19-1666; Rev 1; 10/03 30V Internal Switch LCD Bias Supply Features ♦ Adjustable Output Voltage up to 30V ♦ 20mA at 20V from a Single Li+ Battery ♦ 88% Efficiency ♦ Up to 500kHz Switching Frequency ♦ Selectable Inductor Current Limit (125mA, 250mA, or 500mA) ♦ 18µA Operating Supply Current ♦ 0.1µA Shutdown Current ♦ Avaiable in Two Small Packages 6-Pin TDFN 6-Pin SOT23 Ordering Information Applications LCD Bias Generators TEMP RANGE PART Cellular/Cordless Phones PINPACKAGE SOT MARK Palmtop Computers MAX1605EUT-T -40°C to +85°C 6 SOT23-6 AAHP Personal Digital Assistants (PDAs) MAX1605ETT-T -40°C to +85°C 6 TDFN ABW Organizers Handy Terminals Typical Operating Circuit L1 10µH VIN = 0.8V TO VOUT Pin Configuration TOP VIEW SHDN 1 VCC = 2.4V TO 5.5V 6 FB 5 4 SHDN 1 LIM VCC 2 LX GND 3 LX VCC VCC 2 MAX1605 MAX1605 GND 3 LIM FB SOT23 SHDN MAX1605 5 LIM 4 LX FB ON OFF 6 VOUT = VIN TO 30V TDFN 3mm ✕ 3mm GND ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX1605 General Description The MAX1605 boost converter contains a 0.5A internal switch in a tiny 6-pin SOT23 package. The IC operates from a +2.4V to +5.5V supply voltage, but can boost battery voltages as low as 0.8V up to 30V at the output. The MAX1605 uses a unique control scheme providing the highest efficiency over a wide range of load conditions. An internal 0.5A MOSFET reduces external component count, and a high switching frequency (up to 500kHz) allows for tiny surface-mount components. The current limit can be set to 500mA, 250mA, or 125mA, allowing the user to reduce the output ripple and component size in low-current applications. Additional features include a low quiescent supply current and a shutdown mode to save power. The MAX1605 is ideal for small LCD panels with low current requirements, but can also be used in other applications. A MAX1605EVKIT evaluation kit (EV kit) is available to help speed up design time. MAX1605 30V Internal Switch LCD Bias Supply ABSOLUTE MAXIMUM RATINGS VCC, FB, LIM, SHDN to GND....................................-0.3V to +6V LX to GND ..............................................................-0.3V to +32V Continuous Power Dissipation (TA = +70°C) 6-Pin SOT23 (derate 8.7mW/°C above +70°C) ...........696mW 6-Pin TDFN (derate 24.4mW/°C above +70°C) .........1951mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = SHDN = 3.3V, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage VCC (Note 2) 2.4 5.5 V Inductor Input Voltage Range VIN (Note 2) 0.8 VOUT V VCC falling, 50mV typical hysteresis 2.0 VCC Undervoltage Lockout VUVLO Quiescent Supply Current ICC Shutdown Supply Current 2.2 2.37 V VFB = 1.3V 18 35 µA SHDN = GND 0.1 1 µA VCC Line Regulation ∆VLNR VOUT = 18V, ILOAD = 1mA, VIN = 5V, VCC = VLIM = 2.4V to 5.5V 0.1 %/V VIN Line Regulation ∆VLNR VOUT = 18V, ILOAD = 1mA, VCC = VLIM = 5V, VIN = 2.4V to 12V 0.15 %/V Load Regulation ∆VLDR VOUT = 18V, VCC = VIN = VLIM = 5V, ILOAD = 0mA to 20mA 0.1 %/mA L1 = 100µH, VIN = 3.6V, ILOAD = 10mA 88 % Efficiency Feedback Set Point VFB Feedback Input Bias Current IFB 1.225 VFB = 1.3V 1.25 1.275 V 5 100 nA 30.5 V LX LX Voltage Range LX Switch Current Limit LX On-Resistance VLX ILX(MAX) RLX LX Leakage Current Maximum LX On-Time Minimum LX Off-Time 2 LIM = VCC 0.40 0.50 0.56 LIM = floating 0.20 0.25 0.285 LIM = GND 0.10 0.125 0.15 VCC = 5V, ILX = 100mA 0.8 VCC = 3.3V, ILX = 100mA Ω 1 2 2 µA 10 13 16 µs VFB > 1.1V 0.8 1.0 1.2 VFB < 0.8V (soft-start) 