HEDS-5500, HEDS-6500 and HEDS-9000, 9100, 9200 Series Motion Sensing Products, Optical Encoder Modules Reliability Data Description Failure Rate Prediction The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of MIL- STD-883. The failure rate of semiconductor devices is determined by the junction temperature of the device. The relationship between ambient temperature and actual junction temperature is given by the following: Avago tests parts at the absolute maximum rated conditions recommended for the device. The actual performance you obtain from Avago parts depends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in Table 1. TJ (°C) = TA (°C) + θJA PAVG where TA = ambient temperature in °C θJA = thermal resistance of junction-to-ambient in °C/watt PAVG = average power dissipated in watts The estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using an Arrhenius model for temperature acceleration. Results of such calculations are shown in the table on the following page using an activation energy of 0.43 eV (reference MIL-HDBK-217). Table 1. Life Tests Demonstrated Performance Point Typical Performance Stress Test Conditions Total Device Hrs. Units Tested Total Failed MTBF Failure Rate (% /1K Hours) High Temperature Operating Life VCC = 5.5 V, VA = VB = 3.5 V TA = 100°C 1000 hours 1,405,000 1,405 2 702,500 0.142 Temperature Humidity Operating Life VCC = 5.5 V VA = VB = 3.5 V 1,000 hours TA = 85°C RH = 85% 1,495,000 1,495 10 149,500 0.669 Test Name Table 2. Point Typical Performance [1] in Time Performance in Time [2] (90% Confidence) Ambient Temperature (°C) Junction Temperature (°C) MTBF [1] Failure Rate (%/1K Hours) MTBF [2] Failure Rate (%/1K Hours) +100 +110 703,000 0.142 264,000 0.379 +90 +100 996,000 0.100 374,000 0.267 +80 +90 1,440,000 0.069 541,000 0.185 +70 +80 2,126,000 0.047 799,000 0.125 +60 +70 3,210,000 0.031 1,206,000 0.083 +50 +60 4,968,000 0.020 1,867,000 0.054 +40 +50 7,901,000 0.013 2,969,000 0.034 +30 +40 12,942,000 0.008 4,863,000 0.021 +20 +30 21,903,000 0.005 8,230,000 0.012 Notes: 1. The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number of failures. In the case of zero failures, one failure is assumed for this calculation. 2. The 90% Confidence MTBF represents the minimum level of reliability performance which is expected from 90% of all samples. This confidence interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is commonly used in describing useful life failures. Refer to MIL-STD-690B for details on this methodology. 3. Failures are catastrophic or parametric. Catastrophic failures are open, short, no logic output, no dynamic parameters while parametric failures are failures to meet an electrical characteristic as specified in product catalog such as output voltage, duty or state errors. Example of Failure Rate Calculation Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168 hours/week is: (8 hours/day) x (5 days/week) / (168 hours/week) = 0.25 The point failure rate per year (8760 hours) at 50°C ambient temperature is: (0.020% / 1K hours) x 0.25 x (8760 hours/year) = 0.044% per year Similarly, 90% confidence level failure rate per year at 50°C: (0.054% / 1K hours) x 0.25 x (8760 hours/year) = 0.118% per year Table 3. Environmental Tests Test Name MIL-STD-883C Reference Temperature Cycle 1010 Test Conditions Units Tested Units Failed -40°C to +100°C, 15 minute dwell, 5 minute transfer, 5 cycles 200 cycles 500 cycles 9,512 1,570 1,570 0 3 9 Solder Heat Resistance 2003 Sn/Pb 60/40 Solder; 260°C peak; 10 sec., 20 temp cycles @ -40°C to 85°C 38 0 High Temperature N/A TA = +105°C 77 0 Storage Life 2,000 hours Table 4. Mechanical Tests Test Name MIL-STD-883C Reference Test Conditions Units Tested Units Failed Mechanical Shock 2002 5 blows; X, Y, Z axes, 1500 g, 0.5 msec. 5 0 Vibration Variable Frequency 2007 3 cycles, 4 min. each X, Y, Z axes, 20 g min. 20 to 2000 Hz 5 to 1000 Hz 26 10 0 0 Terminal Strength 2004 Condition A 1 lb. for 30 seconds 15 0 Lead Fatigue 2004, Cond. B 15 0 3 bends, 15° minimum Table 5. Electrical Tests Test Name MIL-STD-883C Reference ESD - Human Body Model 3015.2 Test Conditions 1.5 KΩ, 100 pF, 5 positive and 5 negative discharges per pin. VZ = 3.0 KV Units Tested Units Failed 35 0 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5965-2775E 5965-9642E - December 11, 2006