ETC X24128Z-2.5

Recommended System Management
Alternative: X4283
X24128
128K
16K x 8 Bit
400kHz 2-Wire Serial EEPROM with Block Lock™
FEATURES
DESCRIPTION
• Save critical data with programmable block lock
protection
—Block lock (0, 1/4, 1/2, or all of EEPROM array)
—Software write protection
—Programmable hardware write protect
• In circuit programmable ROM mode
• 400kHz 2-wire serial interface
—Schmitt trigger input noise suppression
—Output slope control for ground bounce noise
elimination
• Longer battery life with lower power
—Active read current less than 1mA
—Active write current less than 3mA
—Standby current less than 1µA
• 2.5V to 5.5V power supply version
• 32 word page write mode
—Minimizes total write time per word
• Internally organized 16K x 8
• Bidirectional data transfer protocol
• Self-timed write cycle
—Typical write cycle time of 5ms
• High reliability
—Endurance: 100,000 cycles
—Data retention: 100 years
• 8-lead XBGA
• 14-lead SOIC
The X24128 is a CMOS Serial EEPROM, internally
organized 16K x 8. The device features a serial interface and software protocol allowing operation on a
simple two wire bus.
Three device select inputs (S0–S2) allow up to eight
devices to share a common two wire bus.
A Write Protect Register at the highest address location,
FFFFh, provides three write protection features: Software Write Protect, Block Lock Protect, and Programmable Hardware Write Protect. The software write
protect feature prevents any nonvolatile writes to the
device until the WEL bit in the write protect register is
set. The Block Lock protection feature gives the user
four array block protect options, set by programming two
bits in the write protect register. The programmable
hardware write protect feature allows the user to install
the device with WP tied to VCC, write to and Block Lock
the desired portions of the memory array in circuit, and
then enable the In Circuit Programmable ROM Mode by
programming the WPEN bit HIGH in the Write Protect
Register. After this, the Block Locked portions of the
array, including the Write Protect Register itself, are permanently protected from being erased.
Xicor EEPROMs are designed and tested for applications requiring extended endurance. Inherent data
retention is greater than 100 years.
BLOCK DIAGRAM
Data Register
Serial EEPROM Data
and Address (SDA)
SCL
Y Decode Logic
Command
Decode
and
Control
Logic
Page
Decode
Logic
4k X 8
Block Lock and
Write Protect
Control Logic
S2
S1
S0
4k X 8
Write
Protect
Register
Device
Select
Logic
8k X 8
Write Voltage
Control
WP
REV 1.1 9/8/00
Serial Eeprom
Array
16k X 8
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Characteristics subject to change without notice.
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X24128
PIN DESCRIPTIONS
PIN CONFIGURATION
Serial Clock (SCL)
The SCL input is used to clock all data into and out of
the device.
8-Lead XBGA: Top View
Serial Data (SDA)
SDA is a bidirectional pin used to transfer data into and
out of the device. It is an open drain output and may be
wire-ORed with any number of open drain or open collector outputs.
S1
NC
NC
NC
S2
VSS
Device Select (S0, S1, S2)
Write Protect (WP)
The Write Protect input controls the Hardware Write
Protect feature. When held LOW, Hardware Write Protection is disabled. When this input is held HIGH, and
the WPEN bit in the Write Protect Register is set HIGH,
the Write Protect Register is protected, preventing
changes to the Block Lock protection and WPEN bits.
PIN NAMES
Symbol
Description
S0, S1, S2
Device Select Inputs
SDA
Serial Data
SCL
Serial Clock
WP
Write Protect
VSS
Ground
VCC
Supply Voltage
NC
No Connect
REV 1.1 9/8/00
8 S1
VCC 2
7 S0
SDA 3
6 VSS
SCL 4
5
S2
14 Lead SOIC
S0
An open drain output requires the use of a pull-up
resistor. For selecting typical values, refer to the Pullup resistor selection graph at the end of this data
sheet.