3.9 5.0 6.0 VLX = 30.5V tON tOFF A _______________________________________________________________________________________ µs 30V Internal Switch LCD Bias Supply (VCC = SHDN = 3.3V, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS CONTROL INPUTS VIH 2.4V ≤ VCC ≤ 5.5V SHDN Input Threshold VIL SHDN Input Bias Current ISHDN 0.8 × VCC 0.2 × VCC 2.4V ≤ VCC ≤ 5.5V VCC = 5.5V, V SHDN = 0 to 5.5V -1 LIM Input Low Level 2.4V ≤ VCC ≤ 5.5V LIM Input Float Level 2.4V ≤ VCC ≤ 5.5V, ILIM = ±0.5µA (VCC / 2) 0.2V LIM Input High Level 2.4V ≤ VCC ≤ 5.5V VCC - 0.4V LIM Input Bias Current ILIM SHDN = VCC, LIM = GND or VCC 1 µA 0.4 V (VCC / 2) + 0.2V V V -2 SHDN = GND V 2 0.1 1 µA ELECTRICAL CHARACTERISTICS (VCC = SHDN = 3.3V, TA = -40°C to +85°C, unless otherwise noted.) (Note 1) MIN MAX Supply Voltage PARAMETER SYMBOL VCC (Note 2) 2.4 5.5 V Inductor Input Voltage Range VIN (Note 2) 0.8 VOUT V VCC falling, 50mV typical hysteresis 2.0 VCC Undervoltage Lockout VUVLO Quiescent Supply Current ICC Shutdown Supply Current Feedback Set Point VFB Feedback Input Bias Current IFB CONDITIONS UNITS 2.37 V VFB = 1.3V 35 µA SHDN = GND 1 µA 1.215 VFB = 1.3V 1.285 V 100 nA 30.5 V LX LX Voltage Range VLX LX Switch Current Limit LX On-Resistance ILX(MAX) RLX LX Leakage Current Maximum LX On-Time Minimum LX Off-Time LIM = VCC 0.35 0.58 LIM = floating 0.18 0.30 LIM = GND 0.08 0.17 VCC = 3.3V, ILX = 100mA 2 Ω VLX = 30.5V 2 µA µs tON tOFF A 9 17 VFB > 1.1V 0.75 1.25 VFB < 0.8V 3.8 6.0 µs CONTROL INPUTS VIH 2.4V ≤ VCC ≤ 5.5V VIL 2.4V ≤ VCC ≤ 5.5V SHDN Input Threshold SHDN Input Bias Current ISHDN VCC = 5.5V, VSHDN = 0 to 5.5V 0.8 × VCC 0.2 × VCC -1 1 V µA _______________________________________________________________________________________ 3 MAX1605 ELECTRICAL CHARACTERISTICS (continued) ELECTRICAL CHARACTERISTICS (continued) (VCC = SHDN = 3.3V, TA = -40°C to +85°C, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN LIM Input Low Level 2.4V ≤ VCC ≤ 5.5V LIM Input Float Level 2.4V ≤ VCC ≤ 5.5V, ILIM = ±0.5µA (VCC / 2) - 0.25V LIM Input High Level 2.4V ≤ VCC ≤ 5.5V VCC - 0.4V -2 LIM Input Bias Current SHDN = VCC, LIM = GND or VCC ILIM MAX UNITS 0.4 V (VCC / 2) + 0.25V V V 2 SHDN = GND µA 1 Note 1: All devices are 100% tested at TA = +25°C. All limits over the temperature range are guaranteed by design. Note 2: The MAX1605 requires a supply voltage between +2.4V and +5.5V; however, the input voltage used to power the inductor can vary from +0.8V to VOUT. Typical Operating Characteristics (VCC = 3.3V, VIN = 3.6V, L1 = 10µH, SHDN = LIM = VCC, VOUT(NOM) = 18V (Figure 3), TA = +25°C, unless otherwise noted.) 17.9 IOUT = 1mA 17.8 20.7 20.5 IOUT = 1mA 20.1 19.9 17.7 2.5 3.0 3.5 4.0 4.5 5.0 0 5.5 3 6 9 MAX1605 toc03 18.0 17.9 17.8 LIM = GND (125mA) 17.7 LIM = OPEN (250mA) 17.5 17.4 0 12 5 10 15 20 SUPPLY VOLTAGE (V) INPUT VOLTAGE (V) LOAD CURRENT (mA) EFFICIENCY vs. SUPPLY VOLTAGE (L1 = 10µH) EFFICIENCY vs. INPUT VOLTAGE (L1 = 10µH) EFFICIENCY vs. LOAD CURRENT (L1 = 10µH) 76 74 IOUT = 1mA VIN80= 3.6V ILIM = 500mA 72 IOUT = 1mA 60 50 VCC = 3.3V ILIM = 500mA 2.5 3.0 3.5 4.0 4.5 SUPPLY VOLTAGE (V) 5.0 5.5 76 74 LIM = OPEN (250mA) 72 70 68 LIM = VCC (500mA) LIM = GND (125mA) 64 62 30 70 78 66 40 25 MAX1605 toc06 80 70 80 MAX1605 toc05 IOUT = 5mA EFFICIENCY (%) IOUT = 10mA IOUT = 5mA 78 90 MAX1605 toc04 80 2.0 18.1 17.6 19.5 2.0 LIM = VCC (500mA) 18.2 VCC = 3.3V LIM = VCC (500mA) 19.7 17.6 4 MAX1605 toc02 20.9 20.3 