SEMICONDUCTOR TECHNICAL DATA The MC10124 is a quad translator for interfacing data and control signals between a saturated logic section and the MECL section of digital systems. The MC10124 has TTL compatible inputs, and MECL complementary open–emitter outputs that allow use as an inverting/ non–inverting translator or as a differential line driver. When the common strobe input is at the low logic level, it forces all true outputs to a MECL low logic state and all inverting outputs to a MECL high logic state. Power supply requirements are ground, +5.0 Volts, and –5.2 Volts. Propagation delay of the MC10124 is typically 3.5 ns. The dc levels are standard or Schottky TTL in, MECL 10,000 out. An advantage of this device is that TTL level information can be transmitted differentially, via balanced twisted pair lines, to the MECL equipment, where the signal can be received by the MC10115 or MC10116 differential line receivers. The MC10124 is useful in computers, instrumentation, peripheral controllers, test equipment, and digital communications systems. L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 FN SUFFIX PLCC CASE 775–02 PD = 380 mW typ/pkg (No Load) tpd = 3.5 ns typ (+ 1.5 Vdc in to 50% out) tr, tf = 2.5 ns typ (20%–80%) DIP PIN ASSIGNMENT BOUT 1 16 GND AOUT 2 15 COUT BOUT 3 14 DOUT AOUT 4 13 DOUT AIN COMMON STROBE BIN 5 12 COUT 6 11 DIN 7 10 CIN VEE 8 9 VCC LOGIC DIAGRAM 5 4 6 2 7 3 1 10 12 15 11 13 14 Gnd = VCC (+5.0Vdc) = VEE (–5.2Vdc) = Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). PIN 16 PIN 9 PIN 8 3/93 Motorola, Inc. 1996 3–82 REV 5 MC10124 ELECTRICAL CHARACTERISTICS Test Limits Characteristic Symbol Pin Pi Under Test Negative Power Supply Drain Current IE 8 72 Positive Power Supply pp y Drain C Current ICCH 9 16 –30°C Min +25°C Max Min Typ +85°C Max Unit 66 72 mAdc 16 18 mAdc Max Min ICCL 9 25 25 25 mAdc Reverse Current IR 6 7 200 50 200 50 200 50 µAdc Forward Current IF 6 7 –12.8 –3.2 –12.8 –3.2 –12.8 –3.2 mAdc BVin 6 7 Clamp Input Voltage VI 6 7 High Output Voltage VOH 1 3 –1.060 –1.060 –0.890 –0.890 –0.960 –0.960 –0.810 –0.810 Low Output Voltage VOL 1 3 –1.890 –1.890 –1.675 –1.675 –1.850 –1.850 –1.650 –1.650 High Threshold Voltage VOHA 1 3 –1.080 –1.080 Low Threshold Voltage VOLA 1 3 Input Breakdown Voltage Switching Times 5.5 5.5 5.5 5.5 5.5 5.5 –1.5 –1.5 –1.5 –1.5 –0.980 –0.980 Vdc –1.5 –1.5 Vdc –0.890 –0.890 –0.700 –0.700 Vdc –1.825 –1.825 –1.615 –1.615 Vdc –0.910 –0.910 –1.655 –1.655 –1.630 –1.630 Vdc –1.595 –1.595 (50Ω Load) Propagation Delay (+3.5Vdc to 50%)1 Rise Time (20 to 80%) Fall Time (20 to 80%) Vdc ns t6+1+ t6–1– t7+1+ t7–1– t7+3– t7–3+ 1 1 1 1 3 3 1.5 1.0 1.5 1.0 1.5 1.0 6.8 6.0 6.8 6.0 6.8 6.0 1.0 1.0 1.0 1.0 1.0 1.0 3.5 3.5 3.5 3.5 3.5 3.5 6.0 6.0 6.0 6.0 6.0 6.0 1.0 1.5 1.0 1.5 1.0 1.5 6.0 6.8 6.0 6.8 6.0 6.8 t1+ 1 1.0 4.2 1.1 2.5 3.9 1.1 4.3 t1– 1 1.0 4.2 1.1 2.5 3.9 1.1 4.3 1. See switching time test circuit. Propagation delay for this circuit is specified from +1.5Vdc in to the 50% point on the output waveform. The +3.5Vdc is shown here because all logic and supply levels are shifted 2 volts positive. MECL Data DL122 — Rev 6 3–83 MOTOROLA MC10124 ELECTRICAL CHARACTERISTICS (continued) TEST VOLTAGE VALUES (Volts) @ Test Temperature VIH VILmax VIHA’ VILA’ VF –30°C +4.0 +0.40 +2.00 +1.10 +0.40 +25°C +4.0 +0.40 +1.80 +1.10 +0.40 +85°C +4.0 +0.40 +1.80 +0.90 +0.40 Symbol Pin Under Test Negative Power Supply Drain