The device select inputs (S0, S1, S2) are used to set
the first three bits of the 8-bit slave address. This
allows up to eight devices to share a common bus.
These inputs can be static or actively driven. If used
statically they must be tied to VSS or VCC as appropriate. If actively driven, they must be driven with CMOS
levels (driven to VCC or VSS).
WP 1
1
2
3
4
5
6
7
14
13
12
X24128
11
10
9
8
VCC
WP
NC
NC
NC
SCL
SDA
DEVICE OPERATION
The device supports a bidirectional bus oriented protocol. The protocol defines any device that sends data
onto the bus as a transmitter, and the receiving device
as the receiver. The device controlling the transfer is a
master and the device being controlled is the slave.
The master will always initiate data transfers, and provide the clock for both transmit and receive operations.
Therefore, the device will be considered a slave in all
applications.
Clock and Data Conventions
Data states on the SDA line can change only during
SCL LOW. SDA state changes during SCL HIGH are
reserved for indicating start and stop conditions. Refer
to Figures 1 and 2.
Start Condition
All commands are preceded by the start condition,
which is a HIGH to LOW transition of SDA when SCL is
HIGH. The device continuously monitors the SDA and
SCL lines for the start condition and will not respond to
any command until this condition has been met.
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Characteristics subject to change without notice.
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X24128
Figure 1. Data Validity
SCL
SDA
Data Stable
Data
Change
Figure 2. Definition of Start and Stop
SCL
SDA
START Bit
STOP Bit
Stop Condition
All communications must be terminated by a stop condition, which is a LOW to HIGH transition of SDA when
SCL is HIGH. The stop condition is also used to place
the device into the standby power mode after a read
sequence. A stop condition can only be issued after
the transmitting device has released the bus.
Acknowledge
Acknowledge is a software convention used to indicate
successful data transfer. The transmitting device, either
master or slave, will release the bus after transmitting
eight bits. During the ninth clock cycle the receiver will
pull the SDA line LOW to acknowledge that it received
the eight bits of data. Refer to Figure 3.
REV 1.1 9/8/00
The device will respond with an acknowledge after recognition of a start condition and its slave address. If
both the device and a write operation have been
selected, the device will respond with an acknowledge
after the receipt of each subsequent 8-bit word.
In the read mode the device will transmit eight bits of
data, release the SDA line and monitor the line for an
acknowledge. If an acknowledge is detected and no
stop condition is generated by the master, the device
will continue to transmit data. If an acknowledge is not
detected, the device will terminate further data transmissions. The master must then issue a stop condition
to return the device to the standby power mode and
place the device into a known state.
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Characteristics subject to change without notice.
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X24128
Figure 3. Acknowledge Response From Receiver
SCL from
Master
1
8
9
Data Output
from Transmitter
Data Output
from Receiver
START
Acknowledge
DEVICE ADDRESSING
Figure 4. Device Addressing
Following a start condition, the master must output the
address of the slave it is accessing. The first four bits of
the Slave Address Byte are the device type identifier
bits. These must equal “1010”. The next 3 bits are the
device select bits S0, S1, and S2. This allows up to 8
devices to share a single bus. These bits are compared
to the S0, S1, and S2 device select input pins. The last
bit of the Slave Address Byte defines the operation to
be performed. When the R/W bit is a one, then a read
operation is selected. When it is zero then a write operation is selected. Refer to Figure 4. After loading the
Slave Address Byte from the SDA bus, the device compares the device type bits with the value “1010” and the
device select bits with the status of the device select
input pins. If the compare is not successful, no
acknowledge is output during the ninth clock cycle and
the device returns to the standby mode.
The word address is either supplied by the master or
obtained from an internal counter, depending on the
operation. The master must supply the two Word
Address Bytes as shown in Figure 4.
The internal organization of the E2 array is 512 pages
by 32 bytes per page. The page address is partially contained in the Word Address Byte 1 and partially in bits 7
through 5 of the Word Address Byte 0. The byte address
is contained in bits 4 through 0 of the Word Address
Byte 0. See Figure 4.
