REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Added device type 06 for vendor cages 54230 and 88379. Added vendor cage 0EU86 for device types 01 through 06. Figure 1, changed case outline M to reflect package is available in either a single or dual cavity. -sld 99-05-14 K. A. Cottongim F Added case outline 9. 00-04-06 Raymond Monnin G Added device types 07, 08, and 09 for vendor cage 0EU86. Made changes to table I to include the addition of device types 07, 08, and 09. Added a min limit to the table I for the ILI, and the ILO tests. Made changes to Figures 2, 3, 4, 5, 6, and 8. -sld 02-01-31 Raymond Monnin 02-06-04 Raymond Monnin H Added case outline Z. Updated paragraph 1.2.4, 1.3, figures 1, 2, and 8. -sld REV H SHEET 35 REV H H H H H H H H H H H H H H H H H H H H SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV H H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Gary Zahn STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS POST OFFICE BOX 3990 COLUMBUS, OHIO 43216-5000 CHECKED BY Michael C. Jones APPROVED BY Kendall A. Cottongim MICROCIRCUIT, HYBRID, MEMORY, DIGITAL, 128K x 32-BIT, ELECTRICALLY ERASABLE/PROGRAMMABLE READ ONLY MEMORY DRAWING APPROVAL DATE 94-08-02 REVISION LEVEL H SIZE A CAGE CODE 5962-94585 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 35 5962-E373-02 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ RHA designator (see 1.2.1) 94585 01 Device type (see 1.2.2) / H Device class designator (see 1.2.3) M Case outline (see 1.2.4) X Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 02 03 04 05 06 07 08 09 Generic number Circuit function WE128K32-300HQ, ACT-E128K32N-300P7Q, AS8E128K32-300/883C WE128K32-250HQ, ACT-E128K32N-250P7Q, AS8E128K32-250/883C WE128K32-200HQ, ACT-E128K32N-200P7Q, AS8E128K32-200/883C WE128K32-150HQ, ACT-E128K32N-150P7Q, AS8E128K32-150/883C WE128K32-140HQ, ACT-E128K32N-140P7Q, AS8E128K32-140/883C WE128K32-120HQ, ACT-E128K32N-120P7Q, AS8E128K32-120/883C AS8ER128K32Q-250/883C AS8ER128K32Q-200/883C AS8ER128K32Q-150/883C Access time EEPROM, 128K x 32-bit EEPROM, 128K x 32-bit EEPROM, 128K x 32-bit EEPROM, 128K x 32-bit EEPROM, 128K x 32-bit EEPROM, 128K x 32-bit EEPROM, 128K x 32-bit EEPROM, 128K x 32-bit EEPROM, 128K x 32-bit 300 ns 250 ns 200 ns 150 ns 140 ns 120 ns 250 ns 200 ns 150 ns 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 2 D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. 1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter M N T U X Y 4 5 6 9 Z Descriptive designator Terminals See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 See figure 1 68 68 66 66 66 66 66 66 66 68 68 Package style Ceramic, single/dual cavity, quad flatpack Ceramic, single cavity, quad flatpack Hex-in-line, single cavity, with standoffs Hex-in-line, single cavity, without standoffs Hex-in-line, single cavity, with standoffs Hex-in-line, single cavity, without standoffs 1.075", hex-in-line, single cavity, with standoffs 1.075", hex-in-line, single cavity, with standoffs 1.075", hex-in-line, single cavity, with standoffs Ceramic, single cavity, quad flatpack Ceramic, dual cavity, quad flatpack 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC)........................................................ Input voltage range.................................................................... Power dissipation (PD)............................................................... Storage temperature range ....................................................... Lead temperature (soldering, 10 seconds)................................ Thermal resistance junction-to-case (θJC): Case outlines T, X, U, and Y.................................................. Case outline M and Z ............................................................. Case outline N ....................................................................... Case outlines 4, 5, and 6 ....................................................... Case outline 9 ........................................................................ Data retention............................................................................ Endurance ................................................................................. -0.6 V to +6.25 V -0.6 V to +6.25 V 1.4 W -65°C to +150°C +300°C 6.2°C/W 9.4°C/W 3.1°C/W 2.7°C/W 1.79°C/W 10 years minimum 10,000 cycles minimum 2/ 1.4 Recommended operating conditions. Supply voltage range (VCC)........................................................ Input low voltage range (VIL)...................................................... Input high voltage range (VIH): Device types 01 through 06 ................................................... Device types 07 through 09 ................................................... Output voltage, High minimum (VOH)......................................... Output voltage, low maximum (VOL) .......................................... Case operating temperature range (TC) .................................... 1/ 2/ +4.5 V dc to +5.5 V dc -0.5 V dc to +0.8 V dc +2.0 V dc to VCC + 0.3 V dc +2.2 V dc to VCC + 0.3 V dc +2.4 V dc +0.45 V dc -55°C to +125°C Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Device types 7 through 9 for page mode writes only. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4, 5, 6, and 7. 3.2.5 Block diagram. The block diagram shall be as specified on figure 8. 3.2.5 Typical output test circuit. The typical output test circuit shall be as specified on figure 9. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 4 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Programming procedure. The programming procedure shall be as specified by manufacturer and shall be available on request. 3.6 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked as listed in MIL-HDBK-103 and QML-38534. 3.7 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.8 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.9 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 3.10 Endurance. A reprogrammability test shall be completed as part of the vendor's reliability monitors. This reprogrammability test shall be done for the initial characterization and after any design or process changes which may affect the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase endurance cycles listed in section 1.3 herein over the full specified operating temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. 3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors. This test shall be done for initial characterization and after any design or process change which may affect data retention. The methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military temperature range. The vendor's procedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Group A subgroups Conditions 1/ 2/ -55°C ≤ TC ≤ +125°C +4.5 V dc ≤ VCC ≤ +5.5 V dc unless otherwise specified Device types Unit Limits Min Max DC parameters Supply current ICC Standby current ISB CS = VIL, OE = WE = VIH, I/O 0 through I/O 31 = open. Inputs = VCC = +5.5 V dc, A0 through A16 change at f = 5 MHz CMOS levels. 1,2,3 All 250 mA CS = VCC, OE = VIH, I/O 0 through I/O 31 = open. Inputs = VCC = +5.5 V dc, A0 through A16 change at f = 5 MHz CMOS levels. 1,2,3 All 5 mA Input leakage current ILI VIN = VSS to VCC 1,2,3 All -10 +10 µA Input leakage ( RES pin) IIL (RES) VIN = VSS to VCC 1,2,3 7,8,9 -500 +500 µA Output leakage current ILO CS = VIH, VOUT = VSS to VCC 1,2,3 All +10 µA Input low voltage VIL 1,2,3 All Input high voltage VIH 1,2,3 1-6 2.0 7-9 2.2 1,2,3 7-9 VCC -.5 V Input high voltage VH -10 V 0.8 V VCC +1V V 0.45 V RES signal Output low voltage VOL VCC = +4.5 V dc, IOL = 2.1 mA 1,2,3 All Output high voltage VOH VCC = +4.5 V dc, IOL = -400 µA 1,2,3 All 2.4 V Capacitance CAD COE VIN = 0 V dc, f = 1.0 MHz, TA = +25°C 4 All 50 pF OE capacitance 3/ CS1 -4 capacitance 3/ CCS VIN = 0 V dc, f = 1.0 MHz, TA = +25°C 4 All 20 pF WE1 -4 capacitance 3/ CWE1-4 VIN = 0 V dc, f = 1.0 MHz, TA = +25°C 4 All 20 pF A0 - A16 3/ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A subgroups Conditions 1/ 2/ -55°C ≤ TC ≤ +125°C +4.5 V dc ≤ VCC ≤+5.5 V dc unless otherwise specified Device types Unit Limits Min Max Capacitance - Continued. WE capacitance 3/ CWE VIN = 0 V dc, f = 1.0 MHz, TA = +25°C Case outline N, only. 4 All 50 pF I/O0-I/O31 capacitance 3/ CI/O VOUT = 0 V dc, f = 1.0 MHz, TA = +25°C 4 All 20 pF RES and RDY/ BUSY capacitance CRES CRDY RES = RDY/ BUSY = 0 V 4 7,8,9 50 pF See 4.3.1c 7,8A,8B All Functional tests Functional tests Read cycle timing characteristics ns 300 250 200 150 140 120 Read cycle timing tRC See figure 4. 