FILTRONIC FMA411

PRELIMINARY
FMA411
LOW-NOISE X-BAND MMIC
•
PERFORMANCE
♦ 8.5 – 14.0 GHz Operating Bandwidth
♦ 2.6 dB Noise Figure
♦ 18 dB Small-Signal Gain
♦ 17.5 dm Output Power
♦ +6V Single Bias Supply
♦ Adjustable Operating Current
♦ DC De-coupled Input and Output Ports
•
DESCRIPTION AND APPLICATIONS
The FMA411 is a 2-stage, reactively matched pHEMT low-noise MMIC amplifier designed for use
over the 8.5 to 14.0 GHz bandwidth. The amplifier requires a single +6V supply and one off-chip
component for supply de-coupling; the supply voltage can be varied from +3V to +6V if needed.
Both the input and output ports are DC de-coupled. Grounding of the amplifier is provided by plated
thru-vias to the bottom of the die, no additional ground is required. Operating current can be
adjusted using the Source resistor ladders located along the bottom edge, by bonding a particular pad
to ground, in order to optimize noise or power performance.
Typical applications include low-noise front end amplifiers, and general gain block utilizations in Xband. The amplifier is unconditionally stable over all load states (-45 to +85°C), and conditionally
stable if the input port is open-circuited.
•
ELECTRICAL SPECIFICATIONS AT 22°C
Parameter
Symbol
Test Conditions
Min
Operating Frequency Bandwidth
BW
Small Signal Gain
S21
VDD = +6 V IDD ≈ 60% IDSS
16.5
Saturated Drain Current
IDSS
VDD = +3V
Typ
Max
Units
14
GHz
18
21
dB
210
230
270
mA
125
8.5
(see Note)
Operating Current
IDQ
VDD = +6V
140
165
mA
Small Signal Gain Flatness
∆S21
VDD = +6 V IDD ≈ 60% IDSS
± 0.8
± 1.2
dB
Noise Figure
NF
VDD = +6 V IDD ≈ 60% IDSS
2.6
3.5
dB
3 -Order Intermodulation Distortion
IMD
VDD = +6 V IDD ≈ 60% IDSS
rd
POUT = +6 dBm SCL
•
16
-46
dBc
17.5
dBm
Power at 1dB Compression
P1dB
VDD = +6 V IDD ≈ 60% IDSS
Input Return Loss
S11
VDD = +6 V IDD ≈ 60% IDSS
-10
-6
dB
Output Return Loss
S22
VDD = +6 V IDD ≈ 60% IDSS
-16
-10
dB
Reverse Isolation
S12
VDD = +6 V IDD ≈ 60% IDSS
-40
-35
dB
NOTE: Continuous operation at IDSS is not recommended
Phone: +1 408 850-5790
Fax: +1 408 850-5766
www.filcs.com
Revised: 7/19/04
Email: [email protected]
PRELIMINARY
FMA411
LOW-NOISE X-BAND MMIC
ABSOLUTE MAXIMUM RATINGS1
Parameter
Symbol
Test Conditions
Supply Voltage
VDD
Supply Current
Max
Units
For any operating current
8
V
IDD
For VDD < 7V
75% IDSS
mA
RF Input Power
PIN
For standard bias conditions
0
dBm
Storage Temperature
TSTG
Non-Operating Storage
150
ºC
Total Power Dissipation
PTOT
See De-Rating Note below
980
mW
Comp.
Under any bias conditions
5
dB
Gain Compression
2
Simultaneous Combination of Limits
TAmbient = 22°C unless otherwise noted
1
Min
-40
2 or more Max. Limits
80
%
Users should avoid exceeding 80% of 2 or more Limits simultaneously
2
Notes:
• Operating conditions that exceed the Absolute Maximum Ratings will result in permanent damage to the device.
• Total Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where:
PDC: DC Bias Power
PIN: RF Input Power
POUT: RF Output Power
• Total Power Dissipation to be de-rated as follows above 22°C:
PTOT= 0.6 - (0.004W/°C) x TCARRIER
where TCARRIER = carrier or heatsink temperature above 22°C
(coefficient of de-rating formula is the Thermal Conductivity)
Example: For a 55°C carrier temperature: PTOT = 0.6 - (0.004 x (55 – 22)) = 0.47W
• For optimum heatsinking eutectic die attach is recommended; conductive epoxy die attach is acceptable with
some degradation in thermal de-rating performance (PTOT = 550mW)
• Note on Thermal Resistivity: The nominal value of 250°C/W is stated for the input stage, which will reach
temperature limits before the output stage. The aggregate MMIC thermal resistivity is approximately 175°C/W.
•
HANDLING PRECAUTIONS
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A per ESD-STM5.1-1998, Human Body Model.
Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263.
Phone: +1 408 850-5790
Fax: +1 408 850-5766
www.filcs.com
Revised: 7/19/04
Email: [email protected]
PRELIMINARY
•
FMA411
LOW-NOISE X-BAND MMIC
MECHANICAL OUTLINE:
Notes:
1) All units are in microns, unless otherwise specified.
2) All bond pads are 100x100 µm2
3) Bias pad (VDD) size is 100x100 µm2
Phone: +1 408 850-5790
Fax: +1 408 850-5766
www.filcs.com
Revised: 7/19/04
Email: [email protected]