Revised May 2005 MM74HCT273 Octal D-Type Flip-Flop with Clear General Description Features The MM74HCT273 utilizes advanced silicon-gate CMOS technology. It has an input threshold and output drive similar to LS-TTL with the low standby power of CMOS. ■ Typical propagation delay: 20 ns ■ Low quiescent current: 80 PA maximum (74HCT series) ■ Fanout of 10 LS-TTL loads These positive edge-triggered flip-flops have a common clock and clear-independent Q outputs. Data on a D input, having the specified set-up and hold time, is transferred to the corresponding Q output on the positive-going transition of the clock pulse. The asynchronous clear forces all outputs LOW when it is LOW. All inputs to this device are protected from damage due to electrostatic discharge by diodes to VCC and ground. MM74HCT devices are intended to interface TTL and NMOS components to CMOS components. These parts can be used as plug-in replacements to reduce system power consumption in existing designs. Ordering Code: Order Number Package Number Package Description MM74HCT273WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide MM74HCT273SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT273MTC MM74HCT273N MTC20 N20A 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagram Pin Assignments for DIP, SOIC, SOP and TSSOP Top View © 2005 Fairchild Semiconductor Corporation DS005760 www.fairchildsemi.com MM74HCT273 Octal D-Type Flip-Flop with Clear February 1984 MM74HCT273 Truth Table (Each Flip-Flop) Inputs Outputs Clear Clock D L X X L H n H H H n L L H L X Q0 H HIGH Level (steady-state) L LOW Level (steady-state) X Don’t Care n Transition from LOW-to-HIGH level Q0 The level of Q before the indicated steady-state input conditions were established. Logic Diagram www.fairchildsemi.com 2 Q Recommended Operating Conditions Supply Voltage (VCC) DC Input Voltage (VIN) DC Output Voltage (VOUT) Clamp Diode Current (IIK, IOK) DC Output Current, per Pin (IOUT) DC VCC or GND Current, per Pin (ICC) Storage Temperature Range (TSTG) 0.5V to 7.0V 1.5V to VCC 1.5V 0.5V to VCC 0.5V r20 mA r25 mA r50 mA 65qC to 150qC Supply Voltage (VCC) 600 mW S.O. Package only 500 mW Max Units 4.5 5.5 V 0 VCC V 40 85 qC 500 ns DC Input or Output Voltage (VIN, VOUT) Operating Temperature Range (TA) Input Rise or Fall Times (tr, tf) Power Dissipation (PD) (Note 3) Min Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power dissipation temperature derating—plastic “N” package: 12 mW/qC from 65qC to 85qC. Lead Temperature (TL) 260qC (Soldering, 10 seconds) DC Electrical Characteristics VCC 5V r 10% unless otherwise specified Symbol VIH Parameter TA Conditions 25qC Typ Minimum HIGH Level TA 40qC to 85qC TA 55qC to 125qC Guaranteed Limits Units 2.0 2.0 2.0 V 0.8 0.8 0.8 V Input Voltage VIL Maximum LOW Level Input Voltage VOH Minimum HIGH Level VIN Output Voltage |IOUT| 20 PA VCC VCC0.1 VCC0.1 VCC0.1 V |IOUT| 4.0 mA, VCC 4.5V 4.2 3.98 3.84 3.7 V 4.8 mA, VCC 5.5V 5.2 4.98 4.84 4.7 V |IOUT| VOL VIH or VIL Minimum LOW Level VIN Voltage |IOUT| 20 PA 0 0.1 0.1 0.1 V |IOUT| 4.0 mA, VCC 4.5V 0.2 0.26 0.33 0.4 V 4.8 mA, VCC 5.5V 0.2 0.26 0.33 0.4 V r0.1 r1.0 r1.0 PA 8 80 160 PA 0.6 0.8 0.9 mA |IOUT| VIH or VIL IIN Maximum Input VIN Current VIH or VIL ICC Maximum Quiescent VIN Supply Current IOUT VIN VCC or GND, VCC or GND 0 PA 2.4V or 0.5V (Note 4) Note 4: Measured per pin, all other inputs held at VCC or GND. 3 www.fairchildsemi.com MM74HCT273 Absolute Maximum Ratings(Note 1) (Note 2) MM74HCT273 AC Electrical Characteristics VCC 5V, TA 25qC, CL 15 pF, tr Symbol tf 6 ns Parameter Conditions Typ Guaranteed Limits Units fMAX Maximum Operating Frequency 68 30 tPHL, tPLH Maximum Propagation Delay from Clock to Q 18 30 MHz ns tPHL, tPLH Maximum Propagation Delay from Clear to Q 21 30 ns ns tREM Minimum Removal Time, Clear to Clock 1 5 tS Minimum Set-Up Time D to Clock 6 20 ns tH Minimum Hold Time Clock to D 3 5 ns tW Minimum Pulse Width Clock or Clear 10 16 ns AC Electrical Characteristics VCC 5.0V r 10%, CL Symbol 50 pF, tr Parameter tf 6 ns unless otherwise specified Conditions TA 25qC Typ fMAX Maximum Operating TA 40qC to 85qC TA 55qC to 125qC Units Guaranteed Limits 68 27 21 18 MHz 22 37 46 56 ns 25 35 44 52 ns 1 5 6 7 ns 6 20 25 30 ns 3 5 5 5 ns 10 16 25 30 ns 500 500 500 ns 15 19 22 ns Frequency tPHL, tPLH Maximum Propagation Delay from Clock to Q tPHL, tPLH Maximum Propagation Delay from Clear to Q tREM Minimum Removal Time Clear to Clock tS Minimum Set-Up Time D to Clock tH Minimum Hold Time Clock to D tW Minimum Pulse Width Clock or Clear tr , tf Maximum Input Rise and Fall Time, Clock tTHL, tTLH Maximum Output Rise 11 and Fall Time CPD Power Dissipation (Per Flip-Flop) 50 pF Capacitance (Note 5) CIN Maximum Input 6 10 10 10 Capacitance Note 5: CPD determines the no load dynamic power consumption, PD IS CPD VCC2 f ICC VCC, and the no load dynamic current consumption, CPD VCC2 f ICC. www.fairchildsemi.com 4 pF MM74HCT273 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B 5 www.fairchildsemi.com MM74HCT273 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D www.fairchildsemi.com 6 MM74HCT273 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 7 www.fairchildsemi.com MM74HCT273 Octal D-Type Flip-Flop with Clear Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Package Number N20A Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com www.fairchildsemi.com 8