BM60013FV-C Datasheet Gate Driver Providing Galvanic isolation Series Isolation voltage 2500Vrms 1ch Gate Driver Providing Galvanic Isolation BM60013FV-C ●General Description The BM60013FV-C is a gate driver with isolation voltage 2500Vrms, I/O delay time of 200ns, and minimum input pulse width of 100ns, and incorporates the fault signal output functions, undervoltage lockout (UVLO) function, thermal protection function, and short current protection (SCP, DESAT) function. ●Key Specifications ■ Isolation voltage: ■ Maximum gate drive voltage: ■ I/O delay time: ■ Minimum input pulse width: W(Typ.) x D(Typ.) x H(Max.) 6.50 ㎜×8.10 ㎜×2.01 ㎜ ●Package SSOP-B20W ●Features ■ Providing Galvanic Isolation ■ Active Miller Clamping ■ Fault signal output function (Adjustable output holding time) ■ Undervoltage lockout function ■ Thermal protection function (Adjustable threshold voltage) ■ Short current protection function (Adjustable threshold voltage) ■ Soft turn-off function for short current protection 2500 [Vrms] (Min.) 20 [V] (Max.) 200 [ns] (Max.) 100 [ns] (Max.) ●Applications ■ Automotive isolated IGBT/MOSFET inverter gate drive ■ Automotive DC-DC converter ■ Industrial inverters systems ■ UPS systems ● Typical Application Circuits GND1 PROOUT S LOGIC INB Q MASK PRE DRIVER FLT VCC2 LOGIC UVLO FB MASK TIMER INA ECU FLT CFLT RLS ENA CVCC1 OUT1 R FLTRLS VCC1 GND2 FLT TIMER OUT2 UVLO SCPIN MASK SCPTH MASK MASK TEST CVCC2 RFLTRLS NC VTSTH GND2 MASK GND1 VTSIN Sens or Figure 1. For using 4-pin IGBT (for using SCP function) GND1 PROOUT LOGIC INB MASK S Q PRE DRIVER FLT CFLT RLS ENA CVCC1 VCC2 LOGIC UVLO FB MASK TIMER INA ECU OUT1 R FLTRLS VCC1 GND2 FLT FLT TIMER OUT2 UVLO SCPIN MASK SCPTH MASK MASK TEST CVCC2 RFLTRLS NC VTSTH GND2 MASK GND1 VTSIN Sens or Figure 2. For using 3-pin IGBT (for using DESAT function) ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Recommended range of external constants Pin Name Recommended Value Symbol Min. Typ. Unit Max. CFLTRLS - 0.01 0.47 uF RFLTRLS 50 200 1000 kΩ VCC1 CVCC1 0.1 1.0 - uF VCC2 CVCC2 0.33 - - uF FLTRLS ●Pin Configuration SSOP-B20W (TOP VIEW) 1pin Figure 3. Pin configuration www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ●Pin Description Pin No. Pin Name 1 VTSIN Thermal detection pin 2 GND2 Output-side ground pin 3 VTSTH Thermal detection threshold setting pin 4 SCPTH Short current detection threshold setting pin 5 SCPIN Short current detection pin 6 OUT2 MOS FET control pin for Miller Clamp 7 VCC2 Output-side power supply pin 8 OUT1 Output pin 9 GND2 Output-side ground pin 10 PROOUT 11 GND1 12 NC No Connect 13 INB Invert / non-invert selection pin 14 FLTRLS 15 VCC1 16 FLT Fault output pin 17 INA Control input pin 18 ENA Input enabling signal input pin 19 TEST Test mode setting pin 20 GND1 Input-side ground pin 2/30 Function Soft turn-off pin Input-side ground pin Fault output holding time setting pin Input-side power supply pin TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Description of pins and cautions on layout of board 1）VCC1 (Input-side power supply pin) The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the current to drive internal transformers, connect a bypass capacitor between the VCC1 and the GND1 pins. 2）GND1 (Input-side ground pin) The GND1 pin is a ground pin on the input side. 3）VCC2 (Output-side power supply pin) The VCC2 pin is a power supply pin on the output side. To reduce voltage fluctuations due to OUT1, OUT2 pin output current and due to the current to drive internal transformers, connect a bypass capacitor between the VCC2 and the GND2 pins. 4）GND2 (Output-side ground pin) The GND2 pin is a ground pin on the output side. Connect the GND2 pin to the emitter / source of a power device. 