FAIRCHILD MM74HC175M

Revised February 1999
MM74HC175
Quad D-Type Flip-Flop With Clear
General Description
The MM74HC175 high speed D-type flip-flop with complementary outputs utilizes advanced silicon-gate CMOS
technology to achieve the high noise immunity and low
power consumption of standard CMOS integrated circuits,
along with the ability to drive 10 LS-TTL loads.
Information at the D inputs of the MM74HC175 is transferred to the Q and Q outputs on the positive going edge of
the clock pulse. Both true and complement outputs from
each flip flop are externally available. All four flip-flops are
controlled by a common clock and a common CLEAR.
Clearing is accomplished by a negative pulse at the
CLEAR input. All four Q outputs are cleared to a logical “0”
and all four Q outputs to a logical “1.”
The 74HC logic family is functionally as well as pin-out
compatible with the standard 74LS logic family. All inputs
are protected from damage due to static discharge by internal diode clamps to VCC and ground.
Features
■ Typical propagation delay: 15 ns
■ Wide operating supply voltage range: 2–6V
■ Low input current: 1 µA maximum
■ Low quiescent supply current: 80 µA maximum (74HC)
■ High output drive current: 4 mA minimum (74HC)
Ordering Code:
Order Number
MM74HC175M
MM74HC175SJ
MM74HC175MTC
MM74HC175N
Package Number
Package Description
M16A
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
M16D
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MTC16
N16E
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Truth Table
(Each Flip-Flop)
Inputs
Outputs
Pin Assignments for DIP, SOIC, SOP and TSSOP
Clear
Clock
D
Q
Q
L
X
X
L
H
H
↑
H
H
L
H
↑
L
L
H
H
L
X
Q0
Q0
H = HIGH Level (steady state)
L = LOW Level (steady state)
X = Irrelevant
↑ = Transition from LOW-to-HIGH level
Q0 = The level of Q before the indicated steady-state input conditions were
established
Top View
© 1999 Fairchild Semiconductor Corporation
DS005319.prf
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MM74HC175 Quad D-Type Flip-Flop With Clear
September 1983
MM74HC175
Logic Diagram
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2
Recommended Operating
Conditions
−0.5 to +7.0V
Supply Voltage (VCC)
DC Input Voltage (VIN)
−1.5 to VCC +1.5V
DC Output Voltage (VOUT)
−0.5 to VCC +0.5V
Clamp Diode Current (IIK, IOK)
±20 mA
DC Output Current, per pin (IOUT)
±25 mA
Max
Units
2
6
V
0
VCC
V
−40
+85
°C
(tr, tf) VCC = 2.0V
1000
ns
VCC = 4.5V
500
ns
VCC = 6.0V
400
ns
DC Input or Output Voltage
(VIN,VOUT)
Operating Temperature Range (TA)
±50 mA
DC VCC or GND Current, per pin (ICC)
Storage Temperature Range (TSTG)
Min
Supply Voltage (VCC)
Input Rise or Fall Times
−65°C to +150°C
Power Dissipation (PD)
(Note 3)
600 mW
S.O. Package only
500 mW
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Lead Temperature (TL)
(Soldering 10 seconds)
DC Electrical Characteristics
Symbol
VIH
VIL
VOH
Parameter
Note 2: Unless otherwise specified all voltages are referenced to ground.
260°C
Conditions
Note 3: Power Dissipation temperature derating — plastic “N” package: −
12 mW/°C from 65°C to 85°C.