18.3 OUTPUT VOLTAGE (V) IOUT = 5mA IOUT = 5mA 21.1 18.4 EFFICIENCY (%) OUTPUT VOLTAGE (V) 18.0 21.3 OUTPUT VOLTAGE (V) VIN = 3.6V LIM = VCC (500mA) 18.1 21.5 MAX1605 toc01 18.2 OUTPUT VOLTAGE vs. LOAD CURRENT OUTPUT VOLTAGE vs. INPUT VOLTAGE OUTPUT VOLTAGE vs. SUPPLY VOLTAGE EFFICIENCY (%) MAX1605 30V Internal Switch LCD Bias Supply 60 0 3 6 INPUT VOLTAGE (V) 9 12 0 5 10 15 LOAD CURRENT (mA) _______________________________________________________________________________________ 20 25 30V Internal Switch LCD Bias Supply EFFICIENCY vs. LOAD CURRENT (L1 = 100µH) 88 80 78 LIM = VCC (500mA) LIM = GND 5 10 15 20 100 0 25 5 10 15 20 25 LOAD CURRENT (mA) LOAD CURRENT (mA) CURRENT LIMIT vs. INPUT VOLTAGE SUPPLY CURRENT vs. SUPPLY VOLTAGE (NO-LOAD) 400 LIM = OPEN 300 200 20 0 3 6 9 15 10 2 3 4 5 0 5 10 15 20 25 LOAD CURRENT (mA) SHUTDOWN WAVEFORM MAX1605 toc15 IOUT 10mA/div 4V 10mA 18.1V 18.1V 17.9V VOUT 100mV/div A 2V/div 0 2V 2V 0 500mA 250mA 0 IL1 500mA/div B 100mV/div 18V 17.9V LIM = VCC (500mA) MAX1605 toc14 6V 18 1.0 0 1 MAX1605 toc13 4V 5.5 1.5 LOAD TRANSIENT LINE TRANSIENT 5.0 LIM = OPEN (250mA) 2.0 SUPPLY VOLTAGE (V) INPUT VOLTAGE (V) 4.5 0.5 0 12 4.0 LIM = GND (125mA) 2.5 0 100 3.5 SUPPLY CURRENT vs. LOAD CURRENT 5 LIM = GND 3.0 3.0 SUPPLY CURRENT (mA) 500 SUPPLY CURRENT (µA) LIM = VCC 2.5 SUPPLY VOLTAGE (V) 25 MAX1605 toc10 600 2.0 MAX1605 toc11 0 LIM = OPEN 200 74 74 CURRENT LIMIT (mA) LIM = VCC (500mA) 76 300 VSHDN 2V/div 76 80 400 IL1 250mA/div 78 82 MAX1605 toc12 LIM = GND (125mA) 82 LIM = GND (125mA) 84 LIM = VCC 500 500mA 0 20V VOUT 10V/div 84 EFFICIENCY (%) EFFICIENCY (%) LIM = OPEN (250mA) LIM = OPEN (250mA) CURRENT LIMIT (mA) 86 86 600 MAX1605 toc08 88 CURRENT LIMIT vs. SUPPLY VOLTAGE 90 MAX1605 toc07 90 MAX1605 toc09 EFFICIENCY vs. LOAD CURRENT (L1 = 47µH) 10V 0 200µs/div A: VIN = VCC = 2.4V TO 5.5V B: VOUT = 18V, ROUT = 3.6kΩ 40µs/div VOUT = 18V, IOUT = 1mA TO 10mA VCC = 3.3V, VIN = 3.6V 200µs/div VOUT = 18V, ROUT = 1.8kΩ VCC = 3.3V, VIN = 3.6V _______________________________________________________________________________________ 5 MAX1605 Typical Operating Characteristics (continued) (VCC = 3.3V, VIN = 3.6V, L1 = 10µH, SHDN = LIM = VCC, VOUT(NOM) = 18V (Figure 3), TA = +25°C, unless otherwise noted.) 30V Internal Switch LCD Bias Supply MAX1605 Pin Description PIN NAME FUNCTION 1 SHDN 2 VCC IC Supply Voltage (+2.4V to +5.5V). Bypass VCC to GND with a 0.1µF or greater capacitor. 3 GND Ground 4 LX Inductor Connection. The drain of an internal 30V N-channel MOSFET. LX is high impedance in shutdown. 5 LIM Inductor Current Limit Selection. Connect LIM to VCC for 500mA, leave LIM floating for 250mA, or connect LIM to GND for 125mA. 6 FB Feedback Input. Connect to a resistive-divider network between the output (VOUT) and FB to set the output voltage between VIN and 30V. The feedback threshold is 1.25V. Active-Low Shutdown Input. A logic low shuts down the device and reduces the supply current to 0.1µA. Connect SHDN to VCC for normal operation. L1 10µH VIN = 0.8V TO VOUT VOUT = VIN TO 30V LX COUT CFF VCC = 2.4V TO 5.5V CONTROL LOGIC N VCC LIM CURRENT LIMIT R1 SHUTDOWN LOGIC SHDN ON FB ERROR AMPLIFIER OFF R2 1.25V GND MAX1605 Figure 1. Functional Diagram Detailed Description The MAX1605 compact, step-up DC-DC converter operates from a +2.4V to +5.5V supply. Consuming only 18µA of supply current, the device includes an internal switching MOSFET with 1Ω on-resistance