REV 1.1 9/8/00
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Device Type
Identifier
1
0
1
Device
Select
0
S2
S1
S0
R/W
Slave Address Byte
High Order Word Address
0
0
A13 A12
A11 A10
A9
A8
X24128 Word Address Byte 1
Low Order Word Address
A7
A6
A5
A4
A3
A2
A1
A0
D1
D0
Word Address Byte 0
D7
D6
D5
D4
D3
D2
Data Byte
Characteristics subject to change without notice.
4 of 16
X24128
WRITE OPERATIONS
Byte Write
For a write operation, the device requires the Slave
Address Byte, the Word Address Byte 1, and the Word
Address Byte 0, which gives the master access to any
one of the words in the array. Upon receipt of the Word
Address Byte 0, the device responds with an acknowledge, and waits for the first eight bits of data. After
receiving the 8 bits of the data byte, the device again
responds with an acknowledge. The master then terminates the transfer by generating a stop condition, at
which time the device begins the internal write cycle to
the nonvolatile memory. While the internal write cycle
is in progress the device inputs are disabled and the
device will not respond to any requests from the master.
The SDA pin is at high impedance. See Figure 5.
Page Write
The device is capable of a thirty-two byte page write operation. It is initiated in the same manner as the byte write
operation; but instead of terminating the write operation
after the first data word is transferred, the master can
transmit up to thirty-one more words. The device will
respond with an acknowledge after the receipt of each
word, and then the byte address is internally incremented
by one. The page address remains constant. When the
counter reaches the end of the page, it “rolls over” and
goes back to the first byte of the current page. This
means that the master can write 32 words to the page
beginning at any byte. If the master begins writing at byte
16, and loads 32 words, then the first 16 words are written to bytes 16 through 31, and the last 16 words are written to bytes 0 through 15. Afterwards, the address
counter would point to byte 16. If the master writes more
than 32 words, then the previously loaded data is overwritten by the new data, one byte at a time.
The master terminates the data byte loading by issuing
a stop condition, which causes the device to begin the
nonvolatile write cycle. As with the byte write operation, all inputs are disabled until completion of the internal write cycle. Refer to Figure 6 for the address,
acknowledge, and data transfer sequence.
Figure 5. Byte Write Sequence
Signals from
the Master
SDA Bus
S
T
A
R
T
Word Address
Byte 1
Slave
Address
S1010
S
T
O
P
Data
0
P
A
C
K
Signals from
the Slave
Word Address
Byte 0
A
C
K
A
C
K
A
C
K
Figure 6. Page Write Sequence
(0 ≤ n ≤ 31)
Signals from
the Master
SDA Bus
Signals from
the Slave
REV 1.1 9/8/00
S
T
A
R
T
Word Address
Byte 1
Slave
Address
S 1010
Word Address
Byte 0
Data
(0)
Data
(n)
S
T
O
P
P
0
A
C
K
A
C
K
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A
C
K
A
C
K
A
C
K
Characteristics subject to change without notice.
5 of 16
X24128
Acknowledge Polling
The maximum write cycle time can be significantly
reduced using Acknowledge Polling. To initiate
Acknowledge Polling, the master issues a start condition followed by the Slave Address Byte for a write or
read operation. If the device is still busy with the internal write cycle, then no ACK will be returned. If the
device has completed the internal write operation, an
ACK will be returned, and the host can then proceed
with the read or write operation. Refer to Figure 7.
Figure 7. Acknowledge Polling Sequence
Byte LoAd Completed
By Issuing Stop.
Enter ACK Polling
Issue Slave
Address Byte
(Read or Write)
Issue STOP
No
Yes
High
Voltage
Cycle Complete.
Continue
Sequence?
