SEMICONDUCTOR TECHNICAL DATA The MC10H181 is a high–speed arithmetic logic unit capable of performing 16 logic operations and 16 arithmetic operations on two four–bit words. Full internal carry is incorporated for ripple through operation. Arithmetic logic operations are selected by applying the appropriate binary word to the select inputs (S0 through S3) as indicated in the tables of arithmetic/logic functions. Group carry propagate (PG) and carry generate (GG) are provided to allow fast operations on very long words using a second order look–ahead. The internal carry is enabled by applying a low level voltage to the mode control input (M). When used with the MC10H179, full–carry look–ahead, as a second order look–ahead block, the MC10H181 provides high–speed arithmetic operations on very long words. This 10H part is a functional/pinout duplication of the standard MECL 10K family part with 100% improvement in propagation delay and no increase in power supply current. L SUFFIX CERAMIC PACKAGE CASE 758–02 P SUFFIX PLASTIC PACKAGE CASE 724–03 FN SUFFIX PLCC CASE 776–02 • Improved Noise Margin, 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated DIP PIN ASSIGNMENT • MECL 10K – Compatible MAXIMUM RATINGS Characteristic Symbol Rating Unit VCC1 1 24 VCC2 VEE VI –8.0 to 0 Vdc F0 2 23 M 0 to VEE Vdc F1 3 22 CN GG 4 21 A0 Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current — Continuous — Surge Iout 50 100 mA Operating Temperature Range TA Tstg 0 to +75 °C CN + 4 5 20 B0 –55 to +150 –55 to +165 °C °C F3 6 19 B1 F2 7 18 A1 PG 8 17 S1 B3 9 16 A2 A3 10 15 S2 B2 11 14 S0 VEE 12 13 S3 Storage Temperature Range — Plastic — Ceramic NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. FUNCTION SELECT TABLE LOGIC DIAGRAM Function Select S3 S2 S1 S0 13 15 17 14 S0 S1 21 A0 20 B0 18 A1 19 B1 16 A2 11 B2 10 A3 9 B3 22 Cn 23 M S2 S3 F0 2 F1 3 F2 7 L L L L Logic Functions M is High C = D.C. F Arithmetic Operation M is Low Cn is low F L L F=A L L H F=A+B F = A plus (A • B) L H L F=A+B F = A plus (A • B) L L H H F = Logical “1” L H L L F=A•B L H L H F=B L H H L F=A L H H H F=A+B F = A plus (A + B) H L L L F=A•B F = (A + B) plus 0 H L L H F=A B B F=A F = A times 2 F = (A + B) plus 0 Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). F = (A + B) plus (A • B) F = A plus B F = A minus B minus 1 F3 6 H L H L F=B GG 4 H L H H F=A+B H H L L F = Logical “0” PG 8 H H L H F=A•B F = (A • B) minus 1 Cn+4 5 H H H L F=A•B F = (A • B) minus 1 H H H H F=A F = (A + B) plus (A • B) F = A plus (A + B) F = minus 1 (two’s complement) F = A minus 1 9/96 Motorola, Inc. 1996 2–275 REV 6 MC10H181 S3 13 LOGIC DIAGRAM S2 15 S1 17 S0 14 2 F0 B0 20 A0 21 3 F1 B1 19 A1 18 7 F2 B2 11 A2 16 6 F3 B3 9 8 PG A3 10 4 GG 5 Cn+4 Cn 22 M 23 VCC1 = Pin 1 VCC2 = Pin 24 VEE = Pin 12 MOTOROLA 2–276 MECL Data DL122 — Rev 6 MC10H181 ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5.0%) (See Note) 0° Characteristic Power Supply Current Input Current High Pin 22 Pins 14,23 Pins 13,15,17 Pins 10,16,18,21 Pins 9,11,19,20 +25° +75° Symbol Min Max Min Max Min Max Unit IE IinH — 159 — 145 — 159 mA — — — — — 720 405 515 475 465 — — — — — 450 255 320 300 275 — — — — — 450 255 320 300 275 µA Input Current Low Pins 9–11, 13–22 IinL 0.5 — 0.5 — 0.3 — µA High Output Voltage VOH VOL –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc VIH VIL –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc Low Output Voltage High Input Voltage Low Input Voltage NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. AC PARAMETERS AC Switching Characteristics 0°C Characteristic Symbol Input Output Propagation Delay Rise Time, Fall Time t+ +, t– – t+, t– Cn Cn Propagation Delay t+ +, t+ –, t– +, t– – t+, t– +25°C +75°C Conditions Min Max Min Max Min Max Unit Cn+4 Cn+4 A0,A1,A2,A3 A0,A1,A2,A3 0.7 0.6 2.0 2.0 0.7 0.6 2.0 2.0 0.7 0.7 2.2 2.2 ns ns Cn Cn Cn