54F/74F540 # 54F/74F541 Octal Buffer/Line Driver with TRI-STATEÉ Outputs General Description Features The ’F540 and ’F541 are similar in function to the ’F240 and ’F244 respectively, except that the inputs and outputs are on opposite sides of the package (see Connection Diagrams). This pinout arrangement makes these devices especially useful as output ports for microprocessors, allowing ease of layout and greater PC board density. Y Commercial Y Package Number Military TRI-STATE outputs drive bus lines Inputs and outputs opposite side of package, allowing easier interface to microprocessors Package Description N20A 20-Lead (0.300× Wide) Molded Dual-In-Line J20A 20-Lead Ceramic Dual-In-Line 74F540SC (Note 1) M20B 20-Lead (0.300× Wide) Molded Small Outline, JEDEC 74F540SJ (Note 1) M20D 20-Lead (0.300× Wide) Molded Small Outline, EIAJ 54F540FM (Note 2) W20A 20-Lead Cerpack 54F540LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C N20A 20-Lead (0.300× Wide) Molded Dual-In-Line J20A 20-Lead Ceramic Dual-In-Line 74F541SC (Note 1) M20B 20-Lead (0.300× Wide) Molded Small Outline, JEDEC 74F541SJ (Note 1) M20D 20-Lead (0.300× Wide) Molded Small Outline, EIAJ 54F541FM (Note 2) W20A 20-Lead Cerpack 54F541LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C 74F540PC 54F540DM (Note 2) 74F541PC 54F541DM (Note 2) Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak Pin Assignment for LCC ’F540 TL/F/9553 – 2 TL/F/9553 – 1 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9553 RRD-B30M75/Printed in U. S. A. 54F/74F540 # 54F/74F541 Octal Buffer/Line Driver with TRI-STATE Outputs May 1995 Connection Diagrams (Continued) ’F541 TL/F/9553 – 5 TL/F/9553–4 Unit Loading/Fan Out 54F/74F Pin Names OE1, OE2 In On, On Description U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL TRI-STATE Output Enable Input (Active LOW) Inputs Outputs 1.0/1.0 1.0/1.0 600/106.6 (80) 20 mA/b0.6 mA 20 mA/b0.6 mA b 12 mA/64 mA (48 mA) Truth Table Inputs Outputs OE1 OE2 I ’F540 ’F541 L H X L L X H L H X X L L Z Z H H Z Z L H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Z e High Impedance Logic Diagrams IEEE/IEC ’F540 IEEE/IEC ’F541 TL/F/9553–3 TL/F/9553 – 6 2 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage Typ Units 2.0 VCD Input Clamp Diode Voltage VOH Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC VCC Conditions Max V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal b 1.2 V 2.4 2.0 2.4 2.0 2.7 Min IIN e b18 mA V Min IOH IOH IOH IOH IOH e e e e e b 3 mA b 12 mA b 3 mA b 15 mA b 3 mA VOL Output LOW Voltage 54F 10% VCC 74F 10% VCC 0.55 0.55 V Min IOL e 48 mA IOL e 64 mA IIH Input HIGH Current 54F 74F 20.0 5.0 mA Max VIN e 2.7V IBVI Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V ICEX Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC VID Input Leakage Test 74F V 0.0 IID e 1.9 mA All Other Pins Grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current b 0.6 mA Max VIN e 0.5V IOZH Output Leakage Current 50 mA Max VOUT e 2.7V IOZL Output Leakage Current b 50 mA Max VOUT e 0.5V IOS Output Short-Circuit Current b 225 mA Max VOUT e 0V IZZ Bus Drainage Test 500 mA 0.0V VOUT e 5.25V 4.75 b 100 3 DC Electrical Characteristics Symbol (Continued) 54F/74F Parameter Min Typ Max Units VCC Conditions ICCH Power Supply Current (’F540) 11 20 mA Max VO e HIGH ICCL Power Supply Current (’F540) 53 75 mA Max VO e LOW ICCZ Power Supply Current (’F540) 31 45 mA Max VO e HIGH Z ICCH Power Supply Current (’F541) 26 35 mA Max VO e HIGH ICCL Power Supply Current (’F541) 55 75 mA Max VO e LOW ICCZ Power Supply Current (’F541) 31 55 mA Max VO e HIGH Z AC Electrical Characteristics Symbol Parameter 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min Typ Max Min Max Min Max tPLH tPHL Propagation Delay Data to Output (’F540) 1.5 1.0 3.0 2.0 5.0 4.0 1.0 1.0 6.0 4.5 1.0 1.0 5.5 4.0 tPZH tPZL Output Enable Time (’F540) 2.5 3.5 4.9 5.8 8.0 10.0 2.5 3.5 9.0 11.0 2.5 3.5 8.5 10.5 tPHZ tPLZ Output Disable Time (’F540) 1.5 1.0 3.4 2.5 6.0 5.5 1.5 1.0 7.0 7.5 1.5 1.0 6.5 6.0 tPLH tPHL Propagation Delay Data to Output (’F541) 1.5 1.5 3.3 2.7 5.5 5.5 1.5 1.5 6.0 6.0 tPZH tPZL Output Enable Time (’F541) 3.0 3.5 5.8 6.1 8.0 8.5 2.5 3.0 9.5 9.5 tPHZ tPLZ Output Disable Time (’F541) 1.5 1.5 3.4 2.9 6.0 5.5 1.5 1.5 6.5 6.0 Units ns ns ns ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 540/541 Temperature Range Family 74F e Commercial 54F e Military S C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13× reel Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) 4 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Dual-In-Lead Package (D) NS Package Number J20A 20-Lead (0.300× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M20B 6 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M20D 20-Lead (0.300× Wide) Molded Dual-In-Line Package (P) NS Package Number N20A 7 54F/74F540 # 54F/74F541 Octal Buffer/Line Driver with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Flatpak (F) NS Package Number W20A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 Tel: 1(800) 272-9959 TWX: (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str. 10 D-82256 F4urstenfeldbruck Germany Tel: (81-41) 35-0 Telex: 527649 Fax: (81-41) 35-1 National Semiconductor Japan Ltd. Sumitomo Chemical Engineering Center Bldg. 7F 1-7-1, Nakase, Mihama-Ku Chiba-City, Ciba Prefecture 261 Tel: (043) 299-2300 Fax: (043) 299-2500 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductores Do Brazil Ltda. Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel: (55-11) 212-5066 Telex: 391-1131931 NSBR BR Fax: (55-11) 212-1181 National Semiconductor (Australia) Pty, Ltd. Building 16 Business Park Drive Monash Business Park Nottinghill, Melbourne Victoria 3168 Australia Tel: (3) 558-9999 Fax: (3) 558-9998 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.