and selectable current limit (Figure 1). During startup, the MAX1605 extends the minimum off-time, limiting initial surge current. The MAX1605 also features a shutdown mode. 6 Control Scheme The MAX1605 features a minimum off-time, current-limited control scheme. The duty cycle is governed by a pair of one-shots that set a minimum off-time and a maximum on-time. The switching frequency can be up to 500kHz and depends upon the load and input voltage. The peak current limit of the internal N-channel MOSFET is pin selectable and may be set at 125mA, 250mA, or 500mA (Figure 2). _______________________________________________________________________________________ 30V Internal Switch LCD Bias Supply VCC (2.4V TO 5.5V) VCC VCC MAX1605 LIM VCC MAX1605 NO CONNECTION GND IPEAK = 500mA MAX1605 VCC (2.4V TO 5.5V) VCC (2.4V TO 5.5V) MAX1605 LIM LIM GND GND IPEAK = 250mA IPEAK = 125mA Figure 2. Setting the Peak Inductor Current Limit Setting the Output Voltage (FB) Separate/Same Power for L1 and VCC Adjust the output voltage by connecting a voltagedivider from the output (VOUT) to FB (Figure 3). Select R2 between 10kΩ to 200kΩ. Calculate R1 with the following equation: Separate voltage sources can supply the inductor (VIN) and the IC (VCC). This allows operation from low-voltage batteries as well as high-voltage sources (0.8V to 30V) because chip bias is provided by a logic supply (2.4V to 5.5V), while the output power is sourced directly from the battery to L1. Conversely, VIN and VCC can also be supplied from one supply if it remains within V CC’s operating limits (+2.4V to +5.5V). R1 = R2 [(VOUT / VFB) – 1] where VFB = 1.25V and VOUT may range from VIN to 30V. The input bias current of FB has a maximum value of 100nA, which allows large-value resistors to be used. For less than 1% error, the current through R2 should be greater than 100 times the feedback input bias current (IFB). Current Limit Select Pin (LIM) The MAX1605 allows a selectable inductor current limit of 125mA, 250mA, or 500mA (Figure 2). This allows flexibility in designing for higher current applications or for smaller, compact designs. The lower current limit allows the use of a physically smaller inductor in spacesensitive, low-power applications. Connect LIM to VCC for 500mA, leave floating for 250mA, or connect to GND for 125mA. Shutdown (SHDN) Pull SHDN low to enter shutdown. During shutdown, the supply current drops to 0.1µA and LX enters a highimpedance state. However, the output remains connected to the input through the inductor and output rectifier, holding the output voltage to one diode drop below VIN when the MAX1605 is shut down. The capacitance and load at OUT determine the rate at which V OUT decays. SHDN can be pulled as high as 6V, regardless of the input and output voltages. L1 10µH VIN = 0.8V TO VOUT CIN 10µF VCC = 2.4V TO 5.5V D1 C1 0.1µF VOUT = 18V LX VCC R1 2.2MΩ MAX1605 LIM CFF 10pF COUT 1µF FB R2 165kΩ ON OFF SHDN GND Figure 3. Typical Application Circuit _______________________________________________________________________________________ 7 MAX1605 30V Internal Switch LCD Bias Supply Design Procedure Inductor Selection Smaller inductance values typically offer smaller physical size for a given series resistance or saturation current. Circuits using larger inductance values may start up at lower input voltages and exhibit less ripple, but also provide reduced output power. This occurs when