FILTRONIC LMA219B

LMA219B
LOW NOISE PHEMT MMIC
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FEATURES
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7 GHz to 11 GHz Frequency Band
1.4 dB Noise Figure
19 dB Gain
14 dBm Output Power at Saturation
+3 V Single Bias Supply
DESCRIPTION AND APPLICATIONS
The Filtronic Solid State LMA219B is a low noise PHEMT amplifier which operates from 7 to
11GHz. This 2-stage reactive matched amplifier produces very low figure of 1.4dB with an
associated gain of 19dB. The LMA219B is designed for phased array radar applications. DC
decoupled input and output RF port. Ground is provided to the circuitry through vias to the backside
metallization.
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ELECTRICAL SPECIFICATIONS @ TAmbient = 25°C
(VDD = +3.0V, ZIN = ZOUT = 50Ω)
Parameter
Symbol
Test Conditions
Min
Typ
Frequency Band
F
Small Signal Gain
S21
VDD = 3V, RS = 10Ω
18
19
Drain Current at Saturation
IDSS
RS = 0Ω
70
140
Small Signal Gain Flatness
∆S21
Noise Figure
NF
Power at 1-dB Compression
P-1dB
Input Return Loss
7
Max
Units
11
GHz
dB
210
mA
3.0
dB
±0.5
IDS = 50% IDSS
1.4
10
dBm
S11
-12
dB
Output Return Loss
S22
-10
dB
Reverse Isolation
S12
-40
dB
Phone: (408) 988-1845
Fax: (408) 970-9950
9
-30
http:// www.filss.com
Revised: 10/22/01
Email: [email protected]
LMA219B
LOW NOISE PHEMT MMIC
•
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Drain Voltage
VD
Operating Current
Min
Max
Units
TAmbient = 22 ± 3 °C
4
V
IOP
TAmbient = 22 ± 3 °C
210
mA
RF Input Power
PIN
TAmbient = 22 ± 3 °C
15
dBm
Total Power Dissipation
PTOT
TAmbient = 22 ± 3 °C
0.85
W
Channel Operating Temperature
TCH
TAmbient = 22 ± 3 °C
150
ºC
Storage Temperature
Maximum Assembly Temperature
(1 min. max.)
TSTG
—
165
ºC
TMAX
—
300
ºC
-65
Notes:
• Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.
• Recommended Continuous Operating Limits should be observed for reliable device operation.
• Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where
PDC: DC Bias Power
PIN: RF Input Power
POUT: RF Output Power
• This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when
handling these devices.
Phone: (408) 988-1845
Fax: (408) 970-9950
http:// www.filss.com
Revised: 10/22/01
Email: [email protected]
LMA219B
LOW NOISE PHEMT MMIC
•
ASSEMBLY DRAWING
Notes:
• Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
• The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
• Bond on bond or stitch bond acceptable.
• Conductor over conductor acceptable. Conductors must not short.
Phone: (408) 988-1845
Fax: (408) 970-9950
http:// www.filss.com
Revised: 10/22/01
Email: [email protected]
LMA219B
LOW NOISE PHEMT MMIC
•
MECHANICAL OUTLINE
Notes:
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All units are in microns (µm).
All bond pads are 100 X 100 µm2 .
Bias pad (VDD ) size is 100 X 121.5 µm2 .
Unless otherwise specified.
HANDLING PRECAUTIONS
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A (0-500 V). Furthe r information on ESD control
measures can be found in MIL-STD-1686 and MIL-HDBK-263.
All information and specifications are subject to change without notice.
Phone: (408) 988-1845
Fax: (408) 970-9950
http:// www.filss.com
Revised: 10/22/01
Email: [email protected]