Current IE 8 Positive Power Supply pp y Drain C Current t ICCH 9 ICCL 9 Reverse Current IR 6 7 Forward Current IF 6 7 BVin 6 7 5,7,10,11,16 6,16 Clamp Input Voltage VI 6 7 16 16 High Output Voltage VOH 1 3 Characteristic Input Breakdown Voltage Low Output Voltage VOL High Threshold Voltage VOHA Low Threshold Voltage Switching Times VOLA Rise Time (20 to 80%) VIH VILmax VIHA’ VILA’ VF G d Gnd 16 5,6,7,10,11 16 5,6,7,10,11,16 5,7,10,11 6 6,7 6,7 1 3 6 6 1 3 6 6 5,7,10,11 6 16 16 6 7 16 16 16 16 6,7 1 3 (50Ω Load) Propagation Delay (+3.5Vdc to 50%)1 TEST VOLTAGE APPLIED TO PINS LISTED BELOW 6,7 16 16 7 7 7 16 16 7 16 16 +6.0 V Pulse In Pulse Out +2.0 V t6+1+ t6–1– t7+1+ t7–1– t7+3– t7–3+ 1 1 1 1 3 3 7 7 6 6 6 6 6 6 7 7 7 7 1 1 1 1 3 3 16 16 16 16 16 16 t1+ 1 6 7 1 16 Fall Time (20 to 80%) t1– 1 6 7 1 16 1. See switching time test circuit. Propagation delay for this circuit is specified from +1.5Vdc in to the 50% point on the output waveform. The +3.5Vdc is shown here because all logic and supply levels are shifted 2 volts positive. MOTOROLA 3–84 MECL Data DL122 — Rev 6 MC10124 ELECTRICAL CHARACTERISTICS (continued) TEST VOLTAGE VALUES (Volts) @ Test Temperature VR VCC VEE II Iin –30°C +2.40 +5.00 –5.2 –10 +1.0 +25°C +2.40 +5.00 –5.2 –10 +1.0 +85°C +2.40 +5.00 –5.2 –10 +1.0 Symbol Pin Under Test Negative Power Supply Drain Current IE Positive Power Supply pp y Drain C Current t Characteristic (mA) TEST VOLTAGE APPLIED TO PINS LISTED BELOW VEE 8 9 8 16 ICCH 9 9 8 16 ICCL 9 9 8 5,6,7,10,11,16 Reverse Current IR 6 7 9 9 8 8 16 16 Forward Current IF 6 7 9 9 8 8 16 16 BVin 6 7 9 9 8 8 Clamp Input Voltage VI 6 7 9 9 8 8 High Output Voltage VOH 1 3 9 9 8 8 16 16 Low Output Voltage VOL 1 3 9 9 8 8 16 16 High Threshold Voltage VOHA 1 3 9 9 8 8 16 16 Low Threshold Voltage VOLA 1 3 9 9 8 8 16 16 +7.0 V –3.2 V +2.0 V Switching Times (50Ω Load) Propagation Delay (+3.5Vdc to 50%)1 Rise Time 6 7 (20 to 80%) II Iin G d Gnd VCC Input Breakdown Voltage VR 6 7 6 7 5,7,10,11,16 6,16 16 16 t6+1+ t6–1– t7+1+ t7–1– t7+3– t7–3+ 1 1 1 1 3 3 9 9 9 9 9 9 8 8 8 8 8 8 16 16 16 16 16 16 t1+ 1 9 8 16 Fall Time (20 to 80%) t1– 1 9 8 16 1. See switching time test circuit. Propagation delay for this circuit is specified from +1.5Vdc in to the 50% point on the output waveform. The +3.5Vdc is shown here because all logic and supply levels are shifted 2 volts positive. Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner. MECL Data DL122 — Rev 6 3–85 MOTOROLA MC10124 SWITCHING TIME TEST CIRCUIT +6.0 Vdc Vin Coax 0.1 µF 25 µF Input Pulse t+ = t– = 5.5 ±0.5 ns (10 to 90%) 0.1 µF 5 6 4 2 7 3 1 10 12 15 11 13 14 Input Pulse Generator 16 0.1 µF 50–ohm termination to ground lo– cated in each scope channel input. All input and output cables to the scope are equal lengths of 50–ohm coaxial cable. Wire length should be < 1/4 inch from TPin to input pin and TPout to output pin. Vout NAND VCC +7.0 Vdc 25 µF Vout AND Coax Coax Unused outputs connected to a 50–ohm resistor to ground. 8 0.1 µF + 2.0 Vdc –3.2 Vdc VEE NOTE: All power supply and logic levels are shown shifted 2 volts positive. MOTOROLA 3–86 MECL Data DL122 — Rev 6 MC10124 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 3–87 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10124 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315 Mfax: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 3–88 *MC10124/D* MC10124/D MECL Data DL122 — Rev 6