EMIF10-COM01 ® IPAD. EMI FILTER INCLUDING ESD PROTECTION TM MAIN APPLICATIONS Where EMI filtering in ESD sensitive equipment is required: Computers and printers Communication systems Mobile phones ■ ■ ■ DESCRIPTION The EMIF10-COM01 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 flip-chip packaging means the package size is equal to the die size. That's why EMIF10-COM01 is a very small device. Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to BENEFITS EMI symetrical (I/O) low-pass filter Very low PCB space consuming: 2 2.64 x 2.64 mm Very thin package: 0.63 mm High efficiency in ESD suppression on both input & output PINS (IEC61000-4-2 level 4). High reliability offered by monolithic integration Flip Chip package ■ ■ PIN CONFIGURATION (Ball Side) ■ 1 2 3 4 5 E 01 02 03 04 05 COMPLIES WITH FOLLOWING STANDARD: IEC61000-4-2 level 4 15 KV (air discharge) 8 kV (contact discharge) D 06 07 08 09 010 BASIC CELL CONFIGURATION C ■ ■ Low-pass Filter Input GND GND GND GND GND B I6 I7 I8 I9 I10 A I1 I2 I3 I4 I5 Output RI/O = 200Ω Cinput = 45 pF ASD is a trademark of STMicroelectronics. January 2002 - Ed: 5A 1/5 EMIF10-COM01 Filtering Behavior Capacitance versus reverse applied voltage EMIF10-COM01: Typical S21(dB) measurement on line I10/O10 0.00 dB -5.00 C(pF) -10.00 50 F=1MHz Vosc=30mV -15.00 40 -20.00 -25.00 30 -30.00 20 -35.00 -40.00 10 0 -45.00 -50.00 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M f/Hz 1.0G 1 2 VR(V) 3 4 5 3.0G Note: Spikes at high frequencies are induced by the PCB layout Crosstalk Behavior Analog Crosstalk: Measurements EMIF10-COM01: Typical A1/A2 crosstalk measurement TEST BOARD EMIF10 COM01 out2 50Ω in1 50Ω Vg 0.00 dB -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 -35.00 -40.00 -45.00 -50.00 -55.00 -60.00 -65.00 -70.00 -75.00 -80.00 1.0M 3.0M 10.0M 30.0M 100.0M f/Hz Rise Time Rise Time: Measurement EMIF10-COM01 In Out Vout Square signal Generator Vc = 2.8V Vin 100k Vout Vin 2/5 300.0M 1.0G 3.0G EMIF10-COM01 ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C) Symbol VPP Tj Parameter and test conditions Value Unit ESD discharge IEC61000-4-2, air discharge ESD discharge IEC61000-4-2, contact discharg 15 8 kV Junction temperature 125 °C Top Operating temperature range -40 to + 85 °C Tstg Storage temperature range -55 to +150 °C ELECTRICAL CHARACTERISTICS (Tamb = 25°C) Symbol I Parameters VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current RI/O Series resistance between Input & Output Cin Input capacitance per line VCL VBR Symbol Test conditions VBR IR = 1mA IRM VRM = 3V per line Rd IPP = 10A, tp = 2.5µs (see note 1) VRM slope : 1 / R d Cin At 0V bias tLH Vout = 2.8V Rload = 100kΩ IPP Min Typ Max Unit 6 8 10 V 500 nA Ω 1 180 RI/O V IRM IR 200 220 Ω 45 50 pF 25 ns 3/5 EMIF10-COM01 APLAC MODEL 200R out in MODEL = demif10 MODEL = demif10 Demif10 model BV = 7 IBV = 1m CJO = 25p M = 0.3333 RS = 1 VJ = 0.6 TT = 100n sub PCB grounding recommendations In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we recommend to implement microvias (100 µm dia.) between the GND bumps and the GND layer. GND bumps can be connected together in PCB layer 1, and in addition, if possible, use through hole vias (200 um dia.) in both sides of filter to improve contact to GND (layer). This layout will minimize the distance to the ground and thus parasitic inductances. In addition, we recommend to have GND plane wherever possible. ORDERING CODE EMIF 10 - COM 01 Version EMI Filter Nb of lines 4/5 For communication EMIF10-COM01 All dimensions in µm PACKAGE MECHANICAL DATA DIE SIZE 2640 650 500 ■ Die size: (2640 ± 50) x (2640 ± 50) Die height (including bumps): 650 ± 65 Bump diameter: 315 ± 50 Pitch: 500 ± 50 Weight: 9.3mg ■ Y W W: Date code ■ ■ ■ ■ 2640 MARKING 300 300 ® 2640 diam 400 F E T Y WW 2640 PACKING: EMIF10-COM01 is delivered in Tape & Reel (7 inches reel); one Tape & Reel contains 5000 dice. Note: More packing information are available in the application note AN1235: "Flip-Chip package description and recommendations for use" Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics - Printed in Italy - All rights reserved. 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