ONSEMI MBRA210ET3

MBRA210ET3
Surface Mount
Schottky Power Rectifier
SMA Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes. Typical applications are AC/DC
and DC−DC converters, reverse battery protection, and “Oring” of
multiple supply voltages and any other application where performance
and size are critical.
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SCHOTTKY BARRIER
RECTIFIER
2 AMPERES
10 VOLTS
Features
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Low IR, Extends Battery Life
1st in the Market Place with a 10 VR Schottky Rectifier
Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guardring for Over−Voltage Protection
Optimized for Low Leakage Current
Pb−Free Package is Available
SMA
CASE 403D
PLASTIC
MARKING DIAGRAM
Mechanical Characteristics
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Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 70 mg (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Polarity Band Indicates Cathode Lead
ESD Ratings:
Machine Model = C
Human Body Model = 3B
B2E1
AYWW G
B2E1
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
MBRA210ET3
MBRA210ET3G
Package
Shipping†
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 6
1
Publication Order Number:
MBRA210ET3/D
MBRA210ET3
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
10
V
Average Rectified Forward Current
(At Rated VR, TC = 125°C)
IO
2.0
A
IFSM
100
A
Tstg, TC
−65 to +150
°C
TJ
−65 to +150
°C
dv/dt
10,000
V/ms
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage/Operating Case Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated VR, TJ = 25°C)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Min Pad
1 Inch Pad
Unit
RqJL
RqJA
22
150
15
81
°C/W
VF
TJ = 25°C
TJ = 100°C
V
0.405
0.480
0.500
0.275
0.355
0.385
TJ = 25°C
TJ = 100°C
15
50
200
500
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 0.1 A)
(IF = 1.0 A)
(IF = 2.0 A)
Maximum Instantaneous Reverse Current
IR
(VR = 5.0 V)
(VR = 10 V)
1. Mounted on a 3″ square FR4 PC Board with min. pads or 1″ square copper heat spreader.
2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.
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2
mA
MBRA210ET3
100
IF, MAXIMUM INSTANTANEOUS
FORWARD CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD
CURRENT (AMPS)
100
10
100°C
1
0.1
125°C
0.1
25°C
75°C
0.2
0.3
−40°C
0.4
0.5
0.6
10
1
0.1
0.7
125°C
0.1
100°C
0.2
0.3
25°C
0.4
0.6
0.5
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VF, MAXIMUM INSTANTANEOUS FORWARD
VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
0.7
IR, REVERSE CURRENT (AMPS)
1.00E−03
125°C
100°C
1.00E−04
75°C
1.00E−05
1.00E−06
25°C
1.00E−07
0
2
4
6
8
10
VR, REVERSE VOLTAGE (VOLTS)
IF, AVERAGE FORWARD
CURRENT (AMPS)
3.5
dc
3.0
2.5
SQUARE WAVE
2.0
1.5
1.0
0.5
0
110
120
130
140
150
160
TL, LEAD TEMPERATURE (°C)
Figure 4. Current Derating − Junction to Lead
PFO, AVERAGE POWER DISSIPATION (WATTS)
Figure 3. Typical Reverse Current
1.4
1.2
dc
1.0
0.8
SQUARE WAVE
0.6
0.4
0.2
0
0
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3
0.5
1.0
1.5
2.0
2.5
3.0
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Forward Power Dissipation
3.5
MBRA210ET3
C, CAPACITANCE (pF)
10,000
1000
100
0
2
4
6
8
10
VR, REVERSE VOLTAGE (VOLTS)
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 6. Typical Capacitance
100
D = 0.5
0.2
0.1
10
0.05
0.02
0.01
1
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
100
1000
t, TIME (S)
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 7. Thermal Response, Junction to Ambient (min pad)
100
D = 0.5
0.2
10
0.1
0.05
0.02
1
0.1
0.01
SINGLE PULSE
0.00001
0.0001
0.001
0.01
0.1
1
10
t, TIME (S)
Figure 8. Thermal Response, Junction to Ambient (1 inch pad)
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4
MBRA210ET3
PACKAGE DIMENSIONS
SMA
CASE 403D−02
ISSUE D
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02.
E
b
DIM
A
A1
b
c
D
E
HE
L
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
(SEE STYLES)
MIN
1.92
0.05
1.27
0.15
2.29
4.06
4.83
0.76
MILLIMETERS
NOM
MAX
2.17
2.27
0.10
0.15
1.45
1.63
0.28
0.41
2.60
2.92
4.32
4.57
5.21
5.59
1.14
1.52
MIN
0.076
0.002
0.050
0.006
0.090
0.160
0.190
0.030
INCHES
NOM
0.085
0.004
0.057
0.011
0.103
0.170
0.205
0.045
MAX
0.089
0.006
0.064
0.016
0.115
0.180
0.220
0.060
A
L
c
A1
SOLDERING FOOTPRINT*
4.0
0.157
2.0
0.0787
2.0
0.0787
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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MBRA210ET3/D