the inductance is sufficiently large to prevent the maximum current limit from being reached before the maximum on-time expires. The inductor’s saturation current rating should be greater than the peak switching current. However, it is generally acceptable to bias the inductor into saturation by as much as 20%, although this will slightly reduce efficiency. Picking the Current Limit The peak LX current limit (ILX(MAX)) required for the application may be calculated from the following equation: ILX(MAX) ≥ ( ) VOUT − VIN(MIN) × t OFF(MIN) VOUT × IOUT(MAX) + VIN(MIN) 2×L where tOFF(MIN) = 0.8µs, and VIN(MIN) is the minimum voltage used to supply the inductor. The set current limit must be greater than this calculated value. Select the appropriate current limit by connecting LIM to VCC, GND, or leaving it unconnected (see the Current Limit Select Pin (LIM) section and Figure 2). Diode Selection The high maximum switching frequency of 500kHz requires a high-speed rectifier. Schottky diodes, such as the Motorola MBRS0530 or the Nihon EP05Q03L, are recommended. To maintain high efficiency, the average current rating of the Schottky diode should be greater than the peak switching current. Choose a reverse breakdown voltage greater than the output voltage. Output Filter Capacitor For most applications, use a small ceramic surfacemount output capacitor, 1µF or greater. For small ceramic capacitors, the output ripple voltage is dominated by the capacitance value. If tantalum or electrolytic capacitors are used, the higher ESR increases the output ripple voltage. Decreasing the ESR reduces the output ripple voltage and the peak-to-peak transient voltage. Surface-mount capacitors are generally preferred because they lack the inductance and resistance of their through-hole equivalents. 8 Input Bypass Capacitor Two inputs, VCC and VIN, require bypass capacitors. Bypass VCC with a 0.1µF ceramic capacitor as close to the IC as possible. The input supplies high currents to the inductor and requires local bulk bypassing close to the inductor. A 10µF low-ESR surface-mount capacitor is sufficient for most applications. PC Board Layout and Grounding Careful printed circuit layout is important for minimizing ground bounce and noise. Keep the MAX1605’s ground pin and the ground leads of the input and output capacitors less than 0.2in (5mm) apart. In addition, keep all connections to FB and LX as short as possible. In particular, when using external feedback resistors, locate them as close to FB as possible. To minimize output voltage ripple, and to maximize output power and efficiency, use a ground plane and solder GND directly to the ground plane. Refer to the MAX1605EVKIT evaluation kit for a layout example. Applications Information Negative Voltage for LCD Bias The MAX1605 can also generate a negative output by adding a diode-capacitor charge-pump circuit (D1, D2, and C3) to the LX pin as shown in Figure 4. Feedback is still connected to the positive output, which is not loaded, allowing a very small capacitor value at C4. For best stability and lowest ripple, the time constant of the R1-R2 series combination and C4 should be near or less than that of C2 and the effective load resistance. Output load regulation of the negative output is somewhat looser than with the standard positive output circuit, and may rise at very light loads due to coupling through the capacitance of D2. If this is