TCD2560D TOSHIBA CCD Image Sensor CCD (charge coupled device) TCD2560D The TCD2560D is a high sensitive and low dark current 5400 elements × 3 line CCD color image sensor which includes CCD drive circuit and clamp circuit. The sensor is designed for scanner. The device contains a row of 5400 elements × 3 line photodiodes which provide a 24 lines/mm (600 dpi) across a A4 size paper. The device is operated by 5 V pulse, and 12 V power supply. Features · Number of image sensing elements: 5400 elements × 3 line · Image sensing element size: 5.25 µm by 5.25 µm on 5.25 µm centers · Photo sensing region: High sensitive and low dark current PN photodiode · Distance between photodiode array: 42 µm (8 lines) · Clock: 2 phase (5 V) · Power supply: 12 V power supply voltage · Internal circuit: Clamp circuit · Package: 22 pin CERDIP package · Color filter: Red, green, blue Weight: 4.5 g (typ.) Pin Assignment (top view) 1 2002-12-25 TCD2560D Maximum Ratings (Note 1) Characteristics Symbol Clock pulse voltage VfA Shift pulse voltage VSH Reset pulse voltage VRS Rating Unit V -0.3~8.0 V V Clamp pulse voltage VCP Power supply voltage VOD -0.3~15 V V Operating temperature Topr 0~60 °C Storage temperature Tstg -25~85 °C Note 1: All voltage are with respect to SS terminals (ground). Circuit Diagram 2 2002-12-25 TCD2560D Pin Names Pin No. Symbol 1 OS3 2 3 Name Pin No. Symbol Signal Output 3 (red) 12 SH2 Shift Gate 2 SS Ground 13 SH1 Shift Gate 1 RS Reset Gate 14 f1A1 Clock 1 (phase 1) 4 CP Clamp Gate 15 f2A1 Clock 1 (phase 2) 5 NC Non Connection 16 NC Non Connection 6 NC Non Connection 17 NC Non Connection 7 NC Non Connection 18 NC Non Connection 8 f2A2 Clock 2 (phase 2) 19 NC Non Connection 9 f1A2 Clock 2 (phase 1) 20 OD Power 10 SH3 Shift Gate 3 21 OS1 Signal Output 1 (blue) 11 SS Ground 22 OS2 Signal Output 2 (green) 3 Name 2002-12-25 TCD2560D Optical/Electrical Characteristics (Ta = 25°C, VOD = 12 V, Vf f = VSH = VRS = VCP = 5 V (pulse), ff f = 1.0 MHz, fRS = 1 MHz, tINT = 10 ms, light source = light source A + CM500S filter (t = 1 mm), load resistance = 100 kW W) Characteristics Sensitivity Symbol Min Typ. Max Red R (R) 3.4 4.8 6.2 Green R (G) 4.7 6.7 8.7 Blue R (B) 2.0 2.9 3.8 Unit Note V/lx･s (Note 2) PRNU (1) ¾ 15 20 % (Note 3) PRNU (3) ¾ 3 12 mV (Note 4) VSAT 2.5 3.0 ¾ V (Note 5) Saturation exposure SE ¾ 0.45 ¾ Ix･s (Note 6) Dark signal voltage VDRK ¾ 0.5 3.0 mV (Note 7) Dark signal non uniformity DSNU ¾ 2.0 9.0 mV (Note 7) DC power dissipation PD ¾ 300 400 mW Total transfer efficiency TTE 92 98 ¾ % Output impedance ZO ¾ 0.3 1.0 kW DC compensation output voltage VOS 4.0 5.0 6.0 V (Note 8) Random noise NDs ¾ 1.0 ― mV (Note 9) Reset noise VRSN ¾ 0.3 1.0 V (Note 8) Masking noise VMS ¾ 0.1 0.5 V (Note 8) Photo response non uniformity Saturation output voltage Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. Note 3: PRNU (1) is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. PRNU (1) = Dc ´ 100 (%) c Where ? is average of total signal output and Dc is the maximum deviation from ? . The amount of incident light is shown below. Red = 1/2･SE Green = 1/2･SE Blue = 1/4･SE Note 4: PRNU (3) is defined as maximum voltage with next pixels, where measured at 5% of SE (typ.). Note 5: VSAT is defined as minimum saturation output of all effective pixels. Note 6: Definition of SE V SE = SAT (Ix × s) RG 4 2002-12-25 TCD2560D Note 7: VDRK is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal voltage. Note 8: DC signal output voltage is defined as follows. Reset Noise Voltage is defined as follows. Note 9: Random noise is defined as the standard deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination (i.e. dark conditions) calculated by the following procedure. 1) Two adjacent pixels (pixel n and n + 1) in one reading are fixed as measurement points. 