DATA SHEET GaAs INTEGRATED CIRCUIT µPG187GR GaAs MMIC DBS TWIN-SPDT FOR 2 x 2 SWITCH MATRIX DESCRIPTION The µPG187GR is intended for use in Direct Broadcast Satellite (DBS) applications within the Low Noise Block (LNB) down-converter for systems where at least multi LNB are required. FEATURES • High isolation : ISL = 42 dB TYP. (D/U-ratio) • Control voltage : Vcont = 0 V/+5 V • Insertion loss : LINS = 1.8 dB TYP. (ZO = 50 Ω) • 16-pin plastic HTSSOP package ORDERING INFORMATION Part Number Package µPG187GR-E1 16-pin plastic HTSSOP Supplying Form • Embossed tape 12 mm wide • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG187GR Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10172EJ01V0DS (1st edition) Date Published July 2002 CP(K) Printed in Japan NEC Compound Semiconductor Devices 2001, 2002 µPG187GR PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name Pin No. Pin Name 1 IN-B1 9 OUT2 2 GND 10 GND 3 GND 11 Vcont4 4 IN-A1 12 Vcont3 Top View 1 16 2 15 3 14 4 13 5 12 5 IN-A2 13 Vcont2 6 11 6 GND 14 Vcont1 7 10 7 GND 15 GND 8 9 8 IN-B2 16 OUT1 Remark Backside : GND TRUTH TABLE ON CHANNEL CONTROL PIN OUT1 OUT2 Vcont1 Vcont2 Vcont3 Vcont4 IN-A1 IN-B2 Low High Low High IN-B1 IN-B2 High Low Low High IN-A1 IN-A2 Low High High Low IN-B1 IN-A2 High Low High Low ABSOLUTE MAXIMUM RATINGS (TA = +25°°C, unless otherwise specified) Parameter Control Voltage Symbol Ratings Unit Vcont −1.0 to +6.0 V Note Total Power Dissipation Ptot 2 Input Power Pin +10 dBm Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −65 to +150 °C W Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RENGE (TA = +25°°C) Parameter Symbol MIN. TYP. MAX. Unit Control Voltage (High) Vcont(H) +4.5 +5.0 +5.5 V Control Voltage (Low) Vcont(L) −0.5 0 +0.5 V 2 Data Sheet PG10172EJ01V0DS µPG187GR ELECTRICAL CHARACTERISTICS (TA = +25°°C, Vcont = 0 V/+5 V, Pin = 0 dBm, ZO = 50 Ω, Each Port, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit LINS f = 0.95 to 2.15 GHz − 1.8 3.0 dB Insertion Loss Flatness 1 ∆LINS1 f = 0.95 to 1.5 GHz − 0.4 1.2 dB Insertion Loss Flatness 2 Insertion Loss ∆LINS2 f = 1.5 to 2.15 GHz − 0.5 1.5 dB Isolation D/U-ratio 1 Note1 ISL1 f = 0.95 to 1.5 GHz 42 44 − dB Isolation D/U-ratio 2 Note1 ISL2 f = 1.5 to 2.15 GHz 40 42 − dB RLOUT f = 0.95 to 2.15 GHz 10 15 − dB Vcont = +5 V/0 V, RF OFF − − 200 µA Output Return Loss Control Current Note2 Icont Notes 1. ‘Isolation D/U-ratio’ = ‘signal leakage (off-state)’ − ‘insertion loss (on-state)’ 2. per 1 control pin Data Sheet PG10172EJ01V0DS 3 µPG187GR TYPICAL CHARACTERISTICS (TA = +25°°C, Vcont = 0 V/+5 V, Pin = 0 dBm, ZO = 50 Ω, Each Port) SIGNAL LEAKAGE vs. FREQUENCY INSERTION LOSS vs. FREQUENCY 0 0 –2 –20 2 3 –4 –6 1: 0.95 GHz –1.54 dB 2: 1.5 GHz –1.74 dB 3: 2.15 GHz –1.83 dB –8 –10 0 0.5 1.0 1.5 2.0 2.5 Signal Leakage (dB) Insertion Loss LINS (dB) 1 –40 1 3 2 –60 1: 0.95 GHz –52.5 dB 2: 1.5 GHz –50.3 dB 3: 2.15 GHz –44.2 dB –80 –100 0 3.0 0.5 INPUT RETURN LOSS (ON ROUTE) vs. FREQUENCY 2.5 3.0 0 –10 1 –20 3 2 –30 1: 0.95 GHz –17.6 dB 2: 1.5 GHz –15.7 dB 3: 2.15 GHz –15.5 dB –40 –50 0 0.5 1.0 1.5 2.0 2.5 Output Return Loss RLOUT (dB) Input Return Loss RLIN (dB) 2.0 OUTPUT RETURN LOSS (ON ROUTE) vs. FREQUENCY 0 –10 1 –20 2 3 –30 1: 0.95 GHz –17.8 dB 2: 1.5 GHz –17.2 dB 3: 2.15 GHz –18.9 dB –40 –50 0 3.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Frequency f (GHz) INPUT RETURN LOSS (OFF ROUTE) vs. FREQUENCY OUTPUT RETURN LOSS (OFF ROUTE) vs. FREQUENCY 0 –10 2 3 –20 –30 1: 0.95 GHz –9.17 dB 2: 1.5 GHz –10.6 dB 3: 2.15 GHz –12.9 dB –40 –50 0 0.5 1.0 1.5 2.0 2.5 3.0 Output Return Loss RLOUT (dB) 0 1 Input Return Loss RLIN (dB) 1.5 Frequency f (GHz) Frequency f (GHz) –10 1 –20 2 3 –30 1: 0.95 GHz –17.2 dB 2: 1.5 GHz –17.3 dB 3: 2.15 GHz –18.9 dB –40 –50 0 Frequency f (GHz) 0.5 1.0 1.5 2.0 Frequency f (GHz) Remark The graphs indicate nominal characteristics. 4 1.0 Data Sheet PG10172EJ01V0DS 2.5 3.0 µPG187GR PACKAGE DIMENSIONS 16-PIN PLASTIC HTSSOP (UNIT: mm) (0.4) 8 16 1 (2.7) 5.5±0.3 9 0.20±0.10 0.65±0.1 (1.8) (0.5) 0.20±0.10 6.4±0.3 (0.1) 5.2±0.2 0.9±0.2 (2.5) (1.5) Remark ( ): Reference value Data Sheet PG10172EJ01V0DS 5 µPG187GR CIRCUIT DIAGRAM AS 2 × 2 SWITCH MATRIX (REFERENCE ONLY) 1 16 C OUT1 R C GND GND GND Vcont1 R Vcont2 IN-A Vcont3 R R C R R GND Vcont4 GND GND OUT2 IN-B 8 9 Backside : GND Remark C : 56 pF, R : 20 Ω 6 C Data Sheet PG10172EJ01V0DS µPG187GR RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Soldering Conditions Condition Symbol Infrared Reflow Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below IR260 VPS Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below VP215 Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below WS260 Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10172EJ01V0DS 7 µPG187GR • The information in this document is current as of July, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. 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"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 8 Data Sheet PG10172EJ01V0DS µPG187GR SAFETY INFORMATION ON THIS PRODUCT Caution GaAs Products The product contains gallium arsenide, GaAs. GaAs vapor and powder are hazardous to human health if inhaled or ingested. • Do not destroy or burn the product. • Do not cut or cleave off any part of the product. • Do not crush or chemically dissolve the product. • Do not put the product in the mouth. Follow related laws and ordinances for disposal. The product should be excluded from general industrial waste or household garbage. 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