5）IN (Control input terminal) The IN pin is a pin used to determine output logic. ENA INB INA L X X H L L H L H H H L H H H OUT1 L L H H L 6）FLT (Fault output pin) The FLT pin is an open drain pin used to output a fault signal when a fault occurs (i.e., when the undervoltage lockout function (UVLO), short current protection function (SCP) or thermal protection function is activated). This pin is I/O pin and if L voltage is externally input, the output is set to L status regardless of other input logic. Consequently, be sure to connect the pull-up resistor between VCC1 pin and the FLT pin even if this pin is not used. Pin FLT While in normal operation Hi-Z When an Fault occurs L (When UVLO, SCP or thermal protection is activated) 7）FLTRLS (Fault output holding time setting pin) The FLTRLS pin is a pin used to make setting of time to hold a fault signal. Connect a capacitor between the FLTRLS pin and the GND1 pin, and a resistor between it and the VCC1 pin. The fault signal is held until the FLTRLS pin voltage exceeds a voltage set with the VFLTRLS parameter. To set holding time to 0 ms, do not connect the capacitor. Short-circuiting the FLTRLS pin to the VCC1 pin will cause a high current to flow in the FLTRLS pin and, in an open state, may cause the IC to malfunction. To avoid such trouble, be sure to connect a resistor between the FLTRLS and the VCC1 pins. 8）OUT1 (Output pin) The OUT1 pin is a pin used to drive the gate of a power device. 9）OUT2 (MOS FET control pin for Miller Clamp) The OUT2 pin is a pin for controlling the external MOS switch for preventing increase in gate voltage due to the miller current of the power device connected to OUT1 pin. 10）PROOUT (Soft turn-off pin) The PROOUT pin is a pin used to put the soft turn-off function of a power devise in operation when the SCP function is activated. This pin combines with the gate voltage monitoring pin for Miller Clamp function. 11）SCPIN (Short current detection pin), SCPTH (Short current detection threshold setting pin) The SCPIN pin is a pin used to detect current for short current protection. When the SCPIN pin voltage exceeds a voltage set with the SCPTH pin voltage, the SCP function will be activated. This may cause the IC to malfunction in an open state. To avoid such trouble, short-circuit the SCPIN pin to the GND2 pin and SCPTH pin to the VCC2 pin if the short current protection is not used. In order to prevent the wrong detection due to noise, the noise mask time tSCPMSK is set. 12）VTSIN(Thermal detection pin), VTSTH (Thermal detection threshold setting pin) The VTSIN pin is a temperature sensor voltage input pin, which can be used for thermal protection of a power device. If VTSIN pin voltage becomes VTSTH pin voltage or less, OUT1 pin is set to L. In the open status, the IC may malfunction, so be sure to supply the VTSIN more than VTSTH if the thermal protection function is not used. In order to prevent the wrong detection due to noise, the noise mask time tTSMSK is set. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Description of functions and examples of constant setting 1) Miller Clamp function When OUT1=L and PROOUT pin voltage < VOUT2ON, H is output from OUT2 pin and the external MOS switch is turned ON. When OUT1=H, L is output from OUT2 pin and the external MOS switch is turned OFF. While the short-circuit protection function is activated, L is output from OUT2 pin and the external MOS switch is turned OFF. Short current SCPIN IN (INA EXOR INB) PROOUT OUT2 Detected Not less than VSCPTH X X L X L Not less than VOUT2ON L X L Less than VOUT2ON H X H X L Not detected VCC2 PREDRIV ER OUT1 PREDRIV ER PROOUT LOGIC PREDRIV ER PREDRIV ER OUT2 PREDRIV ER + V OUT2ON GND2 Figure 4. Block diagram of Miller Clamp function tPOFF tPON IN OUT1 PROOUT (Monitor the gate voltage) OUT2 VOUT2ON tOUT2ON Figure 5. Timing chart of Miller Clamp function www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 2) Fault status output This function is used to output a fault signal from the FLT pin when an fault occurs (i.e., when the undervoltage lockout