2) Each of the output level at video output periods averaged over 200ns period to get V (n) and V (n + 1). 3) V (n + 1) is subtracted from V (n) to get DV. DV = V (n) - V (n + 1) 4) The standard deviation of DV is calculated after procedure 2) and 3) are repeated 30 times (30 readings). DV = 1 30 å | DVi | 30 i = 1 s= 1 30 2 å (| DVi | - DV ) 30 i = 1 5) Procedure 2), 3) and 4) are repeated 10 times to get sigma value. 6) 10 sigma values are averaged. s= 1 10 å sj 10 j = 1 5 2002-12-25 TCD2560D 7) I value calculated using the above procedure is observed 2 times larger than that measured relative to the ground level. So we specify random noise as follows. ND s = 1 2 s Operating Condition Characteristics Symbol “H” level Clock pulse voltage VfA “L” level “H” level Shift pulse voltage VSH “L” level “H” level Reset pulse voltage VRS “L” level “H” level Clamp pulse voltage VCP “L” level Power supply voltage VOD Min Typ. Max Unit 4.5 5.0 5.5 0 0 0.3 VfA “H” - 0.5 VfA “H” VfA “H” 0 0 0.5 4.5 5.0 5.5 0 0 0.5 4.5 5.0 5.5 0 0 0.5 11.4 12.0 13.0 V Note V V (Note10) V V Note 10: VfA “H” means the high level voltage of VfA when SH pulse is high level. Clock Characteristics (Ta = 25°C) Characteristics Symbol Min Typ. Max Unit Clock pulse frequency ffA 0.3 1.0 6.0 MHz Reset pulse frequency fRS 0.3 1.0 6.0 MHz Clamp pulse frequency fCP 0.3 1.0 6.0 MHz Clock 1 capacitance (Note 11) Cf1 ¾ 190 300 pF Clock 2 capacitance (Note 11) Cf2 ¾ 160 300 pF Shift gate capacitance CSH ¾ 20 100 pF Reset gate capacitance CRS ¾ 10 40 pF Clamp gate capacitance CCP ¾ 10 40 pF Note 11: VOD = 12 V 6 2002-12-25 Timing Chart (bit clamp mode) 7 2002-12-25 TCD2560D Timing Chart (line clamp mode) 8 2002-12-25 TCD2560D TCD2560D Timing Requirements 9 2002-12-25 TCD2560D Timing Requirements Characteristics Typ. Symbol Min t1 120 1000 ¾ t5 800 1000 ¾ t2, t4 0 50 ¾ ns SH pulse width t3 3000 5000 ¾ ns Pulse timing of SH and CP t6 200 500 ¾ ns Pulse timing of SH and CP (line clamp mode) t7 10 100 ¾ ns f1, f2 pulse rise time, fall time t8, t9 0 50 ¾ ns RS pulse rise time, fall time t10, t11 0 20 ¾ ns RS pulse width t12 30 80 ¾ ns Pulse timing of RS and CP t13 10 20 ¾ ns Pulse timing of f1A, f2A and CP t14 0 20 ¾ ns t15, t16 0 20 ¾ ns t17 40 (3000) 80 (5000) ¾ ns t18 ¾ 35 ¾ 40 ¾ 60 Pulse timing of SH and f1 SH pulse rise time, fall time CP pulse rise time, fall time CP pulse width (Note 13) Reference level settle time (bit clamp mode) Video data delay time (Note 14) t19 Reference level settle time (line clamp mode) t20 (Note 12) Max 45 Unit ns ns (Note 16) 60 ns (Note 15) 70 ns (Note 16) Note 12: Typ. is the case of fRS = 1.0 MHz Note 13: Line clamp Mode inside ( ). Note 14: Load resistance is 100 kW Note 15: Typical settle time to about 1% of final value Note 16: Typical settle time to about 1% of the peak Clamp Mode Clamp Means CP Input Pulse Bit Clamp CP Pulse Line Clamp CP = SH or CP = DC 5 V 10 2002-12-25 TCD2560D Typical Spectral Response 11 2002-12-25 TCD2560D Typical Drive Circuit IC1, 2: TC74HC04AP TR1, 2, 3: 2SC1815-Y R1: 150 W R2: 1500 W 12 2002-12-25 TCD2560D Caution 1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. When handling the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. (1) Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. (2) Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. (3) Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Lead Frame Forming Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB. 5. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260°C, or within three seconds for lead temperatures of up to 350°C. 13 2002-12-25 TCD2560D Package Dimensions Note 1: Top of chip to bottom of package Note 2: Glass thickness (n = 1.5) Note 3: No.1 sensor element (S1) to center of No.1 pin. Weight: 4.5 g (typ.) 14 2002-12-25 TCD2560D RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 15 2002-12-25