ROHM RB450F

RB450F
Diodes
Schottky barrier diode
RB450F
!External dimensions (Units : mm)
2.0±0.2
0.9±0.1
1.3±0.1
2.1±0.1
0.65
1.25±0.1
0.65
!Features
1) Small surface mounting type. (UMD3)
2) Low IR. (IR=80nA Typ.)
3) High reliability.
0.3
0~0.1
0.15±0.05
3F
0.3±0.1
(All leads have the same dimensions)
!Construction
Silicon epitaxial planar
ROHM : UMD3
EIAJ : SC - 70
JEDEC : SOT - 323
!Circuit
!Absolute maximum ratings (Ta = 25°C)
Symbol
Limits
Unit
Peak reverse voltage
Parameter
VRM
45
V
DC reverse voltage
VR
40
V
IO
0.1
A
IFSM
1
A
Mean rectifying current
Peak forward surge current ∗
Junction temperature
Tj
125
°C
Storage temperature
Tstg
−40~+125
°C
∗60Hz for 1
!Electrical characteristics (Ta = 25°C)
Parameter
Forward voltage
Symbol
Min.
Typ.
Max.
Unit
VF
−
−
0.45
V
Conditions
IF=10mA
Reverse current
IR
−
−
1
µA
VR=10V
Capacitance between terminals
CT
−
6.0
−
pF
VR=10V, f=1MHz
Note) ESD sensitive product handling required.
0.6
0.1Min.
!Applications
Low current rectification
RB450F
Diodes
REVERSE CURRENT : IR (A)
1m
−2
5
25
1m
°C
12
5°C
75
°C
10m
°C
100m
Ta
=
FORWARD CURRENT : IF (A)
1
100µ
10µ
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Io CURRENT (%)
Ta=125°C
10µ
75°C
1µ
25°C
100n
10n
0
5
10
15
20
25
30
35
100
50
20
10
5
2
0
0
2
4
6
8
10
12
14
FORWARD VOLTAGE : VF (V)
REVERSE VOLTAGE : VR (V)
REVERSE VOLTAGE : VR (V)
Fig. 1 Forward characteristics
Fig. 2 Reverse characteristics
Fig. 3 Capacitance between
terminals characteristics
100
80
60
40
20
0
0
100µ
CAPACITANCE BETWEEN TERMINALS : CT (pF)
!Electrical characteristic curves (Ta = 25°C)
25
50
75
100
125
AMBIENT TEMPERATURE : Ta (°C)
Fig. 4 Derating curve
(mounting on glass epoxy PCBs)