function (UVLO), short current protection function (SCP) or thermal protection function is activated) and hold the fault signal until the set Fault output holding time is completed. The fault output holding time tFLTRLS is given as the following equation with the settings of capacitor CFLTRLS and resistor RFLTRLS connected to the FLTRLS pin. For example, when CFLTRLS is set to 0.01F and RFLTRLS is set to 200k, the holding time will be set to 2 ms. tFLTRLS [ms]= CFLTRLS [F]•RFLTRLS [k] To set the fault output holding time to “0” ms, only connect the resistor RFLTRLS. Status FLT pin Normal Hi-Z Fault occurs L Fault occurs (The UVLO, SCP or thermal protection function is activated.) Status ENA VFLTRLS C FLTRLS RFLTRLS FLTRLS Hi-Z FLT L H UVLO SCP VTS VCC1 MASK MASK MASK MASK FLTRLS SS FLT R R - + FLT MASK OUT1 L ECU Fault output holding time （tFLTRLS） LOGIC GND1 Figure 7. Fault Output Block Diagram Figure 6. Fault Status Output Timing Chart 3) Undervoltage Lockout (UVLO) function The BM60013FV-C incorporates the undervoltage lockout (UVLO) function both on the low and the high voltage sides. When the power supply voltage drops to the UVLO ON voltage, the OUT1 pin and the FLT pin both will output the “L” signal. When the power supply voltage rises to the UVLO OFF voltage, these pins will be reset. However, during the fault output holding time set in “2) Fault status output” section, the OUT1 pin and the FLT pin will hold the “L” signal. In addition, to prevent malfunctions due to noises, mask time tUVLO1MSK and tUVLO2MSK are set on both low and high voltage sides. H L IN VUVLO1H VUVLO1L VCC1 FLT OUT1 Figure 8. Input-side UVLO Function Operation Timing Chart Hi-Z L H L H L IN VUVLO2H VUVLO2L VCC2 Hi-Z L H Hi-Z L FLT OUT1 Figure 9. Output-side UVLO Operation Timing Chart www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 4) Short current protection function (SCP, DESAT) When the SCPIN pin voltage exceeds a voltage set with the SCPTH pin voltage, the SCP function will be activated. When the SCP function is activated, the OUT1 pin voltage will be set to the “Hi-Z” level first, and then the PROOUT pin voltage to the “L” level (soft turn-off).Next, after tSTO has passed after the short-circuit current falls below the threshold value, OUT1 pin becomes L and PROOUT pin becomes Hi-Z. Finally, when the fault output holding time set in “2) fault status output” section on page 5 is completed, the SCP function will be released. VCOLLECTOR/VDRAIN which Desaturation Protection starts operation (VDESAT) and the blanking time (tBLANK) can be calculated by the formula below; R3 R 2 V FD1 R3 R3 R 2 R1 VCC 2 MIN V V SCPTH R3 R 2 R1 R3 R 2 R1 V SCPTH t BLANK outernal s R3 C BLANK ln(1 ) 0.2 10 6 R3 R 2 R1 R3 VCC 2 V DESAT V V SCPTH Reference Value (In case of SCPTH=0.7V) VDESAT R1 R2 R3 4.0V 15 kΩ 39 kΩ 6.8 kΩ 4.5V 15 kΩ 43 kΩ 6.8 kΩ 5.0V 15 kΩ 36 kΩ 5.1 kΩ 5.5V 15 kΩ 39 kΩ 5.1 kΩ 6.0V 15 kΩ 43 kΩ 5.1 kΩ 6.5V 15 kΩ 62 kΩ 6.8 kΩ 7.0V 15 kΩ 68 kΩ 6.8 kΩ 7.5V 15 kΩ 82 kΩ 7.5 kΩ 8.0V 15 kΩ 91 kΩ 8.2 kΩ 8.5V 15 kΩ 82 kΩ 6.8 kΩ 9.0V 15 kΩ 130 kΩ 10 kΩ 9.5V 15 kΩ 91 kΩ 6.8 kΩ 10.0V 15 kΩ 130 kΩ 9.1 kΩ VCC2 VCC1 R1 D1 OUT1 LOGIC S FLTRLS + - R PROOUT Q R2 FLT SCPIN VFLTRLS SCPMASK + - SCPTH GND2 CBLANK R3 VSCPTH GND2 Figure 10. Block Diagram for DESAT www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C INA OUT1 OUT2 PROOUT SCPIN FLT t SCPMSK(Typ 3.0us) VSCPTH t SCPMSK VSCPTH tBLANKouternal tBLANK tBLANKouternal tBLANK Figure 11. DESAT sequence H L IN VSCPTH SCPIN OUT1 H Hi-Z L OUT2 H Hi-Z L Hi-Z L Hi-Z L PROOUT FLT tSTO tSTO Fault output holding time*7 Fault output holding time *7 *7: “2) Fault status output” section on page 5 Figure 12. SCP Operation Timing Chart www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C Start OUT1=L, OUT2=H, PROOUT=Hi-Z No VSCPIN>VSCPTH No VFLTRLS>VTFLTRLS Yes Yes No Exceed mask time Yes FLT=Hi-Z OUT1=Hi-Z, OUT2=L, PROOUT=L, FLT=L