Current Address Read
Internally, the device contains an address counter that
maintains the address of the last word read or written
incremented by one. After a read operation from the
last address in the array, the counter will “roll over” to
the first address in the array. After a write operation to
the last address in a given page, the counter will “roll
over” to the first address on the same page.
It should be noted that the ninth clock cycle of the read
operation is not a “don’t care.” To terminate a read
operation, the master must either issue a stop condition during the ninth cycle or hold SDA HIGH during
the ninth clock cycle and then issue a stop condition.
Figure 8. Current Address Read Sequence
Signals from
the Master
No
SDA Bus
Yes
Continue Normal
Read or Write
Command Sequence
Read operations are initiated in the same manner as
write operations with the exception that the R/W bit of
the Slave Address Byte is set to one. There are three
basic read operations: Current Address Reads, Random Reads, and Sequential Reads.
Upon receipt of the Slave Address Byte with the R/W bit
set to one, the device issues an acknowledge and then
transmits the eight bits of the Data Byte. The master terminates the read operation when it does not respond
with an acknowledge during the ninth clock, and then
issues a stop condition. Refer to Figure 8 for the
address, acknowledge, and data transfer sequence.
Issue
START
ACK
Returned?
READ OPERATIONS
Signals from
the Slave
S
T
A
R
T
S
T
O
P
Slave
Address
S 1 0 1 0
1
P
A
C
K
Data
Issue STOP
PROCEED
REV 1.1 9/8/00
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Characteristics subject to change without notice.
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X24128
Random Read
Random read operation allows the master to access
any memory location in the array. Prior to issuing the
Slave Address Byte with the R/W bit set to one, the
master must first perform a “Dummy” write operation.
The master issues the start condition and the Slave
Address Byte with the R/W bit low, receives an
acknowledge, then issues the Word Address Byte 1,
receives another acknowledge, then issues the Word
Address Byte 0. After the device acknowledges receipt
of the Word Address Byte 0, the master issues another
start condition and the Slave Address Byte with the R/
W bit set to one. This is followed by an acknowledge
and then eight bits of data from the device. The master
terminates the read operation by not responding with
an acknowledge, and then issuing a stop condition.
Refer to Figure 9 for the address, acknowledge, and
data transfer sequence.
The device will perform a similar operation called “Set
Current Address” if a stop is issued instead of the second start shown in Figure 9. The device will go into
standby mode after the stop and all bus activity will be
ignored until a start is detected. The effect of this operation is that the new address is loaded into the address
counter, but no data is output by the device.
The next Current Address Read operation will read
from the newly loaded address.
Sequential Read
Sequential reads can be initiated as either a current
address read or random read. The first Data Byte is
transmitted as with the other modes; however, the
master now responds with an acknowledge, indicating
it requires additional data. The device continues to output data for each acknowledge received. The master
terminates the read operation by not responding with
an acknowledge and then issuing a stop condition.
The data output is sequential, with the data from
address n followed by the data from address n + 1. The
address counter for read operations increments
through all byte addresses, allowing the entire memory
contents to be read during one operation. At the end of
the address space the counter “rolls over” to address
0000h, and the device continues to output data for
each acknowledge received. Refer to Figure 10 for the
acknowledge and data transfer sequence.
Figure 9. Random Read Sequence
Signals from
the Master
SDA Bus
S
T
A
R
T
Word Address
Byte 1
Slave
Address
S 1 0 1 0
S
T
A
R
T
Word Address
Byte 0
0
S
T
O
P
1
S
A
C
K
Signals from
the Slave
Slave
Address
A
C
K
A
C
K
P
A
C
K
Data
Figure 10. Sequential Read Sequence
Signals from
the Master
SDA Bus
Signals from
the Slave
Slave
Address
S
A
C
K
A
C
K
S
T
O
P
A
C
K
1
P
A
C
K
Data
(1)
Data
(2)
Data
(n–1)
Data
(n)
(n is any integer greater than 1)
REV 1.1 9/8/00
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Characteristics subject to change without notice.