F1 F1 F1 A0 1.0 0.7 3.0 2.2 1.0 0.7 3.0 2.2 1.2 0.7 3.3 2.4 Rise Time, Fall Time t+ +, t+ –, t– +, t– – t+, t– A1 A1 A1 F1 F1 F1 1.5 0.7 3.7 2.0 1.5 0.7 3.7 2.0 1.6 0.7 4.0 2.2 Propagation Delay Rise Time, Fall Time t+ +, t– – t+, t– A1 A1 PG PG S0,S3 S0,S3 1.5 0.9 3.7 2.4 1.5 0.9 3.7 2.4 1.6 0.9 4.0 2.6 ns ns Propagation Delay Rise Time, Fall Time t+ +, t– – t+, t– A1 A1 GG GG A0,A2,A3,Cn A0,A2,A3,Cn 1.5 0.7 3.7 2.2 1.5 0.7 3.7 2.2 1.6 0.7 3.9 2.4 ns ns Propagation Delay Rise Time, Fall Time t+ –, t– + t+, t– A1 A1 Cn+4 Cn+4 A0,A2,A3,Cn A0,A2,A3,Cn 1.5 0.5 3.6 2.0 1.5 0.5 3.6 2.0 1.6 0.5 3.9 2.2 ns ns Propagation Delay Rise Time, Fall Time t+ +, t– + t+, t– B1 B1 F1 F S3,Cn S3,Cn 2.0 0.7 4.5 2.3 2.0 0.7 4.5 2.3 2.1 0.7 4.8 2.5 ns ns Propagation Delay Rise Time, Fall Time t+ +, t– – t+, t– B1 B1 PG PG S0,A1 S0,A1 1.5 0.7 3.8 2.2 1.5 0.7 3.8 2.2 1.6 0.7 4.0 2.4 ns ns Propagation Delay Rise Time, Fall Time t+ +, t– – t+, t– B1 B1 GG GG S3,Cn S3,Cn 1.5 0.7 3.7 2.2 1.5 0.7 3.7 2.2 1.6 0.7 4.0 2.4 ns ns Propagation Delay Rise Time, Fall Time t+ –, t– + t+, t– B1 B1 Cn+4 Cn+4 S3,Cn S3,Cn 2.0 0.5 4.0 2.0 2.0 0.5 4.0 2.2 2.1 0.5 4.3 2.2 ns ns Propagation Delay Rise Time, Fall Time t+ +, t+ – t+, t– M M F1 F1 — — 1.5 0.8 4.2 2.3 1.5 0.8 4.2 2.3 1.6 0.8 4.5 2.5 ns ns Propagation Delay Rise Time, Fall Time t+ –, t– + t+, t– S1 S1 F1 F1 A1,B1 A1,B1 1.5 0.7 4.5 2.0 1.5 0.7 4.5 2.0 1.6 0.7 4.8 2.2 ns ns Propagation Delay Rise Time, Fall Time t– +, t+ – t+, t– S1 S1 PG PG A3,B3 A3,B3 1.5 0.7 4.0 2.0 1.5 0.7 4.0 2.2 1.6 0.7 4.3 2.4 ns ns Propagation Delay Rise Time, Fall Time t+ –, t– + t+, t– S1 S1 Cn+4 Cn+4 A3,B3 A3,B3 1.5 0.7 4.1 2.2 1.5 0.7 4.1 2.2 1.6 0.7 4.4 2.4 ns ns Propagation Delay Rise Time, Fall Time t+ –, t– + t+, t– S1 S1 GG GG A3,B3 A3,B3 1.3 0.5 4.5 3.2 1.3 0.5 4.5 3.2 1.4 0.5 4.8 3.4 ns ns Rise Time, Fall Time Propagation Delay ns ns † Logic high level (+1.11 Vdc) applied to pins listed. All other input pins are left floating or tied to +0.31 Vdc. VCC1 = VCC2 = +2.0 Vdc, VEE = –3.2 Vdc MECL Data DL122 — Rev 6 2–277 MOTOROLA MC10H181 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B T L–M M N S T L–M S S Y BRK –N– 0.007 (0.180) U M N S D Z –M– –L– W 28 D X G1 0.010 (0.250) T L–M S N S S V 1 VIEW D–D A 0.007 (0.180) R 0.007 (0.180) M T L–M S N S C M T L–M S N 0.007 (0.180) H Z M T L–M N S S S K1 E 0.004 (0.100) G J S K SEATING PLANE F VIEW S G1 0.010 (0.250) –T– T L–M S N S M T L–M S N S VIEW S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA 0.007 (0.180) 2–278 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10_ 0.410 0.430 0.040 ––– MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10_ 10.42 10.92 1.02 ––– MECL Data DL122 — Rev 6 MC10H181 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 758–02 ISSUE A L B 24 P 13 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 12 J –A– DIM A B C D F G J K L N P N C –T– K SEATING PLANE G F INCHES MIN MAX 1.240 1.285 0.285 0.305 0.160 0.200 0.015 0.021 0.045 0.062 0.100 BSC 0.008 0.013 0.100 0.165 0.300 0.310 0.020 0.050 0.360 0.400 MILLIMETERS MIN MAX 31.50 32.64 7.24 7.75 4.07 5.08 0.38 0.53 1.14 1.57 2.54 BSC 0.20 0.33 2.54 4.19 7.62 7.87 0.51 1.27 9.14 10.16 D 24 PL 0.25 (0.010) T A M M P SUFFIX PLASTIC DIP PACKAGE CASE 724–03 ISSUE D –A– 24 13 1 12 –B– L C –T– NOTE 1 K SEATING PLANE N E G M J F D 24 PL 0.25 (0.010) 24 PL 0.25 (0.010) NOTES: 1. CHAMFERED CONTOUR OPTIONAL. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. M T A M M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.230 1.265 0.250 0.270 0.145 0.175 0.015 0.020 0.050 BSC 0.040 0.060 0.100 BSC 0.007 0.012 0.110 0.140 0.300 BSC 0_ 15_ 0.020 0.040 MILLIMETERS MIN MAX 31.25 32.13 6.35 6.85 3.69 4.44 0.38 0.51 1.27 BSC 1.02 1.52 2.54 BSC 0.18 0.30 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MECL Data DL122 — Rev 6 2–279 *MC10H181/D* MC10H181/D MOTOROLA