No IN=H No VSCPIN<VSCPTH Yes OUT1=H, OUT2=L Yes No Exceed tSTO Yes Figure 13. SCP Operation Status Transition Diagram VCC2 VCC1 OUT1 LOGIC FLTRLS S + R - PROOUT Q FLT SCPIN VFLTRLS SCPMASK + - SCPTH GND2 RSCP VSCPTH GND2 Figure 14. Block Diagram for SCP www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 5）I/O condition table Input No. Status 1 VCC1UVLO 2 3 VCC2UVLO 4 5 Disable 6 7 8 FLT external input Output I N A P R O O U T O U T 1 O U T 2 P R O O U T F L T X X H L L Hi-Z L X X X L L H Hi-Z L X X X X H L L Hi-Z L L X X X X L L H Hi-Z L H L H L X X H L L Hi-Z Hi-Z ○ H L H L X X L L H Hi-Z Hi-Z ○ ○ H L L X X X H L L Hi-Z Hi-Z ○ ○ H L L X X X L L H Hi-Z Hi-Z V C C 1 V C C 2 V T S I N S C P I N F L T E N A I N B UVLO X X L X X UVLO X X L X X UVLO X L X UVLO X ○ ○ ○ 9 SCP ○ ○ X H X X X X X Hi-Z L L L 10 Thermal protection ○ ○ L L X X X X H L L Hi-Z L ○ ○ L L X X X X L L H Hi-Z L Non-invert operation L input ○ ○ H L H H L L H L L Hi-Z Hi-Z ○ ○ H L H H L L L L H Hi-Z Hi-Z 11 12 13 14 Non-invert operation H input ○ ○ H L H H L H X H L Hi-Z Hi-Z 15 Invert operation L input ○ ○ H L H H H L X H L Hi-Z Hi-Z ○ ○ H L H H H H H L L Hi-Z Hi-Z H L H H H H 16 17 Invert operation H input (Caution) L L H Hi-Z Hi-Z ○: VCC1 or VCC2 > UVLO, X:Don't care When other errors are complicated immediately after the SCP function is activated, SCP function (soft turn-off) is given to priority. ○ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ○ 9/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 6) Power supply startup / shutoff sequence H L IN VCC1 VUVLO1L VUVLO1L VCC2 VUVLO2H VUVLO2H 0V 0V H Hi-Z L H Hi-Z L Hi-Z L OUT1 OUT2 PROOUT Hi-Z L FLT H IN L VCC1 VUVLO1H VUVLO1H VUVLO2L VCC2 0V VUVLO2L 0V H Hi-Z L H Hi-Z L Hi-Z L Hi-Z L OUT1 OUT2 PROOUT FLT : Since the VCC2 pin voltage is low and the output MOS does not turn ON, the output pins become Hi-Z conditions. : Since the VCC1 pin voltage is low and the FLT output MOS does not turn ON, the output pins become Hi-Z conditions. Figure 15. Power supply startup / shutoff sequence www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Absolute maximum ratings Parameter Symbol Input-side supply voltage Limits VCC1 Output-side supply voltage -0.3 to +7.0 -0.3 to +25.0 VIN FLT pin input voltage -0.3 to +7.0 -0.3 to +VCC2+0.3V or +25.0 *2 -0.3 to +7.0 -0.3 to +VCC2+0.3V or +25.0 *3 IOUT1 OUT1 pin output current (Peak 1us) 0.4 IOUT1PEAK OUT2 pin output current (DC) OUT2 pin output current (Peak 1us) PROOUT pin output current 0.1 A 1.0 A *3 IPROOUT FLT output current A *3 IOUT2PEAK 0.2 IFLT V A 5.0 IOUT2 V V *2 VSCPTH OUT1 pin output current (DC) V *2 VVTSTH SCPTH pin input voltage V *2 VSCPIN VTSTH pin input voltage V *1 -0.3 to +VCC1+0.3 or +7.0 VVTSIN SCPIN pin input voltage V *1 -0.3 to +VCC1+0.3 or +7.0 VFLTRLS VTSIN pin input voltage V *1 -0.3 to +VCC1+0.3 or +7.0 VFLT FLTRLS pin input voltage V *2 VCC2 INA, INB, ENA pin input voltage Unit *1 A 10 mA *4 Power dissipation Pd 1.19 W Operating temperature range Topr -40 to +125 ℃ Storage temperature range Tstg -55 to +150 ℃ Junction temperature Tjmax +150 ℃ *1 Relative to GND1. *2 Relative to GND2. *3 Should not exceed Pd and Tj=150C. *4 Derate above Ta=25C at a rate of 9.5mW/C. Mounted on a glass epoxy of 70 mm 70 mm 1.6 mm. ●Recommended operating conditions Parameter Symbol Input-side supply voltage Min. Max. Units *5 4.5 5.5 V *6 VCC1 Output-side positive supply voltage VCC2 14.0 20.0 V Short current detection common mode input voltage VSCCM 0.0 2.5 V Thermal detection common mode input voltage VTSCM 0.0 3.0 V *5 *6 Relative to GND1. Relative to GND2. ●Insulation related characteristics Parameter Insulation Resistance (VIO=500V) Symbol Characteristic 9 Units RS >10 Ω Insulation Withstand Voltage / 1min VISO 2500 Vrms Insulation Test Voltage / 1sec VISO 3000 Vrms www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Electrical characteristics （Unless