9,10,11 01 02,07 03,08 04,09 05 06 Address access timing tACC See figure 4. 9,10,11 01 02,07 03,08 04,09 05 06 300 250 200 150 140 120 ns Chip select access timing tACS See figure 4. 9,10,11 01 02,07 03,08 04,09 05 06 300 250 200 150 140 120 ns Output hold from address tOH See figure 4. 9,10,11 All 0 ns change OE or CS See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A subgroups Conditions 1/ 2/ -55°C ≤ TC ≤ +125°C +4.5 V dc ≤ VCC ≤ +5.5 V dc unless otherwise specified Device types Unit Limits Min Max Read cycle timing characteristics - Continued. 125 100 85 55 50 75 ns 01-06 70 ns 07-09 50 Out enable to output valid tOE See figure 4. 9,10,11 01 02,07 03,08 04,05 06 09 Chip select or output enable to output high - Z 3/ tDF See figure 4. 9,10,11 0 0 0 0 0 0 Byte write AC timing characteristics. Address setup time Write pulse width tAS tWP See figure 5. 9,10,11 See figure 5. 9,10,11 01-06 10 07-09 0 01-06 150 07-09 250 Chip select setup time tCS See figure 5. 9,10,11 All Address hold time tAH See figure 5. 9,10,11 Output enable setup time tOES See figure 5. 9,10,11 ns ns 0 ns 01-06 100 ns 07-09 150 01-06 4 07-09 0 ns Data hold time tDH See figure 5. 9,10,11 All 10 ns Output enable hold time tOEH See figure 5. 9,10,11 01-06 10 ns 07-09 0 Data setup time tDS See figure 5. 9,10,11 All 100 ns Chip select hold time tCSH See figure 5. 9,10,11 All 0 ns Write pulse width high tWPH See figure 5. 9,10,11 01-06 50 ns 07-09 300 Write cycle time tWC See figure 5. 9,10,11 All 10 ms See footnotes at end of table STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Symbol Group A subgroups Conditions 1/ 2/ -55°C ≤ TC ≤ +125°C +4.5 V dc ≤ VCC ≤ +5.5 V dc unless otherwise specified Device types Unit Limits Min Max Page mode write AC timing characteristics. Data setup time tDS See figure 6. 9,10,11 All 100 ns Data hold time tDH See figure 6. 9,10,11 All 10 ns Write pulse width tWP See figure 6. 9,10,11 01-06 150 ns 07-09 250 Byte load cycle time Write pulse width high Write cycle time tBLC tWPH tWC See figure 6. 9,10,11 See figure 6. 9,10,11 01-06 150 07-09 30 01-06 50 07-09 300 See figure 6. 9,10,11 All µs ns 10 ms Data polling AC timing characteristics. 3/ Data hold time tDH See figure 7. 9,10,11 All 10 ns Output enable hold time tOEH See figure 7. 9,10,11 All 10 ns Output enable to output delay tOE See figure 7. 9,10,11 All Write recovery time tWR See figure 7. 9,10,11 All 0 RES low to output float tDFR See figure 4. 9,10,11 07-09 0 350 ns RES to output delay tRR See figure 4. 9,10,11 07-09 0 450 ns Reset protect time tRP See figures 5 and 6. 9,10,11 07-09 100 Reset high time tRES See figures 5 and 6. 9,10,11 07-09 Time to device busy tDB See figures 5 and 6. 9,10,11 07-09 1/ Unless otherwise specified, the AC test conditions are as follows: Input pulse levels: VIL = 0 V and VIH = 3.0 V. Input rise and fall times: 5 nanoseconds. Input and output timing reference level: 1.5 V. 2/ RES and RDY/ BUSY functions are applicable for device types 07 through 09 only. 3/ Guaranteed by design, but not tested. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 100 ns ns µs µs 1.0 120 ns SIZE 5962-94585 A REVISION LEVEL H SHEET 9 Case outline M. FIGURE 1. Case outline(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 10 Case outline M - Continued. Symbol Millimeters Inches Min Max Min Max A 3.12 5.08 .123 .200 A1 2.30 4.72 .118 .186 A2 0.00 0.51 .000 .020 b 0.33 0.43 .013 .017 B 0.25 REF .010 REF D/E 20.32 BSC .800 BSC D1/E1 22.10 22.61 .870 .890 D2/E2 24.89 25.40 .980 1.000 D3/E3 23.77 24.28 .936 .956 e 1.27 BSC R 0.13 L1 0.89 .050 BSC .005 1.14 .035 .045 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. 3. Case outline M may either be a single cavity or a dual cavity package. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 11 Case outline N. Symbol A A1 A2 b c D/E D1/E1 D2/E2 e e1 j k L S1 Millimeters Min Max 4.45 5.08 1.52 BSC 1.14 1.39 0.31 0.46 0.23 0.31 63.63 66.42 39.24 40.01 73.28 84.20 1.27 BSC 20.32 BSC 4.83 5.33 37.72 38.48 12.19 13.21 9.65 BSC Inches Min Max .175 .200 .060 BSC .045 .055 .012 .018 .009 .012 2.505 2.615 1.545 1.575 2.885 3.315 .050 BSC .800 BSC .190 .210 1.485 1.515 .480 .520 .380 BSC NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 12 Case outlines T, X, 4, 5, and 6. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 13 Case outlines T and X - Continued. Symbol A A1 A2 øb øb1 øb2 D/E D1/E1 D2 D3 e L Millimeters Min Max 5.33 6.22 0.64 0.89 3.42 3.68 0.41 0.51 1.14 1.40 1.65 1.91 29.72 30.48 25.40 BSC 15.24 BSC 28.96 29.21 2.54 BSC 3.68 3.94 Inches Min Max .210 .245 .025 .035 .135 .145 .016 .020 .045 .055 .065 .075 1.170 1.200 1.000 BSC .600 BSC 1.140 1.150 .100 BSC .145 .155 Case outlines 4, 5, and 6 - Continued. Symbol A A1 øb øb1 øb2 D/E D1/E1 D2 D3 e L Millimeters Min Max 3.43 4.60 0.64 0.89 0.41 0.51 1.14 1.40 1.65 1.91 27.05 27.56 25.40 BSC 15.24 BSC 25.90 26.92 2.54 BSC 3.35 3.94 Inches Min Max .135 .181 .025 .035 .016 .020 .045 .055 .065 .075 1.065 1.085 1.000 BSC .600 BSC 1.020 1.060 .100 BSC .132 .155 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is identified by .070 inch (1.78 mm) square pad. 3. Pin numbers are for reference only. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 14 Case outlines U and Y. Symbol A A1 A2 øb øb1 øb2 D/E D1/E1 D2 D3 e L Millimeters Min Max 4.70 5.84 0.13 0.51 3.42 3.68 0.41 0.51 0.76 1.52 1.65 1.91 29.72 30.48 25.40 BSC 15.24 BSC 28.96 29.21 2.54 BSC 4.19 4.70 Inches Min Max .185 .230 .005 .020 .135 .145 .016 .020 .030 .060 .065 .075 1.170 1.200 1.000 BSC .600 BSC 1.140 1.150 .100 BSC .165 .185 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is identified by .070 inch (1.78 mm) square pad. 3. Pin numbers are for reference only. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 15 Case outline 9. Symbol A A1 A2 b C D/E D1/E1 D2/E2 e L1 Millimeters Min Max 3.56 2.79 0.46 0.76 0.33 0.43 0.15 0.25 20.32 BSC 23.65 24.10 25.15 25.40 1.27 BSC 0.51 1.14 Inches Min Max .140 .110 .018 .030 .013 .017 .006 .010 .800 BSC .931 .949 .990 1.000 .050 BSC .020 .045 NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 16 Case outline Z. FIGURE 1. Case outline(s) -Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 17 Case Z - Continued. Symbol A A1 A2 b c D/E D1/E1 D2/E2 e e1 j k L R S1 Millimeters Min Max 3.12 5.08 3.00 4.72 0.00 0.51 0.33 0.43 0.23 0.31 27.58 28.30 22.10 22.61 48.77 50.80 1.27 BSC 20.32 BSC 4.95 5.21 22.73 22.99 8.00 8.26 0.13 1.02 BSC Inches Min Max .123 .200 .118 .186 .000 .020 .013 .017 .009 .012 1.086 1.114 .870 .890 1.920 2.000 .050 BSC .800 BSC .195 .205 .895 .905 .315 .325 .005 .040 BSC NOTES: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin numbers are for reference only. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 18 Device types 1-6 Device types 1-6 Device types 1-6 Device types 1-6 Case outlines M, 9 Case outlines M, 9 Case outlines M, 9 Case outlines M, 9 Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 GND 18 GND 35 OE 52 GND 2 CS3 19 I/O8 36 CS2 53 I/O23 3 A5 20 I/O9 37 NC 54 I/O22 4 A4 21 I/O10 38 WE 2 55 I/O21 5 A3 22 I/O11 39 WE3 56 I/O20 6 A2 23 I/O12 40 WE 4 57 I/O19 7 A1 24 I/O13 41 NC 58 I/O18 8 A0 25 I/O14 42 NC 59 I/O17 9 NC 26 I/O15 43 NC 60 I/O16 10 I/O0 27 VCC 44 I/O31 61 VCC 11 I/O1 28 A11 45 I/O30 62 A10 12 I/O2 29 A12 46 I/O29 63 A9 13 I/O3 30 A13 47 I/O28 64 A8 14 I/O4 31 A14 48 I/O27 65 A7 15 I/O5 32 A15 49 I/O26 66 A6 16 I/O6 33 A16 50 I/O25 67 WE1 17 I/O7 34 CS1 51 I/O24 68 CS4 NOTES: 1. NC is no connection. 2. For case outline M, device types 07 through 09, pin 9 is RES , pin 31 is A15, pin 32 is A14, and pin 43 is RDY/ BUSY . FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 19 Device types 1-6 Device types 1-6 Device types 1-6 Device types 1-6 Case outline N Case outline N Case outline N Case outline N Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 GND 18 GND 35 OE 52 GND 2 CS1 19 I/O8 36 CS4 53 I/O23 3 A5 20 I/O9 37 NC 54 I/O22 4 A4 21 I/O10 38 NC 55 I/O21 5 A3 22 I/O11 39 NC 56 I/O20 6 A2 23 I/O12 40 NC 57 I/O19 7 A1 24 I/O13 41 NC 58 I/O18 8 A0 25 I/O14 42 NC 59 I/O17 9 NC 26 I/O15 43 NC 60 I/O16 10 I/O0 27 VCC 44 I/O31 61 