LMA419 LOW NOISE PHEMT MMIC • FEATURES ♦ ♦ ♦ ♦ ♦ ♦ • 18 GHz to 22 GHz Frequency Band 2.5 dB Noise Figure 22 dB Gain 5 dBm Output Power at Saturation 12 dB Input/Output Return Loss +3 V Single Bias Supply DESCRIPTION AND APPLICATIONS The Filtronic Solid State LMA419 is a low noise PHEMT amplifier that operates from 18 to 22GHz. This 3-stage reactively matched amplifier provides 22dB nominal gain with 2.5dB typical noise figure and saturated power output of +5dBm The LMA419 is designed for commercial mm-W (millimeter-wave) PCN/PCS applications. Ground is provided to the circuitry through vias to the backside metallization. • ELECTRICAL SPECIFICATIONS @ TAmbient = 25°°C (VDD = +3.0V, ZIN = ZOUT = 50Ω) Parameter Symbol Frequency Band F Small Signal Gain S21 Small Signal Gain Flatness ∆S21 ±0.8 ±1.0 dB Noise Figure NF 2.5 3.0 dB Input Return Loss S11 -12 -9 dB Output Return Loss S22 -12 -9 dB Reverse Isolation S12 -40 Phone: (408) 988-1845 Fax: (408) 970-9950 Test Conditions Min Typ 18 IDS = 20 mA http:// www.filss.com 18 Max Units 22 GHz 22 dB dB Revised: 12/05/00 Email: [email protected] LMA419 LOW NOISE PHEMT MMIC • ABSOLUTE MAXIMUM RATINGS Parameter Notes: • • • • Symbol Test Conditions Drain Voltage VD Operating Current Min Max Units TAmbient = 22 ± 3 °C 4 V IOP TAmbient = 22 ± 3 °C 90 mA RF Input Power PIN TAmbient = 22 ± 3 °C -10 dBm Total Power Dissipation PTOT TAmbient = 22 ± 3 °C 0.4 W Channel Operating Temperature TCH TAmbient = 22 ± 3 °C 150 ºC Storage Temperature Maximum Assembly Temperature (1 min. max.) TSTG — 165 ºC TMAX — 300 ºC -65 Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. Recommended Continuous Operating Limits should be observed for reliable device operation. Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where PDC: DC Bias Power PIN: RF Input Power POUT: RF Output Power This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 12/05/00 Email: [email protected] LMA419 LOW NOISE PHEMT MMIC • ASSEMBLY DRAWING Notes: • • • • Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended. Ultrasonic bonding is not recommended. The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes. Bond on bond or stitch bond acceptable. Conductor over conductor acceptable. Conductors must not short. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 12/05/00 Email: [email protected] LMA419 LOW NOISE PHEMT MMIC • MECHANICAL OUTLINE Notes: • • • • • All units are in microns (µm). All bond pads are 100 X 100 µm 2 . Bias pad (VDD ) size is 100 X 121.5 µm 2 . Unless otherwise specified. HANDLING PRECAUTIONS To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. All information and specifications are subject to change without notice. Phone: (408) 988-1845 Fax: (408) 970-9950 http:// www.filss.com Revised: 12/05/00 Email: [email protected]