otherwise specified Ta=-40℃ to 125℃, VCC1=4.5V to 5.5V, VCC2=14V to 20V） Parameter Symbol Min. Typ. Max. General Input side circuit current 1 ICC11 0.10 0.35 0.60 Input side circuit current 2 ICC12 0.10 0.35 0.60 Input side circuit current 3 ICC13 1.1 1.9 2.7 Input side circuit current 4 ICC14 2.0 3.4 4.8 Output side circuit current 1 ICC25 1.6 2.6 3.6 Output side circuit current 2 ICC26 1.0 1.7 2.4 Logic block Logic high level input voltage VINH 0.7×VCC1 VCC1 Logic low level input voltage VINL 0 0.3×VCC1 Logic pull-down resistance RIND 25 50 100 Logic input minimum pulse width tINMin 100 ENA, FLT mask time tFLTMSK 4 10 20 Output OUT1 ON resistance (Source) RONH 0.7 1.8 4.0 OUT1 ON resistance (Sink) RONL 0.4 0.9 2.0 Unit mA mA mA mA mA mA OUT1=L OUT1=H INA =10kHz, Duty=50% INA =20kHz, Duty=50% OUT1=L OUT1=H V V kΩ ns μs INA, INB, ENA, FLT INA, INB, ENA, FLT INA, INB, ENA INA, INB ENA, FLT Ω Ω IOUT1=40mA IOUT1=40mA VCC2=15V, design assurance IPROOUT=40mA OUT1 maximum current IOUT1MAX 3.0 4.5 - A PROOUT ON resistance RONPRO 0.4 0.9 2.0 Ω tPON 100 150 200 ns Turn ON time Turn OFF time tPOFF 100 150 200 ns tPDIST tRISE tFALL RON2H RON2L VOUT2ON tOUT2ON CM -20 25 25 5 1.7 1.8 100 0 50 50 10 3.5 2 40 - 20 100 100 20 7 2.2 80 - ns ns ns Ω Ω V ns kV/μs VUVLO1H VUVLO1L 4.25 4.15 10 12.5 11.5 4.45 4.35 30 13.5 12.5 V V μs V V 10 1.00 3.0 0.25 30 5.25 3.9 0.55 110 3.00 30 0.40 μs mV μs V μs mV μs V 0.64×VCC1 +0.1 V Propagation distortion Rise time Fall time OUT2 ON resistance (Source) OUT2 ON resistance (Sink) OUT2 ON threshold OUT2 output delay time Common Mode Transient Immunity Protection functions Input-side UVLO OFF voltage Input-side UVLO ON voltage Input-side UVLO mask time Output-side UVLO OFF voltage Output-side UVLO ON voltage tUVLO1MSK VUVLO2H VUVLO2L 4.05 3.95 2 11.5 10.5 Output-side UVLO mask time Short current detection offset voltage Short current detection mask time SCPIN Input voltage Soft turn OFF release time Thermal detection offset voltage Thermal detection mask time FLT output low voltage tUVLO2MSK VSCDET tSCPMSK VSCPIN tSTO VTSDET tTSMSK VFLTL 4 -3.25 2.1 30 -5.50 4 - VTFLTRLS 0.64×VCC1 -0.1 FLTRLS threshold INA OUT1 50% -1.25 10 0.18 0.64×VCC1 Conditions No load between OUT1-GND2 No load between OUT1-GND2 tPOFF - tPON 10nFbetween OUT1-GND2 10nFbetween OUT1-GND2 IOUT2=40mA IOUT2=40mA design assurance ISCPIN=1mA IFLT=5mA 50% tPON tPOFF 10% 90% 50% 90% tFALL tRISE 50% 10% Figure 16. INA-OUT1 Timing Chart www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Typical Performance Curves 0.6 0.6 0.5 0.5 0.4 ICC11 [mA] ICC11 [mA] Ta=125℃ 0.3 0.1 4.50 0.3 Vcc1=5.5V Vcc1=4.5V Ta=25℃ Ta=-40℃ 0.2 0.4 Vcc1=5.0V 0.2 0.1 4.75 5.00 VCC1 [V] 5.25 -40 5.50 Figure 17. Input side circuit current (at OUT1=L) -20 0 20 40 60 Ta [℃] 80 100 120 Figure 18. Input side circuit current (at OUT1=L) 0.6 0.6 0.5 0.5 0.4 ICC12 [mA] ICC12 [mA] Ta=125℃ 0.3 0.1 4.50 0.3 Vcc1=5.5V Vcc1=4.5V Ta=25℃ Ta=-40℃ 0.2 0.4 Vcc1=5.0V 0.2 0.1 4.75 5.00 VCC1 [V] 5.25 5.50 Figure 19. Input side circuit current (at OUT1=H) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/30 -40 -20 0 20 40 60 Ta [℃] 80 100 120 Figure 20. Input side circuit current (at OUT1=H) TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 2.8 2.8 Ta=-40℃ 2.4 ICC13 [mA] ICC13 [mA] 2.4 2.0 Vcc1=5.5V 2.0 Vcc1=4.5V Ta=25℃ 1.6 1.6 Vcc1=5.0V Ta=125℃ 1.2 4.50 1.2 4.75 5.00 VCC1 [V] 5.25 5.50 -40 -20 0 Figure 21. Input side circuit current (at INA=10kHz and Duty=50%) Ta=-40℃ 4.5 4.1 100 120 Vcc1=5.5V 4.1 ICC14 [mA] ICC14 [mA] 80 4.9 4.5 3.7 3.3 2.9 2.1 4.50 40 60 Ta [℃] Figure 22. Input side circuit current (at INA=10kHz and Duty=50%) 4.9 2.5 20 3.7 3.3 Vcc1=4.5V 2.9 Ta=25℃ Ta=125℃ Vcc1=5.0V 2.5 2.1 4.75 5.00 VCC1 [V] 5.25 5.50 Figure 23. Input side circuit current (at INA=20kHz and Duty=50%) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 -20 0 20 40 60 Ta [℃] 80 100 120 Figure 24. Input side