VCC 11 I/O1 28 A11 45 I/O30 62 A10 12 I/O2 29 A12 46 I/O29 63 A9 13 I/O3 3 A13 47 I/O28 64 A8 14 I/O4 31 A14 48 I/O27 65 A7 15 I/O5 32 A15 49 I/O26 66 A6 16 I/O6 33 A16 50 I/O25 67 WE 17 I/O7 34 CS2 51 I/O24 68 CS3 NOTE: NC is no connection. FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 20 Device types 1-6 Device types 1-6 Device types 1-6 Device types 1-6 Case outlines T,U,X,Y, 4,5 Case outlines T,U,X,Y, 4,5 Case outlines T,U,X,Y, 4,5 Case outlines T,U,X,Y, 4,5 Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 I/O8 18 A12 35 I/O25 52 WE3 2 I/O9 19 VCC 36 I/O26 53 CS3 3 I/O10 20 CS1 37 A6 54 GND 4 A13 21 NC 38 A7 55 I/O19 5 A14 22 I/03 39 NC 56 I/O31 6 A15 23 I/015 40 A8 57 I/O30 7 A16 24 I/O14 41 A9 58 I/O29 8 NC 25 I/O13 42 I/O16 59 I/O28 9 I/O0 26 I/O12 43 I/O17 60 A0 10 I/O1 27 OE 44 I/O18 61 A1 11 I/O2 28 NC 45 VCC 62 A2 12 WE 2 29 WE1 46 CS4 63 I/O23 13 CS2 30 I/O7 47 WE 4 64 I/O22 14 GND 31 I/O6 48 I/O27 65 I/O21 15 I/O11 32 I/O5 49 A3 66 I/O20 16 A10 33 I/O4 50 A4 17 A11 34 I/O24 51 A5 NOTE: Case outlines T, U, and 4, pins 8, 21, 28, and 39 are no connects (NC) and for case outlines X, Y, and 5, pins 8, 21, 28, and 39 are ground. FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 21 Device types 1-6 Device types 1-6 Device types 1-6 Device types 1-6 Case outline 6 Case outline 6 Case outline 6 Case outline 6 Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 I/O8 18 A15 35 I/O25 52 WE3 2 I/O9 19 VCC 36 I/O26 53 CS3 3 I/O10 20 CS1 37 A7 54 GND 4 A14 21 NC 38 A12 55 I/O19 5 A16 22 I/03 39 NC 56 I/O31 6 A11 23 I/015 40 A13 57 I/O30 7 A0 24 I/O14 41 A8 58 I/O29 8 NC 25 I/O13 42 I/O16 59 I/O28 9 I/O0 26 I/O12 43 I/O17 60 A1 10 I/O1 27 OE 44 I/O18 61 A2 11 I/O2 28 NC 45 VCC 62 A3 12 WE 2 29 WE1 46 CS4 63 I/O23 13 CS2 30 I/O7 47 WE 4 64 I/O22 14 GND 31 I/O6 48 I/O27 65 I/O21 15 I/O11 32 I/O5 49 A4 66 I/O20 16 A10 33 I/O4 50 A5 17 A9 34 I/O24 51 A6 NOTE: NC is no connection. FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 22 Device types 7-9 Device types 7-9 Device types 7-9 Device types 7-9 Case outline M, Z Case outline M, Z Case outline M, Z Case outline M, Z Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol Terminal number Terminal symbol 1 GND 18 GND 35 OE 52 GND 2 CS3 19 I/O8 36 CS2 53 I/O23 3 A5 20 I/O9 37 NC 54 I/O22 4 A4 21 I/O10 38 WE 2 55 I/O21 5 A3 22 I/O11 39 WE3 56 I/O20 6 A2 23 I/O12 40 WE 4 57 I/O19 7 A1 24 I/O13 41 NC 58 I/O18 8 A0 25 I/O14 42 NC 59 I/O17 9 RES 26 I/O15 43 RDY/ BUSY 60 I/O16 10 I/O0 27 VCC 44 I/O31 61 VCC 11 I/O1 28 A11 45 I/O30 62 A10 12 I/O2 29 A12 46 I/O29 63 A9 13 I/O3 30 A13 47 I/O28 64 A8 14 I/O4 31 A15 48 I/O27 65 A7 15 I/O5 32 A14 49 I/O26 66 A6 16 I/O6 33 A16 50 I/O25 67 WE1 17 I/O7 34 CS1 51 I/O24 68 CS4 NOTES: 1. NC is no connection. 2. For case outline M, device types 01 through 06, pin 9 is a no connect, pin 31 is A14, pin 32 is A15, and pin 43 is a no connect. FIGURE 2. Terminal connections - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 23 Device types 01 through 06. CS OE WE A0-A16 Mode Data I/O Device Current H X X X Standby High Z Standby L L H Stable Read Data Out Active L H L Stable Write Data In Active X H X X Out Disable High Z Active X X H X Write Inhibit Active X L X NOTES: 1. H = VIH = High logic level 2. L = VIL = Low logic level 3. X = Do not care (either high or low) 4. High Z = High impedance state X Write Inhibit Active Device types 07 trough 09. Mode CS OE WE RES RDY/ BUSY I/O Read VIL VIL VIH VH High Z Dout Standby VIH X X X High Z High Z Write VIL VIH VIL VH High Z to VOL DIN Deselect VIL VIH VIH VH High Z High Z Write inhibit X X VIH X --- --- Write inhibit X VIL X X --- --- Data polling VIL VIL VIH VH VOL DOUT (I/O7) Program reset X X X VIL High Z High Z NOTES: 1. VIH = High logic "1" state. 2. VIL = Low logic "0" state. 3. X = "do not care" state. 4. High Z = High impedance state. 5. DIN = Data in, DOUT = Data out, and VH = VCC - 0.5 V to VCC +1.0 V. FIGURE 3. Truth table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 24 NOTE: RES waveform is applicable for device types 07 through 09 only. FIGURE 4. Read cycle timing diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 25 NOTE: RDY/ BUSY , RES and VCC waveforms are applicable for device types 07 through 09 only. FIGURE 5. Write cycle timing diagram WE controlled. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 26 NOTE: RDY/ BUSY , RES and VCC waveforms are applicable for device types 07 through 09 only. FIGURE 5. Write cycle timing diagram CS controlled - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 27 NOTES: 1. AO through A6 are used to address specific bytes within a page. 2. A7 through A16 must specify the same page address during each high to low transition of write enable or chip select. 3. RDY/ BUSY , RES and VCC waveforms are applicable for device types 07 through 09 only. FIGURE 6. Page mode write timing diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 28 FIGURE 7. Data polling AC timing diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 29 Case outlines M, T, U, X, Y, 4, 5, 6, and 9. Case outline N. FIGURE 8. Block diagram(s). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 30 Case outlines M and Z, device types 07, 08, and 09 only. FIGURE 8. Block diagram - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 31 NOTES: 1. VZ is programmed from -2.0 V to +7.0 V. IOH and IOL are programmable from 0 to 16 mA. 2. Tester impedance ZO = 75 ohms 3. VZ is typically the midpoint of VOH and VOL. 4. CL includes tester includes jig capacitance. FIGURE 9. Typical output test circuit. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 32 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) 1,4,7,9 Interim electrical parameters Final electrical parameters 1*,2,3,4,7,8A,8B,9,10,11 Group A test requirements 1,2,3,4,7,8A,8B,9,10,11 Group C end-point electrical parameters 1,2,3,4,7,8A,8B,9,10,11 Not applicable End-point electrical parameters for radiation hardness assurance (RHA) devices * PDA applies to subgroup 1. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. . 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534, or by the manufacturer's Quality Management (QM) Plan in accordance with appendix B of MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 33 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 shall be omitted. c. Subgroups 7, 8A, and 8B shall include verification of the truth table. d. The following data patterns shall be verified during subgroups 7, 8A, and 8B: (1) 0's to all memory cell locations. (2) 1's to all memory cell locations. (3) Checkerboard pattern to entire memory array. (4) Checkerboard compliment to entire memory array. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. All devices requiring end-point electrical testing shall be programmed with a checkerboard pattern of alternate rows of AA hex and 55 hex. c. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. (4) The checkerboard data pattern shall be verified after burn-in as part of end-point electrical testing. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation hardness assurance (RHA) insepction. RHA inspection is currently not applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 34 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-PRF-38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Post Office Box 3990, Columbus, Ohio 432165000, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-94585 A REVISION LEVEL H SHEET 35 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-06-04 Approved sources of supply for SMD 5962-94585 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. Standard microcircuit drawing PIN 1/ 5962-9458501HMA 5962-9458501HMC 5962-9458501HMA 5962-9458501HMC 5962-9458501HMA 5962-9458501HMC 5962-9458501HNC 5962-9458501HTA 5962-9458501HTC 5962-9458501HUA 5962-9458501HUC 5962-9458501HXA 5962-9458501HXC 5962-9458501HYA 5962-9458501HYC 5962-9458501H4A 5962-9458501H4C 5962-9458501H4A 5962-9458501H4C 5962-9458501H4A 5962-9458501H4C 5962-9458501H5A 5962-9458501H5C 5962-9458501H5A 5962-9458501H5C 5962-9458501H5A 5962-9458501H5C 5962-9458501H6A 5962-9458501H6C 5962-9458501H9A 5962-9458501H9C Vendor CAGE number Vendor similar PIN 2/ 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0EU86 0EU86 54230 54230 88379 88379 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 AS8E128K32Q-300/883C AS8E128K32Q-300/883C WE128K32-300G2Q WE128K32-300G2Q ACT-E128K32N-300F2Q ACT-E128K32N-300F2Q WE128K32-300G4Q WE128K32N-300HQ WE128K32N-300HQ WE128K32N-300HQ WE128K32N-300HQ WE128K32-300HQ WE128K32-300HQ WE128K32-300HQ WE128K32-300HQ AS8E128K32PN-300/883C AS8E128K32PN-300/883C WE128K32N-300H1Q WE128K32N-300H1Q ACT-E128K32N-300P7Q ACT-E128K32N-300P7Q AS8E128K32P-300/883C AS8E128K32P-300/883C WE128K32-300H1Q WE128K32-300H1Q ACT-E128K32C-300P7Q ACT-E128K32C-300P7Q WE128K32NP-300H1Q WE128K32NP-300H1Q WE128K32-300G1UQ WE128K32-300G1UQ See footnotes at end of table. 