objectionable, reduce the resistance of R1 and R2, while maintaining their ratio, to effectively preload the output with a few hundred microamps. This is why the R1-R2 values shown in Figure 3 are about 10-times lower than typical values used for a positive-output design. When loaded, the negative output voltage will be slightly lower (closer to ground by approximately a diode forward voltage) than the inverse of the voltage on C4. Output Disconnected in Shutdown When the MAX1605 is shut down, the output remains connected to the input (Figure 3), so the output voltage falls to approximately V IN - 0.6V (the input voltage minus a diode drop). For applications that require output isolation during shutdown, add an external PNP transistor as shown in Figure 4. When the MAX1605 is active, the voltage set at the transistor’s emitter exceeds the input voltage, forcing the transistor into the _______________________________________________________________________________________ 30V Internal Switch LCD Bias Supply VCC = 2.4V TO 5.5V R3 1Ω C3 0.1µF D1* D2* C5 1µF MAX1605 L1 10µH VIN = 0.8V TO VOUT VNEG -19V C2 1µF D3** LX VCC C6 0.1µF R1 240kΩ MAX1605 LIM C1 1000pF C4 0.01µF FB R2 16.5kΩ ON OFF SHDN GND *D1, D2 = CENTRAL SEMICONDUCTOR CMPD7000 DUAL **D3 = CENTRAL SEMICONDUCTOR CMSD4448 (1N4148) Figure 4. Negative Voltage for LCD Bias saturation region. When shut down, the input voltage exceeds the emitter voltage so the inactive transistor provides high-impedance isolation between the input and output. Efficiency will be slightly degraded due to the PNP transistor saturation voltage and base current. L1 10µH VIN = 0.8V TO VOUT VSET = 18.3V (VOUT + 0.3V) LX VOUT = 18V 2N2907A R1 MAX1605 LIM TRANSISTOR COUNT: 2329 R3 = 180kΩ VCC = 2.4V TO 5.5V VCC Chip Information FB R2 ON SHDN GND OFF Figure 5. Output Disconnected in Shutdown _______________________________________________________________________________________ 9 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 6LSOT.EPS MAX1605 30V Internal Switch LCD Bias Supply PACKAGE OUTLINE, SOT-23, 6L 21-0058 10 ______________________________________________________________________________________ F 1 1 30V Internal Switch LCD Bias Supply 6, 8, &10L, QFN THIN.EPS L A D D2 A2 PIN 1 ID 1 N 1 C0.35 b E PIN 1 INDEX AREA [(N/2)-1] x e REF. E2 DETAIL A e k A1 CL CL L L e e A DALLAS SEMICONDUCTOR PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, 6, 8 & 10L, TDFN, EXPOSED PAD, 3x3x0.80 mm NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY APPROVAL DOCUMENT CONTROL NO. 21-0137 REV. 1 D ______________________________________________________________________________________ 2 11 MAX1605 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) MAX1605 30V Internal Switch LCD Bias Supply Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) COMMON DIMENSIONS SYMBOL A MIN. MAX. 0.70 0.80 D 2.90 3.10 E 2.90 3.10 A1 0.00 0.05 L k 0.20 0.40 0.25 MIN. A2 0.20 REF. PACKAGE VARIATIONS PKG. CODE N D2 E2 e JEDEC SPEC b T633-1 6 1.50–0.10 2.30–0.10 0.95 BSC MO229 / WEEA 0.40–0.05 1.90 REF T833-1 8 1.50–0.10 2.30–0.10 0.65 BSC MO229 / WEEC 0.30–0.05 1.95 REF T1033-1 10 1.50–0.10 2.30–0.10 0.50 BSC MO229 / WEED-3 0.25–0.05 2.00 REF [(N/2)-1] x e DALLAS SEMICONDUCTOR PROPRIETARY INFORMATION TITLE: PACKAGE OUTLINE, 6, 8 & 10L, TDFN, EXPOSED PAD, 3x3x0.80 mm APPROVAL DOCUMENT CONTROL NO. 21-0137 REV. D 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.