7 of 16
X24128
WRITE PROTECT REGISTER (WPR)
Writing to the Write Protect Register
The Write Protect Register can only be modified by
performing a “Byte Write” operation directly to the
address FFFFh as described below.
The Data Byte must contain zeroes where indicated in
the procedural descriptions below; otherwise the operation will not be performed. Only one Data Byte is
allowed for each register write operation. The part will
not acknowledge any data bytes after the first byte is
entered. The user then has to issue a stop to initiate
the nonvolatile write cycle that writes BL0, BL1, and
WPEN to the nonvolatile bits. A stop must also be
issued after volatile register write operations to put the
device into Standby.
The state of the Write Protect Register can be read by
performing a random byte read at FFFFh at any time.
The part will reset itself after the first byte is read. The
master should supply a stop condition to be consistent
with the protocol, but a stop is not required to end this
operation. After the read, the address counter contains
0000h.
BL0, BL1: Block Lock Protect Bits (Nonvolatile)
The Block Lock Protect Bits, BL0 and BL1, determine
which blocks of the array are protected. A write to a
protected block of memory is ignored, but will receive
an acknowledge. The master must issue a stop to put
the part into standby, just as it would for a valid write;
but the stop will not initiate an internal nonvolatile write
cycle. See Table 1.
WPEN: Write Protect Enable Bit (Nonvolatile)
The Write Protect (WP) pin and the Write Protect
Enable (WPEN) bit in the Write Protect Register control
the Programmable Hardware Write Protection feature.
Hardware Write Protection is enabled when the WP pin
is HIGH and the WPEN bit is HIGH, and disabled when
either the WP pin is LOW or the WPEN bit is LOW. Figure 12 defines the write protect status for each combination of WPEN and WP. When the chip is Hardware
Write Protected, nonvolatile writes are disabled to the
Write Protect Register, including the Block Lock protect
bits and the WPEN bit itself, as well as to the Block
Lock protected sections in the memory array. Only the
sections of the memory array that are not Block Lock
protected, and the volatile bits WEL and RWEL, can be
written.
Write Protect Register: WPR (ADDR = FFFFh)
7
6
5
4
WPEN
0
0
BL1
3
2
1
BL0 RWEL WEL
0
0
WEL: Write Enable Latch (Volatile)
0 = Write Enable Latch reset, writes disabled.
1 = Write Enable Latch set, writes enabled.
RWEL: Register Write Enable Latch (Volatile)
0 = Register Write Enable Latch reset, writes to the
Write Protect Register disabled.
1 = Register Write Enable Latch set, writes to the Write
Protect Register enabled.
REV 1.1 9/8/00
In Circuit Programmable ROM Mode
Note that when the WPEN bit is write protected, it cannot be changed back to a LOW state; so write protection is enabled as long as the WP pin is held HIGH.
Thus an In Circuit Programmable ROM function can be
implemented by hardwiring the WP pin to VCC, writing
to and Block Locking the desired portion of the array to
be ROM, and then programming the WPEN bit HIGH.
Unused Bit Positions
Bits 0, 5 & 6 are not used. All writes to the WPR must
have zeros in these bit positions. The data byte output
during a WPR read will contain zeros in these bits.
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Characteristics subject to change without notice.
8 of 16
X24128
Table 1. Block Lock Protect Bits and Protected Addresses
BL1
BL0
Protected Addresses
Array Location
0
0
None
No Protect
0
1
3000h–3FFFh
Upper 1/4
1
0
2000h–3FFFh
Upper 1/2
1
1
0000h–3FFFh
Full Array
Table 2. WP Pin and WPEN Bit Functionality
WP
WPEN
Memory Array Not
Lock Block Protected
Memory Array Block
Lock Protected
Block Lock Bits
WPEN Bit
0
X
Unprotected
Protected
Unprotected
Unprotected
X
0
Unprotected
Protected
Unprotected
Unprotected
1
1
Unprotected
Protected
Protected
Protected
Writing to the WEL and RWEL bits
WEL and RWEL are volatile latches that power up in
the LOW (disabled) state. While the WEL bit is LOW,
writes to any address other than FFFFh will be ignored
(no acknowledge will be issued after the Data Byte).