circuit current (at INA=20kHz and Duty=50%) 14/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 3.6 3.6 Vcc2=20V Ta=125℃ 3.2 ICC25 [mA] ICC25 [mA] 3.2 2.8 2.4 2.8 2.4 Ta=25℃ Vcc2=14V Ta=-40℃ 2.0 2.0 1.6 1.6 14 16 18 -40 20 -20 0 20 VCC2 [V] Figure 25. Output side circuit current (at OUT1=L) 40 60 Ta [℃] 80 100 120 Figure 26. Output side circuit current (at OUT1=L) 2.4 2.4 2.2 2.2 Vcc2=20V Ta=125℃ 2.0 ICC26 [mA] 2.0 ICC26 [mA] Vcc2=15V 1.8 1.6 Ta=25℃ 1.4 1.8 1.6 Ta=-40℃ 1.2 1.2 1.0 1.0 14 16 18 20 VCC2 [V] Figure 27. Output side circuit current (at OUT1=H) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Vcc2=14V 1.4 15/30 -40 -20 0 20 Vcc2=15V 40 60 Ta [℃] 80 100 120 Figure 28. Output side circuit current (at OUT1=H) TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 24 5.0 4.5 Ta=125℃ Ta=25℃ Ta=-40℃ 4.0 2.5 2.0 L level 1.5 12 8 Ta=-40℃ Ta=25℃ Ta=125℃ 1.0 Vcc1=5V 16 H level 3.0 OUT1 [V] VINH / VINL [V] 3.5 20 4 0.5 0.0 4.50 0 4.75 5.00 VCC1 [V] 5.25 5.50 0 1 2 3 4 5 INA [V] Figure 29. Logic (INA/INB) High/Low level input voltage Figure 30. Logic (INA/INB) High/Low level input voltage at Ta=25℃ 100 100 80 tINMin [ns] RIND [kΩ] 75 Vcc1=4.5V Vcc1=5.0V Vcc1=5.5V 60 Vcc1=4.5V Vcc1=5.0V Vcc1=5.5V 40 50 20 0 25 -40 -20 0 20 40 60 Ta [℃] 80 100 120 -20 0 20 40 60 Ta [℃] 80 100 120 Figure 32. Logic input minimum pulse width（H pulse） Figure 31. Logic pull-down resistance www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 16/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 20 100 16 tFLTMSK [us] tINMin [ns] 80 60 Vcc1=4.5V Vcc1=5.0V Vcc1=5.5V 40 Vcc1=5.5V Vcc1=5.0V Vcc1=4.5V 12 8 20 4 0 -40 -20 0 20 40 60 Ta [℃] 80 -40 100 120 -20 0 20 40 60 Ta [℃] 80 100 120 Figure 34. ENA input mask time Figure 33. Logic input minimum pulse width（L pulse） 20 3.7 3.1 Vcc1=5.5V Vcc1=5.0V Vcc1=4.5V 12 RONH [Ω] tFLTMSK [us] 16 Vcc2=14V Vcc2=15V Vcc2=20V 2.5 1.9 8 1.3 0.7 4 -40 -20 0 20 40 60 Ta [℃] 80 100 120 Figure 35. FLT input mask time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 -20 0 20 40 60 Ta [℃] 80 100 120 Figure 36. OUT1 ON resistance (Source) 17/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet 2.0 2.0 1.6 1.6 Vcc2=14V Vcc2=15V Vcc2=20V RONPRO [Ω] RONL [Ω] BM60013FV-C 1.2 0.8 Vcc2=14V Vcc2=15V Vcc2=20V 1.2 0.8 0.4 0.4 -40 -20 0 20 40 60 Ta [℃] 80 100 120 -40 Figure 37. OUT1 ON resistance (Sink) 0 20 40 60 Ta [℃] 80 100 120 Figure 38. PROOUT ON resistance 200 200 180 180 Vcc2=14V Vcc2=15V Vcc2=20V 160 tPOFF [ns] tPON [ns] -20 140 Vcc2=14V Vcc2=15V Vcc2=20V 160 140 120 120 100 100 -40 -20 0 20 40 60 Ta [℃] 80 100 120 -20 0 20 40 60 Ta [℃] 80 100 120 Figure 40. Turn OFF time Figure 39. Turn ON time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 18/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 100 100 Ta=125℃ 75 tRISE [ns] tFALL [ns] 75 Ta=125℃ 50 50 Ta=25℃ Ta=25℃ Ta=-40℃ Ta=-40℃ 25 25 14 16 18 14 20 16 18 20 VCC2 [V] VCC2 [V] Figure 42. Fall time (10000pF between OUT1-GND2) Figure 41. Rise time (10000pF between OUT1-GND2) 6.5 20.0 17.5 RON2L [Ω] 15.0 RON2H [Ω] Vcc2=14V Vcc2=15V Vcc2=20V Vcc2=14V Vcc2=15V Vcc2=20V 12.5 4.0 10.0 7.5 1.5 5.0 -40 -20 0 20 40 60 Ta [℃] 80 100 120 -20 0 20 40 60 Ta [℃] 80 100 120 Figure 44. OUT2 ON resistance (Sink) Figure 43. OUT2 ON resistance (Source) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 19/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 80 2.2 Vcc2=20V Vcc2=15V Vcc2=14V 60 tOUT2ON [ns] VOUT2ON [V] 2.1 2.0 Ta=125℃ 40 Ta=-40℃ Ta=25℃ 1.9 20 1.8 0 -40 -20 0 20 40 60 Ta [℃] 80 100 14 120 16 18 20 VCC2 [V] Figure 46. OUT2 output delay time Figure 45. OUT2 ON threshold voltage 30 5 26 4 FLT [V] 3 Ta=125℃ Ta=125℃ Ta=-40℃ Ta=-40℃ 2 Ta=25℃ Ta=25℃ tUVLO1MSK [us] 22 18 14 10 1 0 3.95 6 2 4.05 4.15 4.25 VCC1 [V] 4.35 4.45 Figure 47. VCC1 UVLO ON/OFF voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -40 -20 0 20 40 60 Ta [℃] 80 100 120 Figure 48. VCC1 UVLO mask time 