CLKs
9CLKs
3CLKs
6ns
3ns
100MHz(10ns)
3CLKs
2CLKs
5CLKs
7CLKs
2CLKs
6ns
3ns
Note : DIMM/CAS Latency = Device CL + 1 (Registered Mode)
COMMAND TRUTH TABLE
A10/
AP
BA
CKEn-1
CKEn
CS
RAS
CAS
WE
DQM
Mode Register Set
H
X
L
L
L
L
X
OP code
No Operation
H
X
H
X
X
X
L
H
H
H
X
X
Bank Active
H
X
L
L
H
H
X
H
X
L
H
L
H
X
CA
H
X
L
H
L
L
X
CA
H
X
L
L
H
L
X
X
Burst Stop
H
X
L
H
H
L
X
X
DQM
H
V
X
Auto Refresh
H
H
L
L
L
H
X
X
Burst-Read-SingleWRITE
H
X
L
L
L
H
X
A9 Pin High
(Other Pins OP code)
Entry
H
L
L
L
L
H
X
Exit
L
H
H
X
X
X
L
H
H
H
Entry
H
L
H
X
X
X
L
H
H
H
H
X
X
X
L
H
H
H
H
X
X
X
L
V
V
V
Command
Read
Read with Autoprecharge
Write
Write with Autoprecharge
Precharge All Banks
Precharge selected Bank
Self Refresh1
X
Precharge
power down
Clock
Suspend
Exit
L
H
Entry
H
L
Exit
L
H
X
X
ADDR
RA
Note
V
L
H
L
H
V
V
H
X
L
V
X
X
X
X
X
X
X
Note :
1. Exiting Self Refresh occurs by asynchronously bringing CKE from low to high
2. X = Don′t care, H = Logic High, L = Logic Low. BA =Bank Address, RA = Row Address, CA = Column Address,
Opcode = Operand Code, NOP = No Operation
Rev. 1.3/Nov. 01
12
PC133 SDRAM Registered DIMM
HYM72V32C736T8 Series
PACKAGE DEMENSION
Rev. 1.3/Nov. 01
13