1 of 7 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. DATE: 02-06-04 Standard microcircuit drawing PIN 1/ 5962-9458502HMA 5962-9458502HMC 5962-9458502HMA 5962-9458502HMC 5962-9458502HMA 5962-9458502HMC 5962-9458502HNC 5962-9458502HTA 5962-9458502HTC 5962-9458502HUA 5962-9458502HUC 5962-9458502HXA 5962-9458502HXC 5962-9458502HYA 5962-9458502HYC 5962-9458502H4A 5962-9458502H4C 5962-9458502H4A 5962-9458502H4C 5962-9458502H4A 5962-9458502H4C 5962-9458502H5A 5962-9458502H5C 5962-9458502H5A 5962-9458502H5C 5962-9458502H5A 5962-9458502H5C 5962-9458502H6A 5962-9458502H6C 5962-9458502H9A 5962-9458502H9C Vendor CAGE number Vendor similar PIN 2/ 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0EU86 0EU86 54230 54230 88379 88379 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 AS8E128K32Q-250/883C AS8E128K32Q-250/883C WE128K32-250G2Q WE128K32-250G2Q ACT-E128K32N-250F2Q ACT-E128K32N-250F2Q WE128K32-300G4Q WE128K32N-250HQ WE128K32N-250HQ WE128K32N-250HQ WE128K32N-250HQ WE128K32-250HQ WE128K32-250HQ WE128K32-250HQ WE128K32-250HQ AS8E128K32PN-250/883C AS8E128K32PN-250/883C WE128K32N-250H1Q WE128K32N-250H1Q ACT-E128K32N-250P7Q ACT-E128K32N-250P7Q AS8E128K32P-250/883C AS8E128K32P-250/883C WE128K32-250H1Q WE128K32-250H1Q ACT-E128K32C-250P7Q ACT-E128K32C-250P7Q WE128K32NP-250H1Q WE128K32NP-250H1Q WE128K32-250G1UQ WE128K32-250G1UQ See footnotes at end of table. 2 of 7 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. DATE: 02-06-04 Standard microcircuit drawing PIN 1/ 5962-9458503HMA 5962-9458503HMC 5962-9458503HMA 5962-9458503HMC 5962-9458503HMA 5962-9458503HMC 5962-9458503HNC 5962-9458503HTA 5962-9458503HTC 5962-9458503HUA 5962-9458503HUC 5962-9458503HXA 5962-9458503HXC 5962-9458503HYA 5962-9458503HYC 5962-9458503H4A 5962-9458503H4C 5962-9458503H4A 5962-9458503H4C 5962-9458503H4A 5962-9458503H4C 5962-9458503H5A 5962-9458503H5C 5962-9458503H5A 5962-9458503H5C 5962-9458503H5A 5962-9458503H5C 5962-9458503H6A 5962-9458503H6C 5962-9458503H9A 5962-9458503H9C Vendor CAGE number Vendor similar PIN 2/ 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0EU86 0EU86 54230 54230 88379 88379 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 AS8E128K32Q-200/883C AS8E128K32Q-200/883C WE128K32-200G2Q WE128K32-200G2Q ACT-E128K32N-200F2Q ACT-E128K32N-200F2Q WE128K32-300G4Q WE128K32N-200HQ WE128K32N-200HQ WE128K32N-200HQ WE128K32N-200HQ WE128K32-200HQ WE128K32-200HQ WE128K32-200HQ WE128K32-200HQ AS8E128K32PN-200/883C AS8E128K32PN-200/883C WE128K32N-200H1Q WE128K32N-200H1Q ACT-E128K32N-200P7Q ACT-E128K32N-200P7Q AS8E128K32P-200/883C AS8E128K32P-200/883C WE128K32-200H1Q WE128K32-200H1Q ACT-E128K32C-200P7Q ACT-E128K32C-200P7Q WE128K32NP-200H1Q WE128K32NP-200H1Q WE128K32-200G1UQ WE128K32-200G1UQ See footnotes at end of table. 3 of 7 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. DATE: 02-06-04 Standard microcircuit drawing PIN 1/ 5962-9458504HMA 5962-9458504HMC 5962-9458504HMA 5962-9458504HMC 5962-9458504HMA 5962-9458504HMC 5962-9458504HNC 5962-9458504HTA 5962-9458504HTC 5962-9458504HUA 5962-9458504HUC 5962-9458504HXA 5962-9458504HXC 5962-9458504HYA 5962-9458504HYC 5962-9458504H4A 5962-9458504H4C 5962-9458504H4A 5962-9458504H4C 5962-9458504H4A 5962-9458504H4C 5962-9458504H5A 5962-9458504H5C 5962-9458504H5A 5962-9458504H5C 5962-9458504H5A 5962-9458504H5C 5962-9458504H6A 5962-9458504H6C 5962-9458504H9A 5962-9458504H9C Vendor CAGE number Vendor similar PIN 2/ 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0EU86 0EU86 54230 54230 88379 88379 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 AS8E128K32Q-150/883C AS8E128K32Q-150/883C WE128K32-150G2Q WE128K32-150G2Q ACT-E128K32N-150F2Q ACT-E128K32N-150F2Q WE128K32-150G4Q WE128K32N-150HQ WE128K32N-150HQ WE128K32N-150HQ WE128K32N-150HQ WE128K32-150HQ WE128K32-150HQ WE128K32-150HQ WE128K32-150HQ AS8E128K32PN-150/883C AS8E128K32PN-150/883C WE128K32N-150H1Q WE128K32N-150H1Q ACT-E128K32N-150P7Q ACT-E128K32N-150P7Q AS8E128K32P-150/883C AS8E128K32P-150/883C WE128K32-150H1Q WE128K32-150H1Q ACT-E128K32C-150P7Q ACT-E128K32C-150P7Q WE128K32NP-150H1Q WE128K32NP-150H1Q WE128K32-150G1UQ WE128K32-150G1UQ See footnotes at end of table. 