The WEL bit is set by writing 00000010 to address
FFFFh. Once set, WEL remains HIGH until either it is
reset to 0 (by writing 00000000 to FFFFh) or until the part
powers up again. Writes to WEL and RWEL do not cause
a nonvolatile write cycle, so the device is ready for the
next operation immediately after the stop condition.
The RWEL bit controls writes to the Block Lock protect
bits, BL0 and BL1, and the WPEN bit. If RWEL is 0
then no writes can be performed on BL0, BL1, or
WPEN. RWEL is reset when the device powers up or
after any nonvolatile write, including writes to the Block
Lock protect bits, WPEN bit, or any bytes in the memory array. When RWEL is set, WEL cannot be reset,
nor can RWEL and WEL be reset in one write operation. RWEL can be reset by writing 00000010 to
FFFFh; but this is the same operation as in step 3
described below, and will result in programing BL0,
BL1, and WPEN.
Writing to the BL and WPEN Bits
A 3 step sequence is required to change the nonvolatile Block Lock protect or Write Protect Enable bits:
3) Set BL1, BL0, and/or WPEN bits, Write u00xy010 to
address FFFFh, where u = WPEN, x = BL1, and y =
BL0. (Nonvolatile Write Cycle.)
The three step sequence was created to make it difficult to change the contents of the Write Protect Register accidentally. If WEL was set to one by a previous
register write operation, the user may start at step 2.
RWEL is reset to zero in step 3 so that user is required
to perform steps 2 and 3 to make another change.
RWEL must be 0 in step 3. If the RWEL bit in the data
byte for step 3 is a one, then no changes are made to
the Write Protect Register and the device remains at
step 2.
The WP pin must be LOW or the WPEN bit must be
LOW before a nonvolatile register write operation is initiated. Otherwise, the write operation will abort and the
device will go into standby mode after the master
issues the stop condition in step 3.
Step 3 is a nonvolatile write operation, requiring tWC to
complete (acknowledge polling may be used to reduce
this time requirement). It should be noted that step 3
MUST end with a stop condition. If a start condition is
issued during or at the end of step 3 (instead of a stop
condition) the device will abort the nonvolatile register
write and remain at step 2. If the operation is aborted
with a start condition, the master must issue a stop to
put the device into standby mode.
1) Set WEL = 1, Write 00000010 to address FFFFh
(Volatile Write Cycle.)
2) Set RWEL = 1, Write 00000110 to address FFFFh
(Volatile Write Cycle.)
REV 1.1 9/8/00
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Characteristics subject to change without notice.
9 of 16
X24128
ABSOLUTE MAXIMUM RATINGS
COMMENT
Temperature under bias ....................–65°C to +135°C
Storage temperature .........................–65°C to +150°C
Voltage on any pin with respect to VSS ....... –1V to +7V
D.C. output current ............................................... 5mA
Lead temperature (soldering, 10 seconds).........300°C
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device (at these or any other conditions above those
indicated in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
RECOMMENDED OPERATING CONDITIONS
Temperature
Min.
Max.
Supply Voltage
Limits
Commercial
0°C
+70°C
X24128–2.5
2.5V to 5.5V
Industrial
–40°C
+85°C
D.C. OPERATING CHARACTERISTICS
Limits
Symbol
Parameter
ICC1
ICC2
Max.
Unit
VCC supply current (Read)
1
mA
VCC supply current (Write)
3
mA
ISB1(1)
VCC standby current
5
µA
SCL = SDA = VCC, All Other Inputs = VSS or
VCC – 0.3V, VCC = 5V ± 10%
ISB2(1)
VCC standby current
1
µA
SCL = SDA = VCC, All Other Inputs = VSS or
VCC – 0.3V, VCC = 2.5V
ILI
Input leakage current
10
µA
VIN = VSS to VCC
ILO
Output leakage current
10
µA
VOUT = VSS to VCC
(2)
Min.
