54F/74F10 Triple 3-Input NAND Gate General Description This device contains three independent gates, each of which performs the logic NAND function. Commercial Package Number Military Package Description N14A 14-Lead (0.300× Wide) Molded Dual-In-Line J14A 14-Lead Ceramic Dual-In-Line 74F10SC (Note 1) M14A 14-Lead (0.150× Wide) Molded Small Outline, JEDEC 74F10SJ (Note 1) M14D 14-Lead (0.300× Wide) Molded Small Outline, EIAJ 54F10FM (Note 2) W14B 14-Lead Cerpack 54F10LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C 74F10PC 54F10DM (Note 2) Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbol Connection Diagrams IEEE/IEC Pin Assignment for DIP, SOIC and Flatpak Pin Assignment for LCC TL/F/9458 – 2 TL/F/9458–3 TL/F/9458 – 1 Unit Loading/Fan Out 54F/74F Pin Names Description An, Bn, Cn On Inputs Outputs U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL 1.0/1.0 50/33.3 20 mA/b0.6 mA b 1 mA/20 mA FASTÉ and TRI-STATEÉ are registered trademarks of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9458 RRD-B30M75/Printed in U. S. A. 54F/74F10 Triple 3-Input NAND Gate December 1994 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATEÉ Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. DC Electrical Characteristics Symbol 54F/74F Parameter Min VIH Input HIGH Voltage VIL Input LOW Voltage Typ Units VCC Conditions Max 2.0 V Recognized as a HIGH Signal 0.8 V Recognized as a LOW Signal b 1.2 V Min IIN e b18 mA V Min IOH e b1 mA IOH e b1 mA IOH e b1 mA VCD Input Clamp Diode Voltage VOH Output HIGH Voltage 54F 10% VCC 74F 10% VCC 74F 5% VCC VOL Output LOW Voltage 54F 10% VCC 74F 10% VCC 0.5 0.5 V Min IOL e 20 mA IOL e 20 mA IIH Input HIGH Current 54F 74F 20.0 5.0 mA Max VIN e 2.7V IBVI Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V ICEX Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC VID Input Leakage Test 74F V 0.0 IID e 1.9 mA All other pins grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All other pins grounded IIL Input LOW Current 2.5 2.5 2.7 4.75 b 60 b 0.6 mA Max VIN e 0.5V b 150 mA Max VOUT e 0V IOS Output Short-Circuit Current ICCH Power Supply Current 1.4 2.1 mA Max VO e HIGH ICCL Power Supply Current 5.1 7.7 mA Max VO e LOW 2 AC Electrical Characteristics Symbol tPLH tPHL Parameter Propagation Delay An, Bn, Cn to On 74F 54F 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Min Typ Max Min Max Min Max 2.4 1.5 3.7 3.2 5.0 4.3 2.0 1.5 7.0 6.5 2.4 1.5 6.0 5.3 Units ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 10 S Temperature Range Family 74F e Commercial 54F e Military C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13× reels Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline Package SOIC JEDEC SJ e Small Outline Package SOIC EIAJ Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 3 Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Dual-In-Line Package (D) NS Package Number J14A 14-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M14A 4 Physical Dimensions inches (millimeters) (Continued) 14-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M14D 14-Lead (0.300× Wide) Molded Dual-In-Line Package (P) NS Package Number N14A 5 54F/74F10 Triple 3-Input NAND Gate Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Flatpak (F) NS Package Number W14B LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. 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