20/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 30 6 26 5 FLT [V] Ta=125℃ Ta=125℃ Ta=25℃ 3 Ta=25℃ Ta=-40℃ Ta=-40℃ 2 tUVLO2MSK [us] 22 4 18 14 10 1 6 0 10.5 2 11.5 12.5 -40 13.5 -20 0 20 VCC2 [V] 80 100 120 Figure 50. VCC2 UVLO mask time Figure 49. VCC2 UVLO ON/OFF voltage (at VCC1=5V) 10 3.90 8 Ta=-40℃ 6 3.60 Ta=25℃ tSCPMSK [us] 4 VSCDET [mV] 40 60 Ta [℃] 2 0 Ta=125℃ -2 3.30 3.00 Ta=25℃ 2.70 -4 -6 Ta=125℃ Ta=-40℃ 2.40 -8 -10 2.10 14 16 18 20 14 16 18 VCC2 [V] VCC2 [V] Figure 51. SCP offset voltage (at SCPTH=0.7V) Figure 52. SCP detection mask time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/30 20 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 7.0 110 5.0 3.0 Vcc2=14V Vcc2=15V Vcc2=20V 70 VTSDET [mV] tSTO [us] 90 Vcc2=14V Vcc2=15V Vcc2=20V Max. 1.0 Ta=25℃ Ta=125℃ Ta=-40℃ -1.0 -3.0 50 Min. -5.0 -7.0 30 -40 -20 0 20 40 60 Ta [℃] 80 14 100 120 16 18 20 VCC2 [V] Figure 54. VTS offset voltage (at VTSTH=1.7V) Figure 53. Soft turn OFF release time 30 0.4 26 0.3 18 Ta=-40℃ Ta=25℃ VFLTL [V] tTSMSK [us] 22 Ta=125℃ 14 10 Ta=125℃ 0.2 Ta=25℃ 0.1 Ta=-40℃ 6 2 14 16 18 20 VCC2 [V] Figure 55. Thermal detection mask time www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.0 4.50 4.75 5.00 VCC2 [V] 5.25 5.50 Figure 56. FLT output low voltage (IFLT=5mA) 22/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C 3.62 Ta=-40℃ Ta=25℃ Ta=125℃ VTFLTRLS [V] 3.41 3.20 2.99 2.78 4.50 4.75 5.00 VCC1 [V] 5.25 5.50 Figure 57. FLTRLS threshold www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Selection of Components Externally Connected Recommended ROHM RSR025N3 RSS065N03 PROOUT GND1 RFLTRLS NC S LOGIC Q INB PRE DRIVER FLTRLS FLT VCC2 LOGIC UVLO FB MASK TIMER MASK CFLTRLS ENA C VCC1 OUT2 UVLO INA ECU OUT1 R MASK VCC1 GND2 FLT FLT TIMER MASK MASK TEST SCPIN SCPTH CVCC2 Recommended ROHM MCR03EZP VTSTH GND2 MASK VTSIN GND1 Figure 58. For using 4-pin IGBT (for using SCP function) Sens or Recommended ROHM MCR03EZP Recommended ROHM RSR025N3 RSS065N03 GND1 PROOUT RFLTRLS NC S LOGIC INB Q PRE DRIVER R MASK FLTRLS CFLTRLS CVCC1 OUT1 VCC2 LOGIC VCC1 UVLO FLT MASK FB TIMER INA ECU GND2 FLT ENA FLT TIMER OUT2 UVLO SCPIN MASK SCPTH MASK MASK TEST CVCC2 Recommended ROHM MCR03EZP VTSTH GND2 MASK GND1 VTSIN Sens or Figure 59. For using 3-pin IGBT (for using DESAT function) Recommended ROHM MCR03EZP www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●I/O equivalence circuits Pin No. Name I/O equivalence circuits Function VTSIN VCC2 Internal power suplly 1 Thermal detection pin VTSTH VTSIN Thermal detection threshold setting pin GND2 VTSTH 3 VCC2 SCPTH Internal power suplly 4 Short current detection threshold setting pin SCPIN SCPIN Short current detection pin GND2 SCPTH 5 VCC2 OUT2 6 OUT2 MOS FET control pin for Miller Clamp GND2 VCC2 OUT1 8 OUT1 Output pin GND2 VCC2 PROOUT 10 PROOUT Soft turn-off pin GND2 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C Pin No. Name I/O equivalence circuits Function VCC1 FLTRLS FLTRLS 14 Fault output holding time setting pin GND1 VC C 1 FLT FLT 16 Fault output pin GN D 1 VCC1 INB 13 Invert / non-invert selection pin INA INA INB ENA 17 Control input pin ENA 18 Input enabling signal input pin GND1 VCC1 TEST TEST 19 Test mode setting pin GND1 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Power Dissipation Measurement machine：TH156（Kuwano Electric） Measurement condition：ROHM board 3 Board size：70×70×1.6mm 1-layer board：θja=105.3℃/W Power Dissipation:Pd[W] 1.5 1.19W 1.0 0.5 0 0 25 50 75 100 125 150 Ambient Temperature:Ta[℃] Figure 60. SSOP-B20W Derating Curve ●Thermal design Please confirm that the IC’s chip temperature Tj is not over 150℃, while considering the IC’s power consumption (W), package power (Pd) and ambient temperature (Ta). When Tj=150℃ is exceeded the functions as a semiconductor do not operate and some problems (ex. Abnormal operation of various parasitic elements and increasing of leak current) occur. Constant use under these circumstances leads to deterioration and eventually IC may destruct. Tjmax=150℃ must be strictly obeyed under all circumstances. The IC’s consumed power (P) can be estimated roughly with following equation. P＝VCC1・ICC1 + VCC2・ICC2 + ION2・RONH・tON・fPWM + IOFF2・RONL・tOFF・fPWM fPWM : PWM frequency ION : OUT1 pin outflow current when OUT1 is H state. tON : Current outflow time from OUT1 pin when OUT1 is H state. IOFF : OUT1 pin inflow current when OUT1 is L state. tOFF : Current inflow time to OUT1 pin when OUT1 is L state. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Operational Notes (1) Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2) Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines. An external direction diode can be added. (3) Power supply Lines Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) GND Potential The potential of GND1 pin must be minimum potential in all operating conditions. (Input side ; 11pin to 20pin) The potential of VEE2 pin must be minimum potential in all operating conditions. (Output side ; 1pin to 10pin) (5) Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. (6) Inter-pin shorts and mounting errors When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be caused by foreign matter entering between outputs or an output and the power supply or GND. (7) Operation in a strong electric field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. (8) Inspection of the application board During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. (9) Input terminal of IC Between each element there is a P+ isolation for element partition and a P substrate. This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up. For example, when the resistance and transistor are connected to the terminal as shown in figure 61, ○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN), the P-N junction operates as a parasitic diode. ○Also, when GND＞(Terminal B) at the transistor (NPN), The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned parasitic diode. Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction. Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage that is lower than the GND (P substrate) to the input terminal. Transistor(NPN) Resistor Terminal B Terminal A C B Terminal B E Terminal A N P+ N P P+ N N P+ Parasitic element P+ P C E N Parasitic element P substrate P substrate Parasitic element B N GND Parasitic element GND GND GND Other adjacent elements Figure 61. Pattern Diagram of Parasitic Element (10) Ground Wiring Patterns When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern potential of any external components, either. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 28/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Ordering Information B M 6 0 0 1 F 3 V - Package FV: SSOP-B20W Part Number CE 2 Packaging and forming specification E2: Embossed tape and reel ●Physical Dimension Tape and Reel Information SSOP-B20W <Tape and Reel information> 6.5 ± 0.2 Embossed carrier tape Quantity 2000pcs 0.3Min. Direction of feed 1 E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 10 0.15 ± 0.1 0.11 1.7 ± 0.2 Tape 11 6.1 ± 0.2 8.1 ± 0.3 20 0.1 0.65 0.22 ± 0.1 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram SSOP-B20W(TOP VIEW) Part Number Marking BM60013 LOT Number 1PIN MARK www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 29/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet BM60013FV-C ●Revision History Date Revision Changes 8.May.2012 001 29.May.2012 002 New Release Change Description of functions and examples of constant setting‘4)’ Equation Page 6 of tBLANKouternal. Page 24 Delete recommended part number ‘RHK005N03’. Page 28 Change Operational Notes‘(9)’ www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/30 TSZ02201-0717ABH00020-1-2 29.May.2012 Rev.002 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.