54F/74F827 # 74F828 10-Bit Buffers/Line Drivers General Description Features The ’F827 and ’F828 10-bit bus buffers provide high performance bus interface buffering for wide data/address paths or buses carrying parity. The 10-bit buffers have NOR output enables for maximum control flexibility. The ’F827 and ’F828 are functionally- and pin-compatible to AMD’s Am29827 and Am29828. The ’F828 is an inverting version of the ’F827. Y Commercial Military 74F827SPC 54F827SDM (Note 2) 74F827SC (Note 1) Y Y TRI-STATEÉ output ’F828 is inverting Direct replacement for AMD’s Am29827 and Am29828 Package Number Package Description N24C 24-Lead (0.300× Wide) Molded Dual-In-Line J24F 24-Lead (0.300× Wide) Ceramic Dual-In-Line M24B 24-Lead (0.300× Wide) Molded Small Outline, JEDEC 54F827FM (Note 2) W24C 24-Lead Cerpack 54F827LM (Note 2) E28A 24-Lead Ceramic Leadless Chip Carrier, Type C 74F828SPC N24C 24-Lead (0.300× Wide) Molded Dual-In-Line 74F828SC (Note 1) M24B 24-Lead (0.300× Wide) Molded Small Outline, JEDEC Note 1: Devices also available in 13× reel. Use suffix e SCX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e SDMQB, FMQB and LMQB. Connection Diagrams Pin Assignment for DIP, Flatpak and SOIC ’F827 Pin Assignment for LCC ’F828 ’F827 TL/F/9598 – 2 TL/F/9598–1 TL/F/9598 – 8 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9598 RRD-B30M75/Printed in U. S. A. 54F/74F827 # 74F828 10-Bit Buffers/Line Drivers December 1994 Logic Symbols IEEE/IEC ’F827 IEEE/IEC ’F828 TL/F/9598–6 TL/F/9598 – 7 ’F827 ’F828 TL/F/9598–3 TL/F/9598 – 10 2 Unit Loading/Fan Out 54F/74F Pin Names OE1, OE2 D 0 – D7 O0 – O7 Description U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL Output Enable Input 1.0/1.0 20 mA/b0.6 mA Data Inputs 1.0/1.0 20 mA/b0.6 mA Data Outputs, TRI-STATE 600/106.6 (80) b12 mA/64 mA (48 mA) Function Table Functional Description The ’F827 and ’F828 are line drivers designed to be employed as memory address drivers, clock drivers and busoriented transmitters/receivers which provide improved PC board density. The devices have TRI-STATE outputs controlled by the Output Enable (OE) pins. The outputs can sink 64 mA (48 mA mil) and source 15 mA. Input clamp diodes limit high-speed termination effects. Inputs OE L L H Outputs On Dn H L X Function ’F827 ’F828 H L Z L H Z Transparent Transparent High Z H e HIGH Voltage level L e LOW Voltage Level Z e High Impedance X e Immaterial Logic Diagrams ’F827 TL/F/9598 – 4 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. ’F828 TL/F/9598 – 11 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. 3 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage VCD Input Clamp Diode Voltage VOH Output HIGH Voltage Typ Units 2.0 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC VCC Conditions Max V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal b 1.2 V 2.4 2.0 2.4 2.0 2.7 Min IIN e b18 mA V Min IOH IOH IOH IOH IOH IOL e 48 mA IOL e 64 mA e e e e e b 3 mA b 12 mA b 3 mA b 15 mA b 3 mA VOL Output LOW Voltage 54F 10% VCC 74F 10% VCC 0.55 0.55 V Min IIH Input HIGH Current 54F 74F 20.0 5.0 mA Max VIN e 2.7V IBVI Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V ICEX Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC VID Input Leakage Test 74F V 0.0 IID e 1.9 mA All Other Pins Grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current b 0.6 mA Max VIN e 0.5V IOZH Output Leakage Current 50 mA Max VOUT e 2.7V IOZL Output Leakage Current b 50 mA Max VOUT e 0.5V IOS Output Short-Circuit Current b 225 mA Max VOUT e 0V 4.75 b 100 4 DC Electrical Characteristics (Continued) Symbol 54F/74F Parameter Min Typ Units VCC Conditions Max IZZ Bus Drainage Test 500 mA 0.0V VOUT e 5.25V ICCH Power Supply Current (’F827) 30 45 mA Max VO e HIGH ICCL Power Supply Current (’F827) 60 90 mA Max VO e LOW ICCZ Power Supply Current (’F827) 40 60 mA Max VO e HIGH Z ICCH Power Supply Current (’F828) 14 20 mA Max VO e HIGH ICCL Power Supply Current (’F828) 56 85 mA Max VO e LOW ICCZ Power Supply Current (’F828) 35 50 mA Max VO e HIGH Z AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Units Min Typ Max Min Max Min Max tPLH tPHL Propagation Delay Data to Output (’F827) 1.0 1.5 3.0 3.3 5.5 5.5 1.0 1.5 7.5 7.0 1.0 1.5 6.5 6.0 ns tPLH tPHL Propagation Delay Data to Output (’F828) 1.0 1.0 3.0 2.0 5.0 4.0 1.0 1.0 5.5 4.0 ns tPZH tPZL Output Enable Time OE to On 3.0 3.5 5.7 6.8 9.0 11.5 2.5 3.0 10.0 12.5 2.5 3.0 9.5 12.0 ns tPHZ tPLZ Output Disable Time OE to On 1.5 1.0 3.3 3.5 8.0 8.0 1.5 1.0 9.0 9.0 1.5 1.0 8.5 8.5 ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 827/828 Temperature Range Family 74F e Commercial 54F e Military S C X Special Variations X e Devices shipped in 13× reel Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) Device Type Package Code SP e Slim Plastic DIP SD e Slim Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline (SOIC) 5 Physical Dimensions inches (millimeters) 28-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E28A 24-Lead (0.300× Wide) Ceramic Dual-In-Line Package (SD) NS Package Number J24F 6 Physical Dimensions inches (millimeters) (Continued) 24-Lead Small Outline Integrated Circuit (S) NS Package Number M24B 24-Lead Plastic Slim (0.300× Wide) Dual-In-Line Package (SP) NS Package Number N24C 7 54F/74F827 # 74F828 10-Bit Buffers/Line Drivers Physical Dimensions inches (millimeters) (Continued) 24-Lead Ceramic Flatpak (F) NS Package Number W24C LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. 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