VlL
Input LOW voltage
–0.5
VCC x 0.3
V
VIH(2)
Input HIGH voltage
VCC x 0.7
VCC + 0.5
V
VOL
Output LOW voltage
0.4
V
(3)
Vhys
Hysteresis of Schmitt
trigger inputs
VCC x 0.05
Test Conditions
SCL = VCC X 0.1/VCC X 0.9 Levels @
400kHz, SDA = Open, All Other Inputs
= VSS or VCC – 0.3V
IOL = 3mA
V
CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V
Symbol
(3)
(3)
CI/O
CIN
Parameter
Max.
Unit
Test Conditions
Input/output capacitance (SDA)
8
pF
VI/O = 0V
Input capacitance (S0, S1, S2, SCL, WP)
6
pF
VIN = 0V
Notes: (1) Must perform a stop command prior to measurement.
(2) VIL min. and VIH max. are for reference only and are not 100% tested.
(3) This parameter is periodically sampled and not 100% tested.
REV 1.1 9/8/00
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Characteristics subject to change without notice.
10 of 16
X24128
A.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified.)
Read & Write Cycle Limits
Symbol
Min.
Max.
Unit
SCL clock frequency
0
400
kHz
Noise suppression time constant at SCL, SDA inputs
50
tAA
SCL LOW to SDA Data out valid
0.1
tBUF
Time the bus must be free before a new transmission can start
1.2
µs
Start condition hold time
0.6
µs
tLOW
Clock LOW period
1.2
µs
tHIGH
Clock HIGH period
0.6
µs
tSU:STA
Start condition setup time (for a repeated start condition)
0.6
µs
tHD:DAT
Data In hold time
0
µs
tSU:DAT
Data In setup time
100
ns
fSCL
tI
tHD:STA
ns
0.9
µs
tR
SDA and SCL rise time
300
ns
tF
SDA and SCL fall time
300
ns
tSU:STO
tDH
tOF
Note:
Parameter
Stop Condition setup time
0.6
Data out hold time
50
µs
(4)
Output fall time
20+0.1Cb
300
ns
250
µs
(4) Cb = Total capacitance of one bus line in pF
POWER-UP TIMING(5)
Symbol
Parameter
Max.
Unit
tPUR
Power-up to read operation
1
ms
tPUW
Power-up to write operation
5
ms
Notes: (5) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated. These parameters
are periodically sampled and not 100% tested.
(6) Typical values are for TA = 25°C and nominal supply voltage (5V).
A.C. CONDITIONS OF TEST
EQUIVALENT A.C. LOAD CIRCUIT
Input pulse levels
VCC x 0.1 to VCC x 0.9
Input rise and fall times
10ns
Input and output timing levels
VCC X 0.5
5V
1.53KΩ
Output
100pF
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Characteristics subject to change without notice.
11 of 16
X24128
Bus Timing
tF
tHIGH
tLOW
tHD:STA
tHD:DAT
tR
SCL
tSU:STA
tSU:DAT
tSU:STO
SDA IN
tDH
tAA
tBUF
SDA OUT
Write Cycle Limits
Symbol
(8)
TWC
Parameter
Min.
Write Cycle Time
Typ.(7)
Max.
Unit
5
10
ms
Notes: (7) Typical values are for TA = 25°C and nominal supply voltage (5V).
(8) tWR is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum
time the device requires to automatically complete the internal write operation.
The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal erase/write
cycle. During the write cycle, the X24128 bus interface circuits are disabled, SDA is allowed to remain HIGH, and
the device does not respond to its slave address.
Bus Timing
SCL
SDA
8th Bit
ACK
Word n
tWR
STOP
Condition
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START
Condition
Characteristics subject to change without notice.
