NSC 74F10PC

54F/74F10
Triple 3-Input NAND Gate
General Description
This device contains three independent gates, each of
which performs the logic NAND function.
Commercial
Package
Number
Military
Package Description
N14A
14-Lead (0.300× Wide) Molded Dual-In-Line
J14A
14-Lead Ceramic Dual-In-Line
74F10SC (Note 1)
M14A
14-Lead (0.150× Wide) Molded Small Outline, JEDEC
74F10SJ (Note 1)
M14D
14-Lead (0.300× Wide) Molded Small Outline, EIAJ
54F10FM (Note 2)
W14B
14-Lead Cerpack
54F10LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
74F10PC
54F10DM (Note 2)
Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB.
Logic Symbol
Connection Diagrams
IEEE/IEC
Pin Assignment for
DIP, SOIC and Flatpak
Pin Assignment
for LCC
TL/F/9458 – 2
TL/F/9458–3
TL/F/9458 – 1
Unit Loading/Fan Out
54F/74F
Pin Names
Description
An, Bn, Cn
On
Inputs
Outputs
U.L.
HIGH/LOW
Input IIH/IIL
Output IOH/IOL
1.0/1.0
50/33.3
20 mA/b0.6 mA
b 1 mA/20 mA
FASTÉ and TRI-STATEÉ are registered trademarks of National Semiconductor Corporation.
C1995 National Semiconductor Corporation
TL/F/9458
RRD-B30M75/Printed in U. S. A.
54F/74F10 Triple 3-Input NAND Gate
December 1994
Absolute Maximum Ratings (Note 1)
Recommended Operating
Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature
b 65§ C to a 150§ C
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
b 55§ C to a 125§ C
Free Air Ambient Temperature
Military
Commercial
b 55§ C to a 125§ C
0§ C to a 70§ C
Supply Voltage
Military
Commercial
b 55§ C to a 175§ C
b 55§ C to a 150§ C
a 4.5V to a 5.5V
a 4.5V to a 5.5V
VCC Pin Potential to
Ground Pin
b 0.5V to a 7.0V
b 0.5V to a 7.0V
Input Voltage (Note 2)
b 30 mA to a 5.0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with VCC e 0V)
b 0.5V to VCC
Standard Output
b 0.5V to a 5.5V
TRI-STATEÉ Output
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol
54F/74F
Parameter
Min
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
Typ
Units
VCC
Conditions
Max
2.0
V
Recognized as a HIGH Signal
0.8
V
Recognized as a LOW Signal
b 1.2
V
Min
IIN e b18 mA
V
Min
IOH e b1 mA
IOH e b1 mA
IOH e b1 mA
VCD
Input Clamp Diode Voltage
VOH
Output HIGH
Voltage
54F 10% VCC
74F 10% VCC
74F 5% VCC
VOL
Output LOW
Voltage
54F 10% VCC
74F 10% VCC
0.5
0.5
V
Min
IOL e 20 mA
IOL e 20 mA
IIH
Input HIGH
Current
54F
74F
20.0
5.0
mA
Max
VIN e 2.7V
IBVI
Input HIGH Current
Breakdown Test
54F
74F
100
7.0
mA
Max
VIN e 7.0V
ICEX
Output HIGH
Leakage Current
54F
74F
250
50
mA
Max
VOUT e VCC
VID
Input Leakage
Test
74F
V
0.0
IID e 1.9 mA
All other pins grounded
IOD
Output Leakage
Circuit Current
74F
3.75
mA
0.0
VIOD e 150 mV
All other pins grounded
IIL
Input LOW Current
2.5
2.5
2.7
4.75
b 60
b 0.6
mA
Max
VIN e 0.5V
b 150
mA
Max
VOUT e 0V
IOS
Output Short-Circuit Current
ICCH
Power Supply Current
1.4
2.1
mA
Max
VO e HIGH
ICCL
Power Supply Current
5.1
7.7
mA
Max
VO e LOW
2
AC Electrical Characteristics
Symbol
tPLH
tPHL
Parameter
Propagation Delay
An, Bn, Cn to On
74F
54F
74F
TA e a 25§ C
VCC e a 5.0V
CL e 50 pF
TA, VCC e Mil
CL e 50 pF
TA, VCC e Com
CL e 50 pF
Min
Typ
Max
Min
Max
Min
Max
2.4
1.5
3.7
3.2
5.0
4.3
2.0
1.5
7.0
6.5
2.4
1.5
6.0
5.3
Units
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
10
S
Temperature Range Family
74F e Commercial
54F e Military
C
X
Special Variations
QB e Military grade device with
environmental and burn-in
processing
X e Devices shipped in 13× reels
Device Type
Package Code
P e Plastic DIP
D e Ceramic DIP
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline Package SOIC JEDEC
SJ e Small Outline Package SOIC EIAJ
Temperature Range
C e Commercial (0§ C to a 70§ C)
M e Military (b55§ C to a 125§ C)
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
3
Physical Dimensions inches (millimeters) (Continued)
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
14-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M14A
4
Physical Dimensions inches (millimeters) (Continued)
14-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M14D
14-Lead (0.300× Wide) Molded Dual-In-Line Package (P)
NS Package Number N14A
5
54F/74F10 Triple 3-Input NAND Gate
Physical Dimensions inches (millimeters) (Continued)
14-Lead Ceramic Flatpak (F)
NS Package Number W14B
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