4 of 7 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. DATE: 02-06-04 Standard microcircuit drawing PIN 1/ 5962-9458505HMA 5962-9458505HMC 5962-9458505HMA 5962-9458505HMC 5962-9458505HMA 5962-9458505HMC 5962-9458505HNC 5962-9458505HTA 5962-9458505HTC 5962-9458505HUA 5962-9458505HUC 5962-9458505HXA 5962-9458505HXC 5962-9458505HYA 5962-9458505HYC 5962-9458505H4A 5962-9458505H4C 5962-9458505H4A 5962-9458505H4C 5962-9458505H4A 5962-9458505H4C 5962-9458505H5A 5962-9458505H5C 5962-9458505H5A 5962-9458505H5C 5962-9458505H5A 5962-9458505H5C 5962-9458505H6A 5962-9458505H6C 5962-9458505H9A 5962-9458505H9C Vendor CAGE number Vendor similar PIN 2/ 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0EU86 0EU86 54230 54230 88379 88379 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 AS8E128K32Q-140/883C AS8E128K32Q-140/883C WE128K32-140G2Q WE128K32-140G2Q ACT-E128K32N-140F2Q ACT-E128K32N-140F2Q WE128K32-140G4Q WE128K32N-140HQ WE128K32N-140HQ WE128K32N-140HQ WE128K32N-140HQ WE128K32-140HQ WE128K32-140HQ WE128K32-140HQ WE128K32-140HQ AS8E128K32PN-140/883C AS8E128K32PN-140/883C WE128K32N-140H1Q WE128K32N-140H1Q ACT-E128K32N-140P7Q ACT-E128K32N-140P7Q AS8E128K32P-140/883C AS8E128K32P-140/883C WE128K32-140H1Q WE128K32-140H1Q ACT-E128K32C-140P7Q ACT-E128K32C-140P7Q WE128K32NP-140H1Q WE128K32NP-140H1Q WE128K32-140G1UQ WE128K32-140G1UQ See footnotes at end of table. 5 of 7 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. DATE: 02-06-04 Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-9458506HMA 5962-9458506HMC 5962-9458506HMA 5962-9458506HMC 5962-9458506HMA 5962-9458506HMC 5962-9458506HNC 5962-9458506HTA 5962-9458506HTC 5962-9458506HUA 5962-9458506HUC 5962-9458506HXA 5962-9458506HXC 5962-9458506HYA 5962-9458506HYC 5962-9458506H4A 5962-9458506H4C 5962-9458506H4A 5962-9458506H4C 5962-9458506H4A 5962-9458506H4C 5962-9458506H5A 5962-9458506H5C 5962-9458506H5A 5962-9458506H5C 5962-9458506H5A 5962-9458506H5C 5962-9458506H6A 5962-9458506H6C 5962-9458506H9A 5962-9458506H9C 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0EU86 0EU86 54230 54230 88379 88379 0EU86 0EU86 54230 54230 88379 88379 54230 54230 54230 54230 AS8E128K32Q-120/883C AS8E128K32Q-120/883C WE128K32-120G2Q WE128K32-120G2Q ACT-E128K32N-120F2Q ACT-E128K32N-120F2Q WE128K32-120G4Q WE128K32N-120HQ WE128K32N-120HQ WE128K32N-120HQ WE128K32N-120HQ WE128K32-120HQ WE128K32-120HQ WE128K32-120HQ WE128K32-120HQ AS8E128K32PN-120/883C AS8E128K32PN-120/883C WE128K32N-120H1Q WE128K32N-120H1Q ACT-E128K32N-120P7Q ACT-E128K32N-120P7Q AS8E128K32P-120/883C AS8E128K32P-120/883C WE128K32-120H1Q WE128K32-120H1Q ACT-E128K32C-120P7Q ACT-E128K32C-120P7Q WE128K32NP-120H1Q WE128K32NP-120H1Q WE128K32-120G1UQ WE128K32-120G1UQ 5962-9458507HMA 5962-9458507HMC 5962-9458507HZC 5962-9458508HMA 5962-9458508HMC 5962-9458508HZC 5962-9458509HMA 5962-9458509HMC 5962-9458509HZC 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 0EU86 AS8ER128K32Q-250/883C AS8ER128K32Q-250/883C AS8ER128K32QB-250/883C AS8ER128K32Q-200/883C AS8ER128K32Q-200/883C AS8ER128K32QB-200/883C AS8ER128K32Q-150/883C AS8ER128K32Q-150/883C AS8ER128K32QB-150/883C Vendor similar PIN 2/ See footnotes at top of next page. 6 of 7 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued. DATE: 02-06-04 1/ 2/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number Vendor name and address 0EU86 Austin Semiconductor, Incorporated 8701 Cross Park Drive Austin, TX 78754-4566 54230 White Electronic Designs Corporation 3601 East University Drive Phoenix, AZ 85034-7217 88379 Aeroflex Circuit Technology Corporation 35 South Service Road Plainview, NY 11803-4101 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 7 of 7