SEMICONDUCTOR TECHNICAL DATA The MC10H173 is a quad 2–input multiplexer with latch. This device is a functional/pinout duplication of the standard MECL 10K part, with 100% improvement in propagation delay and no increase in power supply current. • Data Propagation Delay, 1.5 ns Typical • Voltage Compensated • Power Dissipation, 275 mW Typical • MECL 10K–Compatible • Improved Noise Margin 150 mV (over operating voltage and temperature range) L SUFFIX CERAMIC PACKAGE CASE 620–10 P SUFFIX PLASTIC PACKAGE CASE 648–08 MAXIMUM RATINGS Symbol Rating Unit Power Supply (VCC = 0) Characteristic VEE –8.0 to 0 Vdc Input Voltage (VCC = 0) VI 0 to VEE Vdc Iout 50 100 mA TA 0 to +75 °C Tstg –55 to +150 –55 to +165 °C °C Output Current — Continuous — Surge Operating Temperature Range Storage Temperature Range — Plastic — Ceramic FN SUFFIX PLCC CASE 775–02 TRUTH TABLE ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° Characteristic Power Supply Current Input Current High Pins 3–7 & 10–13 Pin 9 25° 75° Symbol Min Max Min Max Min Max Unit IE — 73 — 66 — 73 mA — — 510 475 — — 320 300 — — 320 300 Input Current Low IinL 0.5 — 0.5 — 0.3 — µA High Output Voltage VOH –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc Low Output Voltage VOL –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc High Input Voltage VIH –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc Set–up Time Data Select tset Hold Time Data Select thold Rise Time Fall Time ns 0.7 1.0 1.0 2.3 3.7 3.6 0.7 1.0 1.0 2.3 3.7 3.6 0.7 1.0 1.0 2.3 3.7 3.6 ns 0.7 1.0 — — 0.7 1.0 — — 0.7 1.0 — — 0.7 1.0 — — 0.7 1.0 — — 0.7 1.0 — — tr 0.7 2.4 0.7 2.4 0.7 2.4 ns tf 0.7 2.4 0.7 2.4 0.7 2.4 ns ns NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. H L X L L H D00 D01 Q0n 2–53 Q0 1 16 VCC Q1 2 15 Q2 D11 3 14 Q3 D10 4 13 D20 D01 5 12 D21 D00 6 11 D30 CLOCK 7 10 D31 VEE 8 9 SELECT Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). 3/93 Motorola, Inc. 1996 Q0n + 1 DIP PIN ASSIGNMENT AC PARAMETERS tpd CLOCK µA IinH Propagation Delay Data Clock Select SELECT REV 5 MC10H173 APPLICATION INFORMATION The MC10173 is a quad two–channel multiplexer with latch. It incorporates common clock and common data select inputs. The select input determines which data input is enabled. A high (H) level enables data inputs D00, D10, D20, and D30 and a low (L) level enables data inputs D01, D11, D21, D31. Any change on the data input will be reflected at the outputs while the clock is low. The outputs are latched on the positive transition of the clock. While the clock is in the high state, a change in the information present at the data inputs will not affect the output information. LOGIC DIAGRAM SELECT 9 1 Q0 D00 6 D01 5 2 Q1 D10 4 D11 3 15 Q2 D20 13 D21 12 14 Q3 D30 11 D31 10 CLOCK 7 VCC = PIN 16 VEE = PIN 8 MOTOROLA 2–54 MECL Data DL122 — Rev 6 MC10H173 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 V 0.010 (0.250) G1 X S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S Z C H –T– SEATING PLANE F VIEW S G1 0.010 (0.250) S T L–M S 0.007 (0.180) M T L–M S N S VIEW S S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 N K 0.004 (0.100) J S K1 E G 0.007 (0.180) M T L–M 2–55 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA MC10H173 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE V –A– 16 9 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. –B– C L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 2–56 *MC10H173/D* MC10H173/D MECL Data DL122 — Rev 6