12 of 16
X24128
Guidelines for Calculating Typical Values of Bus
Pull-Up Resistors
SYMBOL TABLE
WAVEFORM
120
V
RMin. = CC Max. =1.8KΩ
IOL Min.
Resistance (KΩ)
100
tR
CBUS
80
RMAX.=
60
Max.
Resistance
40
20
Min.
Resistance
0
0
20
40
60
80 100 120
Bus Capacitance (pF)
REV 1.1 9/8/00
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INPUTS
OUTPUTS
Must be
steady
Will be
steady
May change
from Low to
High
Will change
from Low to
High
May change
from High to
Low
Will change
from High to
Low
Don’t Care:
Changes
Allowed
N/A
Changing:
State Not
Known
Center Line
is High
Impedance
Characteristics subject to change without notice.
13 of 16
X24128
PACKAGING INFORMATION
8-Lead XBGA
8-Lead XBGA
Complete Part Number
Top Mark
X24128Z-2.5
X24128ZI-2.5
XAAB
XAAE
8-Lead XBGA: Top View
.084”
VCC
2
7
SO
SDA
3
6
VSS
SCL
4
5
S2
.259”
WP
S1
Pin 1
1000 ± 30
S0
VCC
VSS
SDA
S2
SCL
6588 ± 30
S1
6588 ± 30
8
350 ± 20
1
500 ± 20
WP
215 ± 30
X24128: Bottom View
1200 ± 30
430 ± 50
2143 ± 30
2029 ± 30
215 ± 30
350 ± 20
NOTES: ALL DIMENSIONS IN µM (to convert to inches, 1µm = 3.94 x 10-5 inch)
ALL DIMENSIONS ARE TYPICAL VALUES
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Characteristics subject to change without notice.
14 of 16
X24128
PACKAGING INFORMATION
14-Lead Plastic Small Outline Gullwing Package Type S
0.150 (3.80) 0.228 (5.80)
0.158 (4.00) 0.244 (6.20)
Pin 1 Index
Pin 1
0.014 (0.35)
0.020 (0.51)
0.336 (8.55)
0.345 (8.75)
(4X) 7°
0.053 (1.35)
0.069 (1.75)
0.004 (0.10)
0.010 (0.25)
0.050 (1.27)
0.050"Typical
0.010 (0.25)
0.020 (0.50)
X 45°
0.050"Typical
0° – 8°
0.0075 (0.19)
0.010 (0.25)
0.250"
0.016 (0.410)
0.037 (0.937)
0.030"Typical
14 Places
FOOTPRINT
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
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Characteristics subject to change without notice.
15 of 16
X24128
Ordering Information
X24128
X
X
-X
VCC Range
2.5 = 2.5V to 5.5V
Device
Temperature Range
Blank = 0°C to +70°C
I = –40°C to +85°C
Package
X24128
Z = 8-Lead XBGA
S14 = 14-Lead SOIC
Part Mark Convention
8-Lead XBGA Package
8 and 14-Lead PDIP/SOIC
Complete Part Number Top Mark
X24128
X24128Z - 2.5
XAAE
XAAB
X24128ZI - 2.5
X
S14 = 14-Lead SOIC
X
AE = 2.5V to 5.5V, 0 to +70°C
AF = 2.5V to 5.5V, –40 to +85°C
LIMITED WARRANTY
©Xicor, Inc. 2000 Patents Pending
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices
at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, or licenses are implied.
TRADEMARK DISCLAIMER:
Xicor and the Xicor logo are registered trademarks of Xicor, Inc. AutoStore, Direct Write, Block Lock, SerialFlash, MPS, and XDCP are also trademarks of Xicor, Inc. All
others belong to their respective owners.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846;
4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084,667; 5,153,880; 5,153,691;
5,161,137; 5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection
and correction, redundancy and back-up features to prevent such an occurrence.
Xicor’s products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
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Characteristics subject to change without notice.
16 of 16