(Note 4)
VCC
TA = 25°C
Typ
TA = −40 to 85°C TA = −55 to 125°C
Guaranteed Limits
Units
Minimum HIGH Level
2.0V
1.5
1.5
1.5
Input Voltage
4.5V
3.15
3.15
3.15
V
V
6.0V
4.2
4.2
4.2
V
V
Maximum LOW Level
2.0V
0.5
0.5
0.5
Input Voltage
4.5V
1.35
1.35
1.35
V
6.0V
1.8
1.8
1.8
V
Minimum HIGH Level
VIN = VIH or VIL
Output Voltage
|IOUT| ≤ 20 µA
2.0V
2.0
1.9
1.9
1.9
V
4.5V
4.5
4.4
4.4
4.4
V
6.0V
6.0
5.9
5.9
5.9
V
|IOUT| ≤ 4.0 mA
4.5V
4.2
3.98
3.84
3.7
V
|IOUT| ≤ 5.2 mA
6.0V
5.7
5.48
5.34
5.2
V
VIN = VIH or VIL
VOL
Maximum LOW Level
VIN = VIH or VIL
Output Voltage
|IOUT| ≤ 20 µA
2.0V
0
0.1
0.1
0.1
V
4.5V
0
0.1
0.1
0.1
V
6.0V
0
0.1
0.1
0.1
V
|IOUT| ≤ 4.0 mA
4.5V
0.2
0.26
0.33
0.4
V
|IOUT| ≤ 5.2 mA
6.0V
0.2
0.26
0.33
0.4
V
VIN = VCC or GND
6.0V
±0.1
±1.0
±1.0
µA
6.0V
8
80
160
µA
VIN = VIH or VIL
IIN
Maximum Input
ICC
Maximum Quiescent
VIN = VCC or GND
Supply Current
IOUT = 0 µA
Current
Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
3
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MM74HC175
Absolute Maximum Ratings(Note 1)
(Note 2)
MM74HC175
AC Electrical Characteristics
VCC = 5V, TA = 25°C, CL = 15 pF, tr = tf = 6 ns
Symbol
fMAX
Parameter
Conditions
Guaranteed
Typ
Maximum Operating
Limit
Units
60
35
MHz
15
25
ns
13
21
ns
20
ns
Frequency
tPHL, tPLH
Maximum Propagation
Delay, Clock to Q or Q
tPHL, tPLH
Maximum Propagation
Delay, Reset to Q or Q
tREC
Minimum Removal
Time, Clear to Clock
tS
Minimum Setup Time, Data to Clock
20
ns
tH
Minimum Hold Time, Data from Clock
0
ns
tW
Minimum Pulse Width, Clock or Clear
16
ns
10
AC Electrical Characteristics
VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified)
Symbol
fMAX
Parameter
Conditions
VCC
TA = 25°C
Typ
TA = −40 to 85°C TA = −55 to 125°C
Units
Guaranteed Limits
Maximum Operating
2.0V
12
6
5
4
MHz
Frequency
4.5V
60
30
24
20
MHz
6.0V
70
35
28
24
MHz
tPHL, tPLH Maximum Propagation
2.0V
80
150
190
225
ns
Delay, Clock to Q or Q
4.5V
15
30
38
45
ns
6.0V
13
26
32
38
ns
tPHL, tPLH Maximum Propagation
2.0V
64
125
158
186
ns
Delay, Reset to Q or Q
4.5V
14
25
32
37
ns
6.0V
12
21
27
32
ns
tREM
tS
tH
tW
tr , tf
Minimum Removal Time
2.0V
100
125
150
ns
Clear to Clock
4.5V
20
25
30
ns
6.0V
17
21
25
ns
Minimum Setup Time
2.0V
100
125
150
ns
Data to Clock
4.5V
20
25
30
ns
6.0V
17
21
25
ns
Minimum Hold Time
2.0V
0
0
0
ns
Data from Clock
4.5V
0
0
0
ns
6.0V
0
0
0
ns
Minimum Pulse Width
2.0V
30
80
100
120
ns
Clear or Clock
4.5V
9
16
20
24
ns
6.0V
8
14
17
20
ns
Maximum Input Rise and
2.0V
1000
1000
1000
ns
4.5V
500
500
500
ns
400
400
400
ns
Fall Time
6.0V
tTLH, tTHL Maximum
CPD
2.0V
30
75
95
110
ns
Output Rise and
4.5V
9
15
19
22
ns
Fall Time
6.0V
8
13
16
19
Power Dissipation
Capacitance (Note 5)
CIN
150
(per package)
Maximum Input
5
ns
pF
10
10
10
pF
Capacitance
Note 5: CPD determines the no load dynamic power consumption, PD=CPD VCC2f+ICC VCC, and the no load dynamic current consumption,
IS=CPD VCC f+ICC.
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4
MM74HC175
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow
Package Number M16A
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M16D
5
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MM74HC175
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC16
www.fairchildsemi.com
6
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Package Number N16E
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SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
1. Life support devices or systems are devices or systems
device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the
sonably expected to cause the failure of the life support
body, or (b) support or sustain life, and (c) whose failure
device or system, or to affect its safety or effectiveness.
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
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user.
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
MM74HC175